TY - JOUR A1 - Stark, Wolfgang A1 - Goering, Harald A1 - Michel, U. A1 - Bayerl, H. T1 - Online monitoring of thermoset post-curing by dynamic mechanical thermal analysis DMTA N2 - Thermosetting moulding compounds are synthetic materials which can be easily formed in the molten state and achieve high temperature stability due to a cross-linking process which takes place during manufacture. To ensure thermal and mechanical properties, post-curing of moulded phenolic resin components is necessary for high quality applications. In the industrial practice, post-curing time-temperature-programs are heuristically acquired. In this paper, dynamical mechanical thermal analysis is employed to determine optimal post-curing conditions for injection moulded parts from phenolic resin. KW - DMTA KW - Moulding compound KW - Thermoset KW - Phenolic resin KW - Post-curing PY - 2009 U6 - https://doi.org/10.1016/j.polymertesting.2009.02.005 SN - 0142-9418 VL - 28 IS - 6 SP - 561 EP - 566 PB - Elsevier Science CY - Amsterdam [u.a.] AN - OPUS4-19822 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -