TY - RPRT A1 - Kim, K. J. A1 - Yu, H. A1 - Lee, S. M. A1 - Kwon, J. H. A1 - Ruh, H. A1 - Radnik, Jörg A1 - Archanjo, B. S. A1 - Annese, E. A1 - Damasceno, J. C. A1 - Achete, C. A. A1 - Yao, Y. A1 - Ren, L. A1 - Gao, H. A1 - Windover, D. A1 - Matsuzaki, H. A1 - Azuma, Y. A1 - Zhang, L. A1 - Fujimoto, T. A1 - Jordaan, W. A. A1 - Reed, B. A1 - Shard, A. G. A1 - Cibik, L. A1 - Gollwitzer, C. A1 - Krumrey, M. T1 - Final report of CCQM-K157 for the measurement of the amount of substance of HfO2 expressed as the thickness of nm films N2 - The key comparison CCQM-K157 for the thickness measurement of HfO2 films was performed by the Surface Analysis Working Group (SAWG) of the Consultative Committee for Amount of Substance (CCQM). The aim of CCQM-K157 is to establish the measurement traceability and to ensure the equivalency in the measurement capability of national metrology institutes for the thickness measurement of HfO2 films. In this key comparison, the thicknesses of six HfO2 films with the nominal thickness range from 0.7 nm to 6 nm were compared by x-ray photoelectron spectroscopy (XPS), x-ray reflectometry (XRR), transmission electron microscopy (TEM), spectroscopic ellipsometry (SE) and medium energy ion scattering spectrometry (MEIS). To reach the main text of this paper, click on Final Report. Note that this text is that which appears in Appendix B of the BIPM key comparison database https://www.bipm.org/kcdb/. The final report has been peer-reviewed and approved for publication by the CCQM, according to the provisions of the CIPM Mutual Recognition Arrangement (CIPM MRA). KW - CCQM KW - Thin Films KW - HfO2 KW - thickness KW - XPS PY - 2023 DO - https://doi.org/10.1088/0026-1394/60/1A/08010 VL - 60 SP - 08010 PB - IOP AN - OPUS4-63049 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -