TY - GEN A1 - Paproth, A. A1 - Wolter, Klaus-Jürgen A1 - Friedrich, Jörg Florian A1 - Deltschew, R. T1 - Metal-Polymer Composites for Molded Interconnect Devices (MID) T2 - 55th Electronic Components & Technology Conference CY - Lake Buena Vista, FL, USA DA - 2005-06-01 PY - 2005 SN - 0-7803-8907-7 SP - 6 pages PB - IEEE Service Center CY - Piscataway AN - OPUS4-11945 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -