TY - JOUR A1 - Kuhmann, J. F. A1 - Chiang, C. H. A1 - Harde, P. A1 - Reier, F. A1 - Österle, Werner A1 - Urban, Ingrid A1 - Klein, A. T1 - Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy N2 - Platinum does not form any adherent oxides and can be easily wetted by tin-based solders. Platinum is also an available metallization in semiconductor laboratories. Therefore we investigated the diffusion of platinum thin-film metallizations into eutectic tin–lead solder by using a high-resolution secondary ion mass spectroscopy (SIMS) profiling from the back side. It is shown that an intermetallic phase (PtSn4) is formed during soldering, which controls the consumption of platinum during soldering and in operation. The consumption of platinum follows the well-known parabolic diffusion law. The activation energy of this process is 0.63 eV. Even at extended heating cycles of 2 min at 250°C, 190 nm from the original 300 nm of the platinum film remain undissolved. This high stability makes platinum a very attractive thin-film metallization for flip-chip (FC) bonding of new microsystems. KW - Pt thin film metallization KW - FC solder bonding KW - Diffusion KW - SIMS PY - 1998 SN - 0921-5093 VL - A242 SP - 22 EP - 25 PB - Elsevier AN - OPUS4-38540 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Sievert, Rainer A1 - Österle, Werner A1 - Olschewski, Jürgen A1 - Ziebs, Josef T1 - Physical interpretation of a viscoplastic model applied to high temperature performance of a nickel-base superalloy PY - 1997 SN - 0179-4841 SN - 0044-3093 VL - 88 SP - 416 EP - 424 PB - Hanser CY - München AN - OPUS4-2547 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Bettge, Dirk A1 - Jiao, F. A1 - Österle, Werner A1 - Ziebs, Josef ED - Lütjering, G. T1 - An extended model of the tension-compression asymmetry of single crystal nickel-base superalloys T2 - 6th International Fatigue Congress CY - Berlin, Germany DA - 1996-05-06 PY - 1996 SN - 0-08-042268-3 VL - 2 IS - 2 SP - 885 EP - 889 PB - Pergamon CY - Oxford AN - OPUS4-2508 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Fedelich, Bernard A1 - Frenz, Holger A1 - Österle, Werner A1 - Ohm, Katrin ED - Petit, J. T1 - Experimental and numerical evaluation of fatigue crack initiation and propagation for IN738LC at 850°C N2 - Interrupted LCF-tests at 850 deg C for Inconel 738LC have been carried out and the specimens have been intensively examined by REM to quantify the evolution of fatigue damage. Surface crack nucleation at oxidatized grain boundaries and coalescence of neighboring flaws occurred during the whole experiment. An anomalous fast single crack growth is observed just after nucleation, followed by a relative stagnation of the propagation in absence of coalescence. A statistical model is proposed that describes these pheonmena. It leads to an integro-differential equation for the crack density f(c,n) after n cycles, similar to the Bolzmann equation which describes the collision of molecules in a dilute gas. T2 - 11th Biennial European Conference on Fracture (ECF) CY - Poitiers-Futuroscope, France DA - 1996-09-03 PY - 1996 SN - 0-947817-92-1 VL - 2 SP - 1237 EP - 1242 PB - EMAS CY - Warley, West Midlands AN - OPUS4-2512 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Kuhmann, J. A1 - Harde, P. A1 - Pech, O. A1 - Pittroff, W. A1 - Preuß, A. A1 - Adolphi, B. A1 - Wirth, Thomas A1 - Österle, Werner ED - Reichl, H. T1 - Fluxless flip-chip bonding for the photonic assembly - comparison between evaporated SnPb (60/40) and AuSn (80/20) solder T2 - 5th International Conference on Micro-Electro-, -Opto-, -Mechanical Systems and Components CY - Potsdam, Germany DA - 1996-09-17 PY - 1996 SN - 3-8007-2200-3 VL - 5 SP - 91 EP - 97 PB - VDE-Verl. CY - Berlin AN - OPUS4-2544 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Urban, Ingrid A1 - Dörfel, Ilona A1 - Österle, Werner A1 - Schierhorn, Eike T1 - Interfaces between hard coating systems and substrates T2 - 11th European Conference on Electron Microscopy (EUREM-11) CY - Dublin, Ireland DA - 1996-08-26 PY - 1996 SN - 2-9600163-0-0 PB - CESM, Committee of European Societies of Microscopy CY - Brussels AN - OPUS4-2545 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Jiao, Feng A1 - Österle, Werner A1 - Portella, Pedro Dolabella A1 - Ziebs, Josef T1 - Cyclic hardening of alloy 800h under biaxial loading T2 - International Congress Stainless Steels '96 ; 2nd European congress CY - Düsseldorf and Neuss, Germany DA - 1996-06-03 KW - Hochtemperaturtechnik KW - Beanspruchung, zyklisch KW - Stahl, austenitisch KW - Legierung 800 H PY - 1996 SN - 3-514-00601-6 SP - 292 EP - 293 PB - Verl. Stahleisen CY - Düsseldorf AN - OPUS4-695 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Fedelich, Bernard A1 - Frenz, Holger A1 - Österle, Werner A1 - Ohm, Katrin ED - Lütjering, G. T1 - A stochastic model for LCF small crack growth in a nickel-base superalloy T2 - 6th International Fatigue Congress CY - Berlin, Germany DA - 1996-05-06 PY - 1996 SN - 0-08-042268-3 VL - 96 IS - 2 SP - 1263 EP - 1268 PB - Pergamon CY - Oxford AN - OPUS4-2511 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Österle, Werner A1 - Portella, Pedro Dolabella A1 - Ziebs, Josef A1 - Jiao, Feng ED - Lütjering, G. T1 - Mechanical behaviour of alloy 800h under cyclic biaxial loading T2 - 6th International Fatigue Congress CY - Berlin, Germany DA - 1996-05-06 KW - Legierung KW - Belastung, zyklisch KW - Beanspruchung, mechanisch PY - 1996 SN - 0-08-042268-3 VL - 2 IS - 2 SP - 989 EP - 994 PB - Pergamon CY - Oxford AN - OPUS4-669 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Ressel, P. A1 - Österle, Werner A1 - Urban, Ingrid A1 - Klein, A. A1 - Vogel, K. A1 - Kräutle, H. T1 - Transmission electron microscopy study of rapid thermally annealed Pd/Ge contacts on In0.53Ga0.47As N2 - Phase formation in rapid thermally annealed Pd/Ge contacts on In0.53Ga0.47As has been investigated by means of cross-sectional transmission electron microscopy, convergent-beam electron diffraction, and energy-dispersive x-ray analysis. Solid-phase regrowth is observed to occur similarly as in Pd/Ge contacts on GaAs or InP. The reaction starts at low temperatures with the formation of an amorphous Pd–In–Ga–As layer, which crystallizes at elevated temperatures yielding hexagonal Pd4In0.53Ga0.47As being first described in this work. At temperatures .250 °C, this phase decomposes due to epitaxial solid-phase regrowth of In0.53Ga0.47As and formation of Pd–Ge phases. The stable composition is reached at temperatures .350 °C with excess Ge diffused through top Pd–Ge to the contact interface and growing epitaxially on the semiconductor. KW - Semiconductor KW - Thin film contact layer KW - Electron microscopy KW - Intermetallic phases PY - 1996 DO - https://doi.org/10.1063/1.363348 SN - 0021-8979 VL - 80 IS - 7 SP - 3910 EP - 3914 AN - OPUS4-38537 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -