TY - JOUR A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schiller, Wolfgang Arno T1 - Flip-Chip-Lotbumps thermisch-zyklisch belastet - Einfluß des Substratmaterials auf das viskoplastische Verhalten von Flip-Chip-Lotbumps PY - 1998 SN - 0025-5300 VL - 40 IS - 9 SP - 350 EP - 352 PB - Carl Hanser Verlag CY - München AN - OPUS4-33715 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schiller, Wolfgang Arno T1 - Numerical investigation on the influence of different substrate materials on the viscoplastic behaviour of flip chip solder bumps N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a flip chip under thermocyclic loading between -55°C (-67°F) and 125°C (257°F). In order to simulate realistically the inelastic material response of the solder bump, Chaboche's viscoplastic material model instead of a classical ORNL-theory was implemented into the finite element code ABAQUS and applied to a flip chip configuration. This so-called unified constitutive model is able to describe the Bauschinger effect as well as the creep/plasticity interaction. Herewith the influence of the substrate material on the inelastic deformation behaviour of a tin-lead solder bump was analysed. A comparison is given with respect to the influence of the two substrate materials namely Al2O3 and our self-developed Low Temperature Co-fired Ceramics (LTCC) on the inelastic response of the Sn60Pb40 eutectic solder material. It may be shown that the thermoelastic behaviour of the LTCC substrate significantly reduces the cyclic stresses in the bump compared to Al2O3 as well as the cumulative inelastic strain which is responsible for the development of damage and hence flip chip failure T2 - International symposium on advanced packaging materials 2000 CY - Braselton, Georgia, USA DA - 06.03.2000 PY - 2000 SN - 0-930815-59-9 DO - https://doi.org/10.1109/ISAPM.2000.869253 SP - 112 EP - 117 AN - OPUS4-33716 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Eberstein, Markus A1 - Glitzky, Carsten A1 - Gemeinert, Marion A1 - Rabe, Torsten A1 - Schiller, Wolfgang Arno A1 - Modes, C. T1 - Design of LTCC with high thermal expansion N2 - New applications of low-temperature co-fired ceramics (LTCC), such as pressure sensors or integrated functional layers, require materials that possess higher coefficients of thermal expansion (CTE). To fabricate LTCC with elevated CTE, two methods of material design are examined: firstly, glass ceramic composites (GCC), which consist of >50 vol% glass in the starting powder, and, secondly, glass-bonded ceramics (GBC), where glass is added as a sintering aid only. The CTE of GBC is mainly determined by the crystalline component. For GCC, the CTE can be well predicted, if CTE and elastic data of each phase in the microstructure are known. A nonlinear characteristic of the CTE versus phase composition was found with increasing Ecrystals/Eglass ratio and absolute CTE difference between the components. The glass composition and glass amount can be used to compensate the fixed properties of a crystalline material in a desired way. However, because the CTE and permittivity of a glass cannot be chosen independently, an optimum glass composition has to be found. For a given LTCC, it is possible to control the devitrification by shifting the glass composition. In this way, the resulting CTE values can be predicted more exactly and tailoring becomes possible. Different LTCC materials, based on the crystalline compounds Ba(La,Nd)2Ti4O12, ZrO2 (Y-TZP), SiO2 (quartz), and specially developed glasses, possessing an elevated CTE of around 10 × 10-6 K-1 while showing permittivity εr between 6 and 63, are introduced. KW - LTCC KW - Glass ceramic composites KW - Coefficient of thermal expansion CTE KW - Design PY - 2009 DO - https://doi.org/10.1111/j.1744-7402.2008.02316.x SN - 1546-542X SN - 1744-7402 VL - 6 IS - 1 SP - 1 EP - 8 PB - American Ceramic Soc. CY - Westerville, Ohio AN - OPUS4-18675 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberstein, Markus A1 - Glitzky, Carsten A1 - Gemeinert, Marion A1 - Rabe, Torsten A1 - Schiller, Wolfgang Arno A1 - Modes, C. T1 - Design of LTCC with high thermal expansion T2 - IMAPS/ACERS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2008) CY - Munich, Germany DA - 2008-04-21 KW - LTCC KW - Glass ceramic composites KW - Coefficient of thermal expansion CTE KW - Design PY - 2008 SP - 000120 EP - 000126 PB - IMAPS, International Microelectronics and Packaging Society CY - Washington, DC AN - OPUS4-17436 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Glitzky, Carsten A1 - Rabe, Torsten A1 - Eberstein, Markus A1 - Schiller, Wolfgang Arno A1 - Töpfer, J. A1 - Barth, S. A1 - Kipka, A. T1 - LTCC-Modules with integrated ferrite layers - Strategies for material development and co-sintering N2 - The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties. KW - Coefficient of thermal expansion (CTE) KW - Cofiring KW - Ferrite KW - LTCC KW - Shrinkage PY - 2009 SN - 1551-4897 VL - 6 IS - 1 SP - 49 EP - 53 CY - Washington, DC AN - OPUS4-19708 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Glitzky, Carsten A1 - Rabe, Torsten A1 - Eberstein, Markus A1 - Schiller, Wolfgang Arno A1 - Töpfer, J. A1 - Barth, S. A1 - Kipka, A. T1 - LTCC-modules with integrated ferrite layers - Strategies for material development and co-sintering T2 - 2009 IMAPS/ACerS - 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) CY - Denver, Colorado, USA DA - 2009-04-21 KW - LTCC KW - Ferrite KW - Co-firing KW - Shrinkage KW - Coefficient of thermal expansion (CTE) PY - 2008 SN - 0-930815-83-1 SP - 000058 EP - 000063 AN - OPUS4-18926 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Eberstein, Markus A1 - Schiller, Wolfgang Arno T1 - Neue niedrig sinternde Mikrowellenkeramik für Anwendungen in der mobilen Kommunikationstechnik PY - 2003 UR - http://www.keramische-zeitschrift.de/images/Keram_2003.pdf SN - 0023-0561 VL - 55 IS - 5 SP - 344 EP - 348 PB - DVS-Verl. CY - Düsseldorf AN - OPUS4-2754 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Schiller, Wolfgang Arno A1 - Eberstein, Markus A1 - Müller, Ralf T1 - Glas-Keramik-Komposite für Mikrosysteme und Sensoren PY - 2002 SN - 1618-8721 VL - 1 IS - 2 SP - 17 PB - Deutsche Glastechnische Gesellschaft CY - Offenbach AN - OPUS4-3115 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Rabe, Torsten A1 - Gemeinert, Marion A1 - Schiller, Wolfgang Arno T1 - Development of Advanced Low Temperature Co-fired Ceramics (LTCC) KW - LTCC KW - Zero shrinkage sintering KW - Multilayer KW - Material development PY - 2004 SN - 1013-9826 VL - 264-268 SP - 1181 EP - 1184 PB - Trans Tech Publ. CY - Aedermannsdorf AN - OPUS4-5843 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - Dünnfilmkompatible LTCC als Basis multifunktioneller Mehrlagengehäuse für Mikrosysteme T2 - Abschlusskolloquium zum BMBF-Projekt: Technologien für vertikale Mikrosystemaufbauten - Optobasis (16SV824/4) CY - Berlin, Germany DA - 2002-03-05 PY - 2002 AN - OPUS4-6298 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - Advanced LTCC Technologie: Neue werkstofftechnische konzepte für Kommunikations- und Sensoranwendungen T2 - DKG-Tagung "Technische Keramik in Funktion" CY - Hermsdorf (Thuringia), Germany DA - 2002-09-19 PY - 2002 AN - OPUS4-6300 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - Werkstofftechnik der Hochleistungskeramik und Werbundwerkstoffe T2 - Materialica 2003 CY - Munich, Germany DA - 2003-09-15 PY - 2003 AN - OPUS4-4748 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Weh, Lothar A1 - Venthur, Astrid A1 - Schiller, Wolfgang Arno T1 - Defekte und Oberflächenstrukturen in keramischen Folien auf Polyvinylbutyral-Basis N2 - Defekte und störende Oberflächenstrukturen keramischer Bauelemente, die aus keramischen Folien gefertigt werden, haben neben keramtechnologischen Prozessfehlern vielfach ihre Ursachen in dynamischen Prozessen bei der Trocknung der Nassschichten. Neben Einzeldefekten wie Poren oder Rissen können in Grünfolien während der Trocknung auch oberflächenspannungsinduzierte periodische Schichtdickenunterschiede auftreten. Grenzflächenendynamische Bewegungen wie auch die Bildung von Blasen oder Agglomeraten treten gleichermaßen in gegossenen keramischen Schichten und in keramikfreien Polyvinylbutyral/Weichmacher-Schichten auf. Das analoge Verhalten der untersuchten gegossenen keramischen Schichten und der entsprechenden keramikfreien Polymerschichten bezüglich der Entstehung dieser Oberflächenfehler sowie Möglichkeiten zur Fehlerreduzierung werden aufgezeigt. KW - Keramische Folien KW - Oberflächentopologie KW - Defekte KW - Marangoni-Instabilität KW - Schlicker KW - Oberfläche KW - Gefüge KW - Grenzflächenprozesse PY - 2004 UR - http://www.keramische-zeitschrift.de/index.cfm?objekt=Keram&jahr=2004&ausgabe=9&rubrik=Aus%20Forschung%20und%20Technik&lang=DE&artikel_id=202007&navi=2 SN - 0023-0561 VL - 9-10 SP - 562 EP - 572 PB - DVS-Verl. CY - Düsseldorf AN - OPUS4-4755 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - Neue werkstofftechnische Konzepte in der LTCC technologie T2 - 10. BAM Keramiktag / Symposium "Folie- und multilayertechnologie für funktionskeramische Anwendungen" CY - Berlin, Germany DA - 2003-04-10 PY - 2003 AN - OPUS4-5350 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - LTCC-Keramik im Automobil T2 - MicroCar 2003 - Mikrowerkstoffe, Nanowerkstoffe für den Automobilbau CY - Leipzig, Germany DA - 2003-06-26 PY - 2003 AN - OPUS4-5351 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - Neue Zero Shrinkage LTCC für Mikrosysteme hoher Präzision T2 - DKG/BAM-Symposium "Glasig-kristalline Funktionswerkstoffe - Vielfalt und Präzision" (12. Keramiktag der BAM) CY - Berlin, Germany DA - 2005-05-12 PY - 2005 AN - OPUS4-7810 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - Zur Funktion der Gläser in der LTCC-Technologie T2 - DGG-Glasforum 2005, Schott AG CY - Mainz, Germany DA - 2005-10-18 PY - 2005 AN - OPUS4-11739 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - Hochleistungskeramik und Multilayer-Folien-Technik für Mikrosysteme T2 - Leibnitz-Sozietät, Klasse "Naturwissenschaften" CY - Berlin, Germany DA - 2005-12-08 PY - 2005 AN - OPUS4-11740 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Schiller, Wolfgang Arno T1 - Zero Shrinkage LTCC für Mikrosensoren T2 - DKG Jahrestagung 2006 CY - Stuttgart, Germany DA - 2006-04-03 PY - 2006 AN - OPUS4-12424 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberstein, Markus A1 - Rabe, Torsten A1 - Schiller, Wolfgang Arno T1 - Liquid Phases in LTCC - Key to Tailored Materials T2 - MAPS/ACerS 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2006) CY - Denver, CO, USA DA - 2006-04-24 KW - LTCC KW - Ceramic composites KW - Liquid phase sintering KW - Viscosity KW - Dielectric properties KW - Crystallization PY - 2006 SP - 1(?) EP - 8(?) PB - American Ceramic Society CY - Denver AN - OPUS4-14043 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -