TY - GEN A1 - Kuhmann, J. A1 - Harde, P. A1 - Pech, O. A1 - Pittroff, W. A1 - Preuß, A. A1 - Adolphi, B. A1 - Wirth, Thomas A1 - Österle, Werner ED - Reichl, H. T1 - Fluxless flip-chip bonding for the photonic assembly - comparison between evaporated SnPb (60/40) and AuSn (80/20) solder T2 - Micro-system technologies '96 T2 - 5th International Conference on Micro-Electro-, -Opto-, -Mechanical Systems and Components CY - Potsdam, Germany DA - 1996-09-17 PY - 1996 SN - 3-8007-2200-3 VL - 5 SP - 91 EP - 97 PB - VDE-Verl. CY - Berlin AN - OPUS4-2544 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Senoner, Mathias A1 - Wirth, Thomas A1 - Unger, Wolfgang A1 - Österle, Werner A1 - Kaiander, I. A1 - Sellin, R. L. A1 - Bimberg, D. ED - Wilkening, G. ED - Koenders, L. T1 - Testing the Lateral Resolution in the Nanometre Range with a New Type of Certified Reference Material T2 - Nanoscale calibration standards and methods T2 - NanoScale 2004 Seminar ; 6th Seminar on Quantitative Microscopy ; 2nd Seminar on Nanoscale Calibration Standards and Methods CY - Braunschweig, Germany DA - 2004-03-25 KW - Laterale Auflösung KW - Nanometrologie KW - Nanotechnologie KW - Oberflächenanalytik KW - Zertifiziertes Referenzmaterial PY - 2004 SN - 3-527-40502-X DO - https://doi.org/10.1002/3527606661.ch21 SP - 282 EP - 294 PB - Wiley-VCH CY - Weinheim AN - OPUS4-7541 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -