TY - CONF A1 - Österle, Werner A1 - Urban, Ingrid A1 - Nebauer, E. T1 - Alloying reactions of Au-Ni-Ge ohmic contacts to n-GaAs T2 - Proceedings of the 13th International Conference on Electron Microscopy PY - 1994 SP - 781 EP - 782 CY - Les Ulis AN - OPUS4-2479 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Österle, Werner A1 - Urban, Ingrid A1 - Gesatzke, Wolfgang A1 - Rooch, Heidemarie ED - Bartz, Wilfried J. T1 - Characterization and evaluation of the formation of friction layers during braking with conventional PMC friction material against a cast iron rotor T2 - Tribology and lubrication engineering - 14th International Colloquium Tribology T2 - 14th International Colloquium Tribology, "Tribology and Lubrication Engineering" CY - Stuttgart, Germany DA - 2004-01-13 PY - 2004 SN - 3-924813-54-X VL - 1 SP - 483 EP - 489 PB - Techn. Akad. Esslingen CY - Ostfildern AN - OPUS4-3494 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Urban, Ingrid A1 - Dörfel, Ilona A1 - Österle, Werner A1 - Schierhorn, Eike T1 - Interfaces between hard coating systems and substrates T2 - Electron microscopy 96 T2 - 11th European Conference on Electron Microscopy (EUREM-11) CY - Dublin, Ireland DA - 1996-08-26 PY - 1996 SN - 2-9600163-0-0 PB - CESM, Committee of European Societies of Microscopy CY - Brussels AN - OPUS4-2545 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Kranzmann, Axel A1 - Hünert, Daniela A1 - Rooch, Heidemarie A1 - Urban, Ingrid A1 - Schulz, Wencke A1 - Österle, Werner T1 - Reactions at the interface between steel and oxide scale in wet CO2 containing atmospheres T2 - NACE International corrosion conference 2009 (Proceedings) N2 - The resistance of structural steels against corrosion in CO2-H2O and CO2-H2O-O2 atmospheres at temperatures above 550°C was observed with high magnification methods. The test atmosphere is the basic composition of an oxyfuel coal combustion atmosphere. The analytical information base was applied to develop reaction schemes for the oxidation of steels. It was demonstrated that the formation of phases and the kinetics of oxidation reactions in this atmospheres is affected by the formation of intermediate iron hydroxide and a high carbon activity. In the temperature regime above 550°C the thermal equilibrium between H2O, CO2 and Fe reacted and formed CO. CO triggers the formation of FeO and carbides and increases the reaction kinetics. Porosity at the interface is established by gaseous phases such as Fe(OH)2 or H2O. H2 formation is not limited to the steel - oxide interface but can occur in the whole oxide scale. Examples of the experimental results were compared with a thermodynamic approach. The objective of the work was to derive qualitative rules of the basic corrosion reactions. T2 - NACE International corrosion conference 2009 CY - Atlanta, Georgia, USA DA - 2009-03-22 KW - High temperature corrosion KW - Corrosion gases KW - Mild steels KW - 9-12% Cr-steels KW - Hydrogen transport KW - Oxyfuel combustion PY - 2009 SP - 1 EP - 10 (Paper 09265) AN - OPUS4-22334 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Österle, Werner A1 - Dmitriev, A.I. A1 - Urban, Ingrid ED - Jayashree Bijwe, T1 - Characterization of up to date brake friction materials T2 - IWAAFC-1, International Workshop on Advances in Asbestos free Friction Composites, January 5-6, 2006, Delhi, India (Proceedings) T2 - IWAAFC-1, International Workshop on Advances in Asbestos free Friction Composites CY - Delhi, India DA - 2006-01-05 PY - 2006 SP - 21 EP - 35 CY - Delhi, India AN - OPUS4-18700 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Ressel, P. A1 - Österle, Werner A1 - Urban, Ingrid A1 - Klein, A. A1 - Vogel, K. A1 - Kräutle, H. T1 - Transmission electron microscopy study of rapid thermally annealed Pd/Ge contacts on In0.53Ga0.47As JF - Journal of Applied Physics N2 - Phase formation in rapid thermally annealed Pd/Ge contacts on In0.53Ga0.47As has been investigated by means of cross-sectional transmission electron microscopy, convergent-beam electron diffraction, and energy-dispersive x-ray analysis. Solid-phase regrowth is observed to occur similarly as in Pd/Ge contacts on GaAs or InP. The reaction starts at low temperatures with the formation of an amorphous Pd–In–Ga–As layer, which crystallizes at elevated temperatures yielding hexagonal Pd4In0.53Ga0.47As being first described in this work. At temperatures .250 °C, this phase decomposes due to epitaxial solid-phase regrowth of In0.53Ga0.47As and formation of Pd–Ge phases. The stable composition is reached at temperatures .350 °C with excess Ge diffused through top Pd–Ge to the contact interface and growing epitaxially on the semiconductor. KW - Semiconductor KW - Thin film contact layer KW - Electron microscopy KW - Intermetallic phases PY - 1996 DO - https://doi.org/10.1063/1.363348 SN - 0021-8979 VL - 80 IS - 7 SP - 3910 EP - 3914 AN - OPUS4-38537 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Kuhmann, J. F. A1 - Chiang, C. H. A1 - Harde, P. A1 - Reier, F. A1 - Österle, Werner A1 - Urban, Ingrid A1 - Klein, A. T1 - Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy JF - Materials Science and Engineering N2 - Platinum does not form any adherent oxides and can be easily wetted by tin-based solders. Platinum is also an available metallization in semiconductor laboratories. Therefore we investigated the diffusion of platinum thin-film metallizations into eutectic tin–lead solder by using a high-resolution secondary ion mass spectroscopy (SIMS) profiling from the back side. It is shown that an intermetallic phase (PtSn4) is formed during soldering, which controls the consumption of platinum during soldering and in operation. The consumption of platinum follows the well-known parabolic diffusion law. The activation energy of this process is 0.63 eV. Even at extended heating cycles of 2 min at 250°C, 190 nm from the original 300 nm of the platinum film remain undissolved. This high stability makes platinum a very attractive thin-film metallization for flip-chip (FC) bonding of new microsystems. KW - Pt thin film metallization KW - FC solder bonding KW - Diffusion KW - SIMS PY - 1998 SN - 0921-5093 VL - A242 SP - 22 EP - 25 PB - Elsevier AN - OPUS4-38540 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -