TY - CONF A1 - Köppe, Tabea A1 - Werner, Klaus-Dieter A1 - Kammermeier, Michael A1 - Bartholmai, Matthias ED - Jirousek, O. ED - Kytýr, D. T1 - Temperature-dependent dynamic analysis of the system strain gauge/adhesive N2 - In this study the influence of the lemperature is syslematically investigated for dynamic impact on the System strain gauge/adhesive. The aim is to make a Statement aboutthe reliability ofthe different tested adhesives. For the investigations a Hopkinson pressurebar combined with a temperature chamber was used. The produced Information is important e.g. for drop tests oftransport and storage Containers. An important result ofthe test is that the temperature has no significant influence on the measurement of the compression maximum at high dynamic load. Also there was no debonding ofa strain gauge which could have been a sign for brittleness ofthe adhesive. Due to the low generated strains, creep behaviour could not be investigated. Thats why two additional tests will be performed. The first test is a static analysis in the temperature chamber with a four point bending beam. The second test is a rheological examination of the different adhesives in the temperature ränge. T2 - XIIIth Bilateral Czech/German symposium - Experimental methods and numerical simulation in engineering sciences CY - Telc, Czech Republic DA - 05.06.2012 KW - Hopkinson pressure bar KW - Temperature dependent and high dynamic load tests KW - System adhesive/ strain gauge PY - 2012 SN - 978-80-01-05062-0 N1 - Geburtsname von Köppe, Tabea: Wilk, T. - Birth name of Köppe, Tabea: Wilk, T. IS - 1 SP - 99 EP - 102 PB - CTU AN - OPUS4-26027 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -