TY - CONF A1 - Bütefisch, S. A1 - Weimann, T. A1 - Busch, I. A1 - Danzebrink, H.-U. A1 - Gross, Thomas A1 - Unger, Wolfgang A1 - Wirth, Thomas T1 - New reference material for imaging XPS (X-ray photoelectron spectroscopy) instrument characterization N2 - Reference materials without variations in topography are essential for the characterization of imaging XPS (X-ray Photoelectron Spectroscopy) Instruments. Therefore a new fabrication process for this kind of zero-topography reference material was developed at PTB and resulted in first prototypes. The fabrication process and first measurement results will be presented in this paper. T2 - Sensor 2015 - 17th International conference on sensors and measurement technology CY - Nuremberg, Germany DA - 19.05.2015 KW - Imaging XPS KW - Reference material KW - Topography free KW - Micro technology PY - 2015 SN - 978-3-9813484-8-4 DO - https://doi.org/10.5162/sensor2015/P7.1 SP - Chapter P7, 821 EP - 825 AN - OPUS4-33837 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Stockmann, Jörg Manfred A1 - Radnik, Jörg A1 - Bütefisch, Sebastian A1 - Weimann, Thomas A1 - Hodoroaba, Vasile-Dan T1 - A New XPS Test Material for More Reliable Analysis of Microstructures N2 - A reference material is required for small‐area XPS because it has been used more frequently for surface control in recent years and many operators use incorrect field of views. To address this problem, we developed a test material starting in 2019. We optimised this XPS test material dedicated to the control of analysis position on the sample, with respect to the following factors: type of XPS instruments available on the market, the manufacturing process and sample handling. Test structures are now aligned along lines instead of on a circle radius, so that the individual structures can be accessed more quickly and easily. In addition, a larger test structure of 300 μm and another one in an intermediate size of 18 μm were added. Smaller test structures under 50 μm have been annotated with finder grids/arrows around them so that they are easier to find. Further, the manufacturing process was changed from e‐beam lithography to a mask process to be able to offer the test material at a favourable price. The use of masks also had to be adapted for the new manufacturing process so that the smallest square structures are also realised as such and do not show any distortion of the structure boundaries. The quality control using a metrological SEM confirmed a very reproducible manufacturing process. It is demonstrated that the test material can be successfully employed to find the most suitable beam size of the XPS system used for the analysis of small (μm range) surface features. KW - Small-area measurements KW - Test material KW - XPS KW - XPS imaging PY - 2024 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-616577 DO - https://doi.org/10.1002/sia.7367 SP - 1 EP - 6 PB - Wiley AN - OPUS4-61657 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -