TY - JOUR A1 - Thiel, Erik A1 - Ziegler, Mathias T1 - Subsurface defect localization by structured heating using laser projected photothermal thermography N2 - The presented method is used to locate subsurface defects oriented perpendicularly to the surface. To achieve this, we create destructively interfering thermal wave fields that are disturbed by the defect. This effect is measured and used to locate the defect. We form the destructively interfering wave fields by using a modified projector. The original light engine of the projector is replaced with a fiber-coupled high-power Diode laser. Its beam is shaped and aligned to the projector's spatial light modulator and optimized for optimal optical throughput and homogeneous projection by first characterizing the beam profile, and, second, correcting it mechanically and numerically. A high-performance infrared (IR) camera is set up according to the tight geometrical situation (including corrections of the geometrical image distortions) and the requirement to detect weak temperature oscillations at the sample surface. Data acquisition can be performed once a synchronization between the individual thermal wave field sources, the scanning stage, and the IR camera is established by using a dedicated experimental setup which needs to be tuned to the specific material being investigated. During data post-processing, the relevant information on the presence of a defect below the surface of the sample is extracted. It is retrieved from the oscillating part of the acquired thermal radiation coming from the so-called depletion line of the sample surface. The exact location of the defect is deduced from the analysis of the spatial-temporal shape of these oscillations in a final step. The method is reference-free and very sensitive to changes within the thermal wave field. So far, the method has been tested with steel samples but is applicable to different materials as well, in particular to temperature sensitive materials. KW - Active thermography KW - Structured heating KW - Digital micromirror device KW - Thermal wave field KW - Photothermal PY - 2017 UR - https://www.jove.com/video/55733 DO - https://doi.org/10.3791/55733 SN - 1940-087X IS - 123 SP - e55733-1 EP - e55733-13 PB - MyJoVE Corp. AN - OPUS4-40281 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Krishna, S. K. P. A1 - Puthiyaveetil, N. A1 - Kidangan, R. A1 - Unnikrishnakurup, Sreedhar A1 - Ziegler, Mathias A1 - Myrach, Philipp A1 - Balasubramaniam, Krishnan A1 - Purushothaman, B. T1 - Raw data based image processing algorithm for fast detection of surface breaking cracks N2 - The aim of this work is to illustrate the contribution of signal processing techniques in the field of Non-Destructive Evaluation. A component’s life evaluation is inevitably related to the presence of flaws in it. The detection and characterization of cracks prior to damage is a technologically and economically significant task and is of very importance when it comes to safety-relevant measures. The Laser Thermography is the most effective and advanced thermography method for Non-Destructive Evaluation. High capability for the detection of surface cracks and for the characterization of the geometry of artificial surface flaws in metallic samples of laser thermography is particularly encouraging. This is one of the non- contacting, fast and real time detection method. The presence of a vertical surface breaking crack will disturb the thermal footprint. The data processing method plays vital role in fast detection of the surface and sub-surface cracks. Currently in laser thermographic inspection lacks a compromising data processing algorithm which is necessary for the fast crack detection and also the analysis of data is done as part of post processing. In this work we introduced a raw data based image processing algorithm which results precise, better and fast crack detection. The algorithm we developed gives better results in both experimental and modeling data. By applying this algorithm we carried out a detailed investigation Variation of thermal contrast with crack parameters like depth and width. The algorithm we developed is applied for various surface temperature data from the 2D scanning model and also validated credibility of algorithm with experimental data. T2 - QNDE conference 2016 - Review of progress in quantitative nondestructive evaluation CY - Atlanta, GA, USA DA - 18.07.2016 KW - Crack Detection KW - Laserthermografie KW - Thermografie KW - Risserkennung PY - 2017 SN - 978-0-7354-1474-7 DO - https://doi.org/10.1063/1.4974723 SN - 0094-243X VL - 1806 IS - 1 SP - UNSP 140008, 1 EP - 9 PB - AIP Publishing CY - New York AN - OPUS4-39387 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Puthiyaveettil, N. A1 - Krishna, S. A1 - Kidangan, R. A1 - Unnikrishnakurup, Sreedhar A1 - Krishnamurthy, C. V. A1 - Ziegler, Mathias A1 - Myrach, Philipp A1 - Balasubramaniam, Krishnan T1 - In-line laser thermography for crack detection at elevated temperature: A Numerical modeling study N2 - The detection and characterization of cracks prior to damage is a technologically and economically highly significant task and is of very importance when it comes to safety-relevant structures. The evaluation of a components life is closely related to the presence of cracks in it. Laser thermography has already high capability for the detection of surface cracks and for the characterization of the geometry of artificial surface flaws in metallic samples. Crack detection in metallic samples at high temperature is highly significant in present manufacturing scenario. During the casting process of billets, surface cracks form, due to the suboptimal cooling rates. These cracks reduce value of the billet and must be removed using machining process after cooling. This secondary process increases cost of manufacturing. In this work we developed a heat transfer model for laser thermography to study the thermal contrast variation with increase in surface temperature using finite element method (FEM). Here we are mainly concentrating the capability of the scanning laser thermography in crack detection which are in elevated temperature and numerical modeling study of thermal contrast variation of crack with respect increase in metal surface temperature. This study is important to prove the capability of laser thermography for crack detection in elevated temperature. Since we are using High power CW Laser to local heating of the metal surface which can give relatively high thermal contrast even at elevated temperature compare to other heating source. Here we are modeled and simulated 2D laser scanning across a surface breaking crack and developed an algorithm to produce the vicinity of crack. The algorithm we developed applied for various surface temperature data. And validated the credibility of the algorithm with experimental data. T2 - 13th Quantitative Infrared Thermography Conference 2016 CY - Gdansk, Poland DA - 04.07.2016 KW - Thermal contrast KW - Laser thermography KW - Thermography KW - Surface cracks KW - Elevated temperatures KW - FEM PY - 2016 UR - http://www.ndt.net/article/qirt2016/papers/092.pdf DO - https://doi.org/10.21611/qirt.2016.092 VL - 2016 SP - 588 EP - 596 PB - QIRT 2016 Proceedings AN - OPUS4-39105 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Thiel, Erik A1 - Kreutzbruck, M. A1 - Ziegler, Mathias T1 - Laser-projected photothermal thermography using thermal wave field interference for subsurface defect characterization N2 - The coherent superposition of two anti-phased thermal wave fields creates a zone of destructive interference which is extremely sensitive to the presence of defects without any reference measurements. Combining a high power laser with a spatial light modulator allows modulating phase and amplitude of an illuminated surface that induces spatially and temporally controlled thermal wave fields. The position and depth of defects are reconstructed from analysis of the Amplitude and Phase of the resulting photothermal signal. The proposed concept is experimentally validated and supported by numerical modeling. KW - Thermal waves KW - Active thermography KW - DMD KW - Spatial light modulator KW - Subsurface defects PY - 2016 UR - http://scitation.aip.org/search?value1=laser+projected+photothermal&option1=all&option912=resultCategory&value912=ResearchPublicationContent&operator8=AND&option8=pub_serialIdent&value8=aip%2Fjournal%2Fapl&qs=true DO - https://doi.org/10.1063/1.4963139 SN - 0003-6951 VL - 109 IS - 12 SP - 123504-1 EP - 123504-4 PB - AIP Publishing CY - Melville, New York AN - OPUS4-37590 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Hempel, M. A1 - Ziegler, Mathias A1 - Tomm, J.W. A1 - Elsaesser, T. A1 - Michel, N. A1 - Krakowski, M. T1 - Time-resolved analysis of catastrophic optical damage in 975 nm emitting diode lasers N2 - Catastrophic optical damage (COD) is analyzed during single current pulse excitation of 975 nm emitting diode lasers. Power transients and thermal images are monitored during each pulse. The COD process is unambiguously related to the occurrence of a “thermal flash” of Planck’s radiation. We observe COD to ignite multiple times in subsequent pulses. Thermography allows for tracing a spatial motion of the COD site on the front facet of the devices. The time constant of power decay after the onset of COD has values from 400 to 2000 ns, i.e., an order of magnitude longer than observed for shorter-wavelength devices. KW - Semiconductor laser KW - Thermography KW - Catastrophic optical damage KW - High-power diode lasers PY - 2010 DO - https://doi.org/10.1063/1.3456388 SN - 0003-6951 SN - 1077-3118 VL - 96 IS - 251105 SP - 1 EP - 3 PB - American Institute of Physics CY - Melville, NY AN - OPUS4-21672 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Ziegler, Mathias A1 - Hempel, M. A1 - Larsen, H. E. A1 - Tomm, J. W. A1 - Andersen, P. E. A1 - Clausen, S. A1 - Elliott, S. N. A1 - Elsaesser, T. T1 - Physical limits of semiconductor laser operation: A time-resolved analysis of catastrophic optical damage N2 - The early stages of catastrophic optical damage (COD) in 808 nm emitting diode lasers are mapped by simultaneously monitoring the optical emission with a 1 ns time resolution and deriving the device temperature from thermal images. COD occurs in highly localized damage regions on a 30 to 400 ns time scale which is determined by the accumulation of excess energy absorbed from the optical output. We identify regimes in which COD is avoided by the proper choice of operation parameters. KW - Semiconductor laser KW - Thermography KW - Catastrophic optical damage KW - High-power diode lasers PY - 2010 DO - https://doi.org/10.1063/1.3463039 SN - 0003-6951 SN - 1077-3118 VL - 97 IS - 021110 SP - 1 EP - 3 PB - American Institute of Physics CY - Melville, NY AN - OPUS4-21741 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Hempel, M. A1 - Tomm, J.W. A1 - Ziegler, Mathias A1 - Elsaesser, T. A1 - Michel, N. A1 - Krakowski, M. T1 - Catastrophic optical damage at front and rear facets of diode lasers N2 - Single-pulse tests of the catastrophic optical damage (COD) are performed for three batches of diode lasers with different gain-regions. The tests involve in situ inspection of front, rear, and side of the devices by a thermocamera. Devices with an Al-containing gain-region show COD at the front facet, as expected for strong facet heating via surface recombination and reabsorption of laser light. In contrast, Al-free devices with low surface recombination rates tend to fail at the rear facet, pointing to a different heating scenario. The high carrier density at the rear facet favors heating and COD via Auger recombination processes. KW - Thermography KW - Catastrophic optical damage KW - High power diode lasers KW - Destructive testing KW - Non-destructive testing KW - Auger effect KW - Carrier density KW - Heating KW - Laser beam effects KW - Optical testing KW - Semiconductor lasers KW - Surface recombination PY - 2010 DO - https://doi.org/10.1063/1.3524235 SN - 0003-6951 SN - 1077-3118 VL - 97 IS - 23 SP - 231101-1 - 231101-3 PB - American Institute of Physics CY - Melville, NY AN - OPUS4-22763 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Tomm, J.W. A1 - Ziegler, Mathias A1 - Hempel, M. A1 - Elsaesser, T. T1 - Mechanisms and fast kinetics of the catastrophic optical damage (COD) in GaAs-based diode lasers N2 - COD diagram determined for a batch of broad-area AlGaAs diode lasers. The time to COD within a single current pulse is plotted versus the actual average optical power in the moment when the COD takes place. Full circles stand for clearly identified COD events (right ordinate), whereas open circles (left ordinate) represent the pulse duration in experiments, where no COD has been detected. A borderline (gray) exists between two regions, i. e., parameter sets, of presence (orange) and absence of COD (blue). This borderline is somewhat blurred because of the randomness in filamentation of the laser nearfield and scatter in properties of the involved individual devices. KW - Semiconductor laser KW - Thermography KW - Catastrophic optical damage KW - High-power diode lasers KW - Destructive testing KW - Non-destructive testing PY - 2011 DO - https://doi.org/10.1002/lpor.201000023 SN - 1863-8880 VL - 5 IS - 3 SP - 422 EP - 441 PB - Wiley-VCH CY - Weinheim AN - OPUS4-23624 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Pagano, R. A1 - Ziegler, Mathias A1 - Tomm, J.W. A1 - Esquivias, I. A1 - Tijero, J.M.G. A1 - O'Callaghan, J.R. A1 - Michel, N. A1 - Krakowski, M. A1 - Corbett, B. T1 - Two-dimensional carrier density distribution inside a high power tapered laser diode N2 - The spontaneous emission of a GaAs-based tapered laser diode emitting at λ = 1060 nm was measured through a window in the transparent substrate in order to study the carrier density distribution inside the device. It is shown that the tapered geometry is responsible for nonuniform amplification of the spontaneous/stimulated emission which in turn influences the spatial distribution of the carriers starting from below threshold. The carrier density does not clamp at the lasing threshold and above it the device shows lateral spatial hole-burning caused by high stimulated emission along the cavity center. KW - Carrier density KW - Gallium arsenide KW - III-V semiconductors KW - Indium compounds KW - Laser cavity resonators KW - Optical hole burning KW - Quantum well lasers KW - Stimulated emission KW - Superradiance PY - 2011 DO - https://doi.org/10.1063/1.3596445 SN - 0003-6951 SN - 1077-3118 VL - 98 SP - 221110-1 EP - 221110-3 PB - American Institute of Physics CY - Melville, NY AN - OPUS4-23873 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Schlichting, Joachim A1 - Ziegler, Mathias A1 - Dey, Anika A1 - Maierhofer, Christiane A1 - Kreutzbruck, Marc T1 - Efficient data evaluation for thermographic crack detection N2 - We present an all-purpose crack detection algorithm for flying spot thermography which is directly applicable to a thermogram sequence without the need of any additional information about the experimental setup. A single image containing distinct crack signatures is derived in two steps. Firstly, the spatial derivative is calculated for each frame of the sequence and, secondly, the resulting data set is sorted pixel wise along the time axis. The feasibility of the proposed procedure is proven by testing a piece of rail that comprises roll contact fatigue cracks and by comparing the results with magnetic particle testing. KW - Active thermography KW - Laser scanner KW - Railway KW - Roll contact fatigue KW - Open surface cracks PY - 2011 SN - 1768-6733 VL - 8 IS - 1 SP - 119 EP - 123 PB - Lavoisier CY - Cachan Cedex AN - OPUS4-24255 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -