TY - JOUR
A1 - Eberle, Arno
A1 - Sievert, Rainer
A1 - Schiller, Wolfgang Arno
T1 - Flip-Chip-Lotbumps thermisch-zyklisch belastet - Einfluß des Substratmaterials auf das viskoplastische Verhalten von Flip-Chip-Lotbumps
PY - 1998
SN - 0025-5300
VL - 40
IS - 9
SP - 350
EP - 352
PB - Carl Hanser Verlag
CY - München
AN - OPUS4-33715
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
A1 - Schiller, Wolfgang Arno
T1 - Numerical investigation on the influence of different substrate materials on the viscoplastic behaviour of flip chip solder bumps
N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a flip chip under thermocyclic loading between -55°C (-67°F) and 125°C (257°F). In order to simulate realistically the inelastic material response of the solder bump, Chaboche's viscoplastic material model instead of a classical ORNL-theory was implemented into the finite element code ABAQUS and applied to a flip chip configuration. This so-called unified constitutive model is able to describe the Bauschinger effect as well as the creep/plasticity interaction. Herewith the influence of the substrate material on the inelastic deformation behaviour of a tin-lead solder bump was analysed. A comparison is given with respect to the influence of the two substrate materials namely Al2O3 and our self-developed Low Temperature Co-fired Ceramics (LTCC) on the inelastic response of the Sn60Pb40 eutectic solder material. It may be shown that the thermoelastic behaviour of the LTCC substrate significantly reduces the cyclic stresses in the bump compared to Al2O3 as well as the cumulative inelastic strain which is responsible for the development of damage and hence flip chip failure
T2 - International symposium on advanced packaging materials 2000
CY - Braselton, Georgia, USA
DA - 06.03.2000
PY - 2000
SN - 0-930815-59-9
DO - https://doi.org/10.1109/ISAPM.2000.869253
SP - 112
EP - 117
AN - OPUS4-33716
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - JOUR
A1 - Eberstein, Markus
A1 - Glitzky, Carsten
A1 - Gemeinert, Marion
A1 - Rabe, Torsten
A1 - Schiller, Wolfgang Arno
A1 - Modes, C.
T1 - Design of LTCC with high thermal expansion
N2 - New applications of low-temperature co-fired ceramics (LTCC), such as pressure sensors or integrated functional layers, require materials that possess higher coefficients of thermal expansion (CTE). To fabricate LTCC with elevated CTE, two methods of material design are examined: firstly, glass ceramic composites (GCC), which consist of >50 vol% glass in the starting powder, and, secondly, glass-bonded ceramics (GBC), where glass is added as a sintering aid only. The CTE of GBC is mainly determined by the crystalline component. For GCC, the CTE can be well predicted, if CTE and elastic data of each phase in the microstructure are known. A nonlinear characteristic of the CTE versus phase composition was found with increasing Ecrystals/Eglass ratio and absolute CTE difference between the components. The glass composition and glass amount can be used to compensate the fixed properties of a crystalline material in a desired way. However, because the CTE and permittivity of a glass cannot be chosen independently, an optimum glass composition has to be found. For a given LTCC, it is possible to control the devitrification by shifting the glass composition. In this way, the resulting CTE values can be predicted more exactly and tailoring becomes possible. Different LTCC materials, based on the crystalline compounds Ba(La,Nd)2Ti4O12, ZrO2 (Y-TZP), SiO2 (quartz), and specially developed glasses, possessing an elevated CTE of around 10 × 10-6 K-1 while showing permittivity εr between 6 and 63, are introduced.
KW - LTCC
KW - Glass ceramic composites
KW - Coefficient of thermal expansion CTE
KW - Design
PY - 2009
DO - https://doi.org/10.1111/j.1744-7402.2008.02316.x
SN - 1546-542X
SN - 1744-7402
VL - 6
IS - 1
SP - 1
EP - 8
PB - American Ceramic Soc.
CY - Westerville, Ohio
AN - OPUS4-18675
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberstein, Markus
A1 - Glitzky, Carsten
A1 - Gemeinert, Marion
A1 - Rabe, Torsten
A1 - Schiller, Wolfgang Arno
A1 - Modes, C.
T1 - Design of LTCC with high thermal expansion
T2 - IMAPS/ACERS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2008)
CY - Munich, Germany
DA - 2008-04-21
KW - LTCC
KW - Glass ceramic composites
KW - Coefficient of thermal expansion CTE
KW - Design
PY - 2008
SP - 000120
EP - 000126
PB - IMAPS, International Microelectronics and Packaging Society
CY - Washington, DC
AN - OPUS4-17436
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - JOUR
A1 - Glitzky, Carsten
A1 - Rabe, Torsten
A1 - Eberstein, Markus
A1 - Schiller, Wolfgang Arno
A1 - Töpfer, J.
A1 - Barth, S.
A1 - Kipka, A.
T1 - LTCC-Modules with integrated ferrite layers - Strategies for material development and co-sintering
N2 - The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties.
KW - Coefficient of thermal expansion (CTE)
KW - Cofiring
KW - Ferrite
KW - LTCC
KW - Shrinkage
PY - 2009
SN - 1551-4897
VL - 6
IS - 1
SP - 49
EP - 53
CY - Washington, DC
AN - OPUS4-19708
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Glitzky, Carsten
A1 - Rabe, Torsten
A1 - Eberstein, Markus
A1 - Schiller, Wolfgang Arno
A1 - Töpfer, J.
A1 - Barth, S.
A1 - Kipka, A.
T1 - LTCC-modules with integrated ferrite layers - Strategies for material development and co-sintering
T2 - 2009 IMAPS/ACerS - 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)
CY - Denver, Colorado, USA
DA - 2009-04-21
KW - LTCC
KW - Ferrite
KW - Co-firing
KW - Shrinkage
KW - Coefficient of thermal expansion (CTE)
PY - 2008
SN - 0-930815-83-1
SP - 000058
EP - 000063
AN - OPUS4-18926
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - JOUR
A1 - Eberstein, Markus
A1 - Schiller, Wolfgang Arno
T1 - Neue niedrig sinternde Mikrowellenkeramik für Anwendungen in der mobilen Kommunikationstechnik
PY - 2003
UR - http://www.keramische-zeitschrift.de/images/Keram_2003.pdf
SN - 0023-0561
VL - 55
IS - 5
SP - 344
EP - 348
PB - DVS-Verl.
CY - Düsseldorf
AN - OPUS4-2754
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - JOUR
A1 - Schiller, Wolfgang Arno
A1 - Eberstein, Markus
A1 - Müller, Ralf
T1 - Glas-Keramik-Komposite für Mikrosysteme und Sensoren
PY - 2002
SN - 1618-8721
VL - 1
IS - 2
SP - 17
PB - Deutsche Glastechnische Gesellschaft
CY - Offenbach
AN - OPUS4-3115
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - JOUR
A1 - Rabe, Torsten
A1 - Gemeinert, Marion
A1 - Schiller, Wolfgang Arno
T1 - Development of Advanced Low Temperature Co-fired Ceramics (LTCC)
KW - LTCC
KW - Zero shrinkage sintering
KW - Multilayer
KW - Material development
PY - 2004
SN - 1013-9826
VL - 264-268
SP - 1181
EP - 1184
PB - Trans Tech Publ.
CY - Aedermannsdorf
AN - OPUS4-5843
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - Dünnfilmkompatible LTCC als Basis multifunktioneller Mehrlagengehäuse für Mikrosysteme
T2 - Abschlusskolloquium zum BMBF-Projekt: Technologien für vertikale Mikrosystemaufbauten - Optobasis (16SV824/4)
CY - Berlin, Germany
DA - 2002-03-05
PY - 2002
AN - OPUS4-6298
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - Advanced LTCC Technologie: Neue werkstofftechnische konzepte für Kommunikations- und Sensoranwendungen
T2 - DKG-Tagung "Technische Keramik in Funktion"
CY - Hermsdorf (Thuringia), Germany
DA - 2002-09-19
PY - 2002
AN - OPUS4-6300
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - Werkstofftechnik der Hochleistungskeramik und Werbundwerkstoffe
T2 - Materialica 2003
CY - Munich, Germany
DA - 2003-09-15
PY - 2003
AN - OPUS4-4748
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - JOUR
A1 - Weh, Lothar
A1 - Venthur, Astrid
A1 - Schiller, Wolfgang Arno
T1 - Defekte und Oberflächenstrukturen in keramischen Folien auf Polyvinylbutyral-Basis
N2 - Defekte und störende Oberflächenstrukturen keramischer Bauelemente, die aus keramischen Folien gefertigt werden, haben neben keramtechnologischen Prozessfehlern vielfach ihre Ursachen in dynamischen Prozessen bei der Trocknung der Nassschichten. Neben Einzeldefekten wie Poren oder Rissen können in Grünfolien während der Trocknung auch oberflächenspannungsinduzierte periodische Schichtdickenunterschiede auftreten. Grenzflächenendynamische Bewegungen wie auch die Bildung von Blasen oder Agglomeraten treten gleichermaßen in gegossenen keramischen Schichten und in keramikfreien Polyvinylbutyral/Weichmacher-Schichten auf. Das analoge Verhalten der untersuchten gegossenen keramischen Schichten und der entsprechenden keramikfreien Polymerschichten bezüglich der Entstehung dieser Oberflächenfehler sowie Möglichkeiten zur Fehlerreduzierung werden aufgezeigt.
KW - Keramische Folien
KW - Oberflächentopologie
KW - Defekte
KW - Marangoni-Instabilität
KW - Schlicker
KW - Oberfläche
KW - Gefüge
KW - Grenzflächenprozesse
PY - 2004
UR - http://www.keramische-zeitschrift.de/index.cfm?objekt=Keram&jahr=2004&ausgabe=9&rubrik=Aus%20Forschung%20und%20Technik&lang=DE&artikel_id=202007&navi=2
SN - 0023-0561
VL - 9-10
SP - 562
EP - 572
PB - DVS-Verl.
CY - Düsseldorf
AN - OPUS4-4755
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - Neue werkstofftechnische Konzepte in der LTCC technologie
T2 - 10. BAM Keramiktag / Symposium "Folie- und multilayertechnologie für funktionskeramische Anwendungen"
CY - Berlin, Germany
DA - 2003-04-10
PY - 2003
AN - OPUS4-5350
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - LTCC-Keramik im Automobil
T2 - MicroCar 2003 - Mikrowerkstoffe, Nanowerkstoffe für den Automobilbau
CY - Leipzig, Germany
DA - 2003-06-26
PY - 2003
AN - OPUS4-5351
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - Neue Zero Shrinkage LTCC für Mikrosysteme hoher Präzision
T2 - DKG/BAM-Symposium "Glasig-kristalline Funktionswerkstoffe - Vielfalt und Präzision" (12. Keramiktag der BAM)
CY - Berlin, Germany
DA - 2005-05-12
PY - 2005
AN - OPUS4-7810
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - Zur Funktion der Gläser in der LTCC-Technologie
T2 - DGG-Glasforum 2005, Schott AG
CY - Mainz, Germany
DA - 2005-10-18
PY - 2005
AN - OPUS4-11739
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - Hochleistungskeramik und Multilayer-Folien-Technik für Mikrosysteme
T2 - Leibnitz-Sozietät, Klasse "Naturwissenschaften"
CY - Berlin, Germany
DA - 2005-12-08
PY - 2005
AN - OPUS4-11740
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Schiller, Wolfgang Arno
T1 - Zero Shrinkage LTCC für Mikrosensoren
T2 - DKG Jahrestagung 2006
CY - Stuttgart, Germany
DA - 2006-04-03
PY - 2006
AN - OPUS4-12424
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberstein, Markus
A1 - Rabe, Torsten
A1 - Schiller, Wolfgang Arno
T1 - Liquid Phases in LTCC - Key to Tailored Materials
T2 - MAPS/ACerS 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2006)
CY - Denver, CO, USA
DA - 2006-04-24
KW - LTCC
KW - Ceramic composites
KW - Liquid phase sintering
KW - Viscosity
KW - Dielectric properties
KW - Crystallization
PY - 2006
SP - 1(?)
EP - 8(?)
PB - American Ceramic Society
CY - Denver
AN - OPUS4-14043
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -