TY - JOUR A1 - Jaunich, Matthias A1 - Stark, Wolfgang A1 - Wolff, Dietmar T1 - Comparison of low temperature properties of different elastomer materials investigated by a new method for compression set measurement N2 - The method for the determination of compression set values with a Dynamic Mechanical Analysis (DMA) setup at low temperatures, which was presented previously, allows a much faster and readily automated procedure than the standardized compression set test according to ISO 815-2. This method is applied to a series of different elastomeric materials that are commonly used for sealing applications. The results of the compression set test are compared with results from thermal analysis to allow an in depth comparison of the material behaviour at low temperatures. Furthermore, a comparison between two EPDM materials is presented. These materials show very similar properties determined by thermo analytical methods such as Differential Scanning Calorimetry (DSC) and Dynamic Mechanical Analysis (DMA) but differ clearly in their compression set behaviour. This comparison shows the importance and value of information of the compression set test in addition to thermal analysis to judge the behaviour of sealing materials and confirms the relevance of the new compression set test method for the investigation of low temperature properties of elastomers. KW - Sealing material KW - Elastomer KW - Compression set KW - Dynamic mechanical analysis KW - Low temperature behaviour PY - 2012 DO - https://doi.org/10.1016/j.polymertesting.2012.07.016 SN - 0142-9418 VL - 31 IS - 8 SP - 987 EP - 992 PB - Elsevier Science CY - Amsterdam [u.a.] AN - OPUS4-26538 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Jaunich, Matthias A1 - Wolff, Dietmar A1 - Stark, Wolfgang T1 - Low temperature properties of rubber seals - results of component tests T2 - 10th Fall rubber colloquium CY - Hannover, Germany DA - 2012-11-07 PY - 2012 SN - 978-3-9814076-1-7 IS - khk2012_jaunich.pdf SP - 1 EP - 8 AN - OPUS4-26995 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Trappe, Volker A1 - Günzel, Stephan A1 - Jaunich, Matthias T1 - Correlation between crack propagation rate and cure process of epoxy resins N2 - Fracture mechanics approaches are increasingly applied for the characterization of epoxy resin and adhesive mechanical properties. Therefore, the fracture toughness and crack resistance under static load ISO 13586 are often regarded as state of the art to analyse material improvements. However, experimental investigations on fatigue behaviour, thus the crack propagation according to ISO 15850, seem to be much more sensitive to characterize the materials for in service loading conditions. Firstly, an efficient testing concept was developed at BAM. In this framework, the geometry for a modified single edge notched tensile specimen (SET) was developed in order to assure appropriate resolution in measuring the crack length via a CCD-camera. In the next step, the influence of the cure temperature on the fracture-mechanical properties was investigated. KW - Fracture toughness KW - Crack resistance KW - Fracture mechanics KW - Plastics KW - Crack propagation PY - 2012 DO - https://doi.org/10.1016/j.polymertesting.2012.03.007 SN - 0142-9418 VL - 31 IS - 5 SP - 654 EP - 659 PB - Elsevier Science CY - Amsterdam [u.a.] AN - OPUS4-26937 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Jaunich, Matthias T1 - Low Temperature - For a seal this depends on the applied material T2 - Deutsche Kautschuk-Tagung 2012 CY - Nuremberg, Germany DA - 2012-07-02 PY - 2012 AN - OPUS4-24421 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Jaunich, Matthias A1 - Stark, Wolfgang A1 - Wolff, Dietmar T1 - Low temperature - For a seal this depends on the applied material T2 - DKT 2012 - German Rubber Conference CY - Nuremberg, Germany DA - 2012-07-02 PY - 2012 IS - 10-2330_5-L-1530 SP - 1 EP - 4 PB - Deutsche Kautschuk-Gesellschaft CY - Frankfurt am Main AN - OPUS4-26190 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -