TY - JOUR A1 - Vöse, Markus A1 - Fedelich, Bernard A1 - Otto, F. A1 - Eggeler, G. T1 - Micromechanical modeling of creep damage in a copper-antimony alloy N2 - A micromechanical model of creep induced grain boundary damage is proposed, which allows for the simulation of creep damage in a polycrystal with the finite element method. Grain boundary cavitation and sliding are considered via a micromechanically motivated cohesive zone model, while the grains creep following the slip system theory. The model has been calibrated with creep test data from pure Cu single crystals and a coarse-grained polycrystalline Cu-Sb alloy. The test data includes porosity measurements and estimates of grain boundary sliding. Finally, the model has been applied to Voronoi models of polycrystalline structures. In particular the influence of grain boundary sliding on the overall creep rate is demonstrated. T2 - ECF20 - 20th European conference on fracture CY - Trondheim, Norway DA - 28.06.2014 KW - Creep damage KW - Grain boundary sliding KW - Cohesive zone KW - Micromechanical model KW - Polycrystal PY - 2014 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:b43-309914 SN - 2211-8128 VL - 3 SP - 21 EP - 26 PB - Curran CY - Red Hook, NY, USA AN - OPUS4-30991 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Vöse, Markus A1 - Otto, F. A1 - Fedelich, Bernard A1 - Eggeler, G. T1 - Micromechanical investigations and modelling of a copper-antimony-alloy under creep conditions N2 - In many practical applications, creep damage is the limiting factor of a component’s lifetime. A micromechanical model of creep induced grain boundary damage is proposed, which allows for the simulation of creep damage in a polycrystal within the framework of finite element analysis. The model considers grain boundary cavitation and sliding according to a micromechanically motivated cohesive zone model while creep deformation of the grains is described following the slip system theory. The model can be applied to idealised polycrystalline structures, such as a Voronoi tessellation or, like demonstrated here, to real grain structures of miniature creep specimens. Creep tests with pure Cu single crystals and with a coarse-grained polycrystalline Cu-1 wt.% Sb alloy at 823 K have been performed and used to calibrate the polycrystal model. The grain structure of the polycrystalline Cu–Sb specimens has been revealed by the EBSD method. Extensive grain boundary sliding and cavitation has been observed in the crept specimens. Grain boundary sliding has been found to promote wedge-type damage at grain boundary triple junctions and to contribute significantly to the total creep strain. Furthermore, the assumed stress sensitivity of the models grain boundary cavity nucleation rate strongly influences the development of wedge-type damage. KW - Creep KW - Damage KW - Copper–Antimony-Alloy KW - Grain boundary cavitation KW - Grain boundary sliding KW - Micromechanical model PY - 2014 U6 - https://doi.org/10.1016/j.mechmat.2013.09.013 SN - 0167-6636 SN - 1872-7743 VL - 69 IS - 1 SP - 41 EP - 62 PB - Elsevier Ltd. CY - Amsterdam AN - OPUS4-29396 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -