TY - CONF A1 - Stark, Wolfgang T1 - Characterizing the flow-cure behaviour of thermoset plastics using thermoanalytical and ultrasonic methods N2 - The prospects of modern thermoanalytical methods for characterisation of flow, curing and final mechanical behaviour of moulding compounds were demonstrated. Using urea resin moulding compounds from different manufacturers the possibilities of the various techniques could be shown. With comparatively low effort, fundamental information can be gained before production process had been started. On this basis it is possible to make appropriate material selection at an early point in the process chain. On the basis of thermoanalytical data an incoming goods inspection can be established. Also it is easy to control the compliance with the conditions of delivery. In some cases it could also be helpful to have stored analysis data especially when problems appear in manufacturing process or unexpected part damages occur With the ultrasound measuring system it is possible to transfer the findings from the analytical methods directly to the processes in the mould. The application of ultrasound provides Dynamic Mechanical Analysis in the mould. Beside quality assurance ultrasound can also be used for process optimisation, especially for reduction of cycle time. In an advanced form ultrasound information can be used as a basis for improved machine control based on material state. The ultrasound measuring system developed by ISK Iserlohn and BAM can be obtained from the ISK. T2 - 5. Internationale Duroplasttagung / International Thermoset Conference CY - Iserlohn, Germany DA - 2008-11-20 KW - Differential Scanning Calorimetry KW - Dynamic Mechanical Analysis KW - Ultrasound KW - Urea rsin KW - Moulding compound KW - Incoming goods inspection KW - Process optimization PY - 2008 IS - Duro08_GB_08 SP - 1 EP - 8 AN - OPUS4-18586 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Stark, Wolfgang T1 - Investigation of curing behaviour of melamine/phenolic (MP) thermosets N2 - Commercially available melamine/phenolic (MP) moulding compounds used for manufacturing electro installation parts were investigated by laboratory thermal analysis methods: Dynamic Mechanical Analysis (DMA), Differential Scanning Calorimetry (DSC) and Dielectric Analysis (DEA). The results were compared with on-line measurements in a compression mould using incorporated dielectric and ultrasound sensors. Softening and cross-linking behaviour were analyzed. For on-line process monitoring, only the ultrasound method worked well. The dielectric method was distorted by water formed as a by-product from the poly-condensation reaction. KW - Thermoset KW - Melamine KW - Phenol KW - Moulding compound KW - Cross-linking KW - DSC PY - 2010 U6 - https://doi.org/10.1016/j.polymertesting.2010.05.008 SN - 0142-9418 VL - 29 IS - 6 SP - 723 EP - 728 PB - Elsevier Science CY - Amsterdam [u.a.] AN - OPUS4-20982 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Stark, Wolfgang A1 - Goering, Harald A1 - Michel, U. A1 - Bayerl, H. T1 - Online monitoring of thermoset post-curing by dynamic mechanical thermal analysis DMTA N2 - Thermosetting moulding compounds are synthetic materials which can be easily formed in the molten state and achieve high temperature stability due to a cross-linking process which takes place during manufacture. To ensure thermal and mechanical properties, post-curing of moulded phenolic resin components is necessary for high quality applications. In the industrial practice, post-curing time-temperature-programs are heuristically acquired. In this paper, dynamical mechanical thermal analysis is employed to determine optimal post-curing conditions for injection moulded parts from phenolic resin. KW - DMTA KW - Moulding compound KW - Thermoset KW - Phenolic resin KW - Post-curing PY - 2009 U6 - https://doi.org/10.1016/j.polymertesting.2009.02.005 SN - 0142-9418 VL - 28 IS - 6 SP - 561 EP - 566 PB - Elsevier Science CY - Amsterdam [u.a.] AN - OPUS4-19822 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -