TY - JOUR A1 - Stark, Wolfgang T1 - Investigation of curing behaviour of melamine/phenolic (MP) thermosets N2 - Commercially available melamine/phenolic (MP) moulding compounds used for manufacturing electro installation parts were investigated by laboratory thermal analysis methods: Dynamic Mechanical Analysis (DMA), Differential Scanning Calorimetry (DSC) and Dielectric Analysis (DEA). The results were compared with on-line measurements in a compression mould using incorporated dielectric and ultrasound sensors. Softening and cross-linking behaviour were analyzed. For on-line process monitoring, only the ultrasound method worked well. The dielectric method was distorted by water formed as a by-product from the poly-condensation reaction. KW - Thermoset KW - Melamine KW - Phenol KW - Moulding compound KW - Cross-linking KW - DSC PY - 2010 U6 - https://doi.org/10.1016/j.polymertesting.2010.05.008 SN - 0142-9418 VL - 29 IS - 6 SP - 723 EP - 728 PB - Elsevier Science CY - Amsterdam [u.a.] AN - OPUS4-20982 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -