TY - GEN A1 - Kuhmann, J. A1 - Harde, P. A1 - Pech, O. A1 - Pittroff, W. A1 - Preuß, A. A1 - Adolphi, B. A1 - Wirth, Thomas A1 - Österle, Werner ED - Reichl, H. T1 - Fluxless flip-chip bonding for the photonic assembly - comparison between evaporated SnPb (60/40) and AuSn (80/20) solder T2 - 5th International Conference on Micro-Electro-, -Opto-, -Mechanical Systems and Components CY - Potsdam, Germany DA - 1996-09-17 PY - 1996 SN - 3-8007-2200-3 VL - 5 SP - 91 EP - 97 PB - VDE-Verl. CY - Berlin AN - OPUS4-2544 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Kuhmann, J. F. A1 - Chiang, C. H. A1 - Harde, P. A1 - Reier, F. A1 - Österle, Werner A1 - Urban, Ingrid A1 - Klein, A. T1 - Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy N2 - Platinum does not form any adherent oxides and can be easily wetted by tin-based solders. Platinum is also an available metallization in semiconductor laboratories. Therefore we investigated the diffusion of platinum thin-film metallizations into eutectic tin–lead solder by using a high-resolution secondary ion mass spectroscopy (SIMS) profiling from the back side. It is shown that an intermetallic phase (PtSn4) is formed during soldering, which controls the consumption of platinum during soldering and in operation. The consumption of platinum follows the well-known parabolic diffusion law. The activation energy of this process is 0.63 eV. Even at extended heating cycles of 2 min at 250°C, 190 nm from the original 300 nm of the platinum film remain undissolved. This high stability makes platinum a very attractive thin-film metallization for flip-chip (FC) bonding of new microsystems. KW - Pt thin film metallization KW - FC solder bonding KW - Diffusion KW - SIMS PY - 1998 SN - 0921-5093 VL - A242 SP - 22 EP - 25 PB - Elsevier AN - OPUS4-38540 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -