TY - CONF A1 - Paul, S. C. A1 - Ebell, Gino A1 - Van Zijl, G. P. A. G. A1 - Schmidt, Wolfram ED - Schlangen, E. ED - Sierra Beltran, M.G. ED - Lukovic, M. ED - Ye, G. T1 - Cracked and uncracked SHCC specimens under different exposure conditions N2 - This paper describes the fibre-reinforced strain hardening cement-based composite (SHCC) performance under various exposure conditions. Cracked and uncracked SHCC beam specimens were subjected to cyclic wetting and drying under chloride exposure to observe the time of depassivation and corrosion potential of the imbedded reinforcement. Two reference mortars, one of the same strength class as the SHCC (Mortar 1) and the other of high strength class (Mortar 2) were used under the same conditions. Finally, tests for determining the rapid chloride migration coefficient, electrical resistivity, capillary water absorption and freezethaw were also performed to observe the corrosion probability and diffusion rate in uncracked SHCC and mortars. T2 - SHCC3 - 3rd International RILEM conference on strain hardening cementitious composites CY - Dordrecht, The Netherlands DA - 03.11.2014 KW - Depassivation KW - SHCC corrosion crack KW - Lochkorrosion KW - Betonstahl PY - 2014 SN - 978-2-35158-150-6 SN - 978-2-35158-151-3 SP - 25 EP - 32 AN - OPUS4-32462 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Steglich, P. A1 - Mai, C. A1 - Bondarenko, S. A1 - Paul, Martin A1 - Weller, Michael G. A1 - Schrader, S. A1 - Mai, A. T1 - BioPIC - Integration of Biosensors based on Photonic Integrated Circuits by Local-Backside Etching N2 - Silicon photonic sensors are promising candidates for lab-on-a-chip solutions with versatile applications and scalable production prospects using complementary metal-oxide semiconductor (CMOS) fabrication methods. However, the widespread use has been hindered because the sensing area adjoins optical and electrical components making packaging and sensor handling challenging. In this work, a local back-side release of the photonic sensor is employed, enabling a separation of the sensing area from the rest of the chip. This approach allows preserving the compatibility of photonic integrated circuits in the front-end of line and metal interconnects in the back-end of line. T2 - ATTRACT online Conference CY - Online meeting DA - 22.09.2020 KW - Silicon Photonics KW - Photonic Sensor KW - Photonic Integrated Circuits KW - Point-Of-Care-Diagnostics KW - CMOS KW - Microfluidics KW - Lab-on-a-chip KW - Ring resonator PY - 2020 UR - https://attract-eu.com/showroom/project/integration-of-biosensors-based-on-photonic-integrated-circuits-by-local-backside-etching-biopic/ SP - 1 EP - 5 AN - OPUS4-51735 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -