TY - GEN A1 - Kuhmann, J. A1 - Harde, P. A1 - Pech, O. A1 - Pittroff, W. A1 - Preuß, A. A1 - Adolphi, B. A1 - Wirth, Thomas A1 - Österle, Werner ED - Reichl, H. T1 - Fluxless flip-chip bonding for the photonic assembly - comparison between evaporated SnPb (60/40) and AuSn (80/20) solder T2 - 5th International Conference on Micro-Electro-, -Opto-, -Mechanical Systems and Components CY - Potsdam, Germany DA - 1996-09-17 PY - 1996 SN - 3-8007-2200-3 VL - 5 SP - 91 EP - 97 PB - VDE-Verl. CY - Berlin AN - OPUS4-2544 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -