TY - CONF A1 - Silbernagl, Dorothee A1 - Szymoniak, Paulina A1 - Tavasolyzadeh, Zeynab A1 - Sturm, Heinz A1 - Topolniak, Ievgeniia T1 - Interpenetrating Polymer Networks with Tuned Thermal and Mechanical Properties by Multiphoton Lithography N2 - Multiphoton lithography (MPL) has recently attracted significant research interest as a versatile tool capable of fabricating 2D and 3D micro- and nanoscopic features with high spatial resolution. The integrity of MPL microstructures, or their ability to respond to external stimuli, is of critical importance. Often, the mechanically flexible micro-objects are expected to be capable of shape morphing, bending, or other motion to ensure their functionality. However, achieving the desired properties of MPL-manufactured micro components for a specific application still remains challenging. In this work, we present new MPL materials based on epoxy-acrylate interpenetrating networks (IPNs). We aim at fabrication 3D microstructures, whose properties can be easily tuned by varying the ratio of the IPN components and fabrication parameters. The studied mixtures consist of polyethylene glycol diacrylate (PEGDA) and cycloaliphatic epoxide functional groups. Consequently, tryarylsylfonium salt and cyclopentanone photoinitiator tailored for MPL were used to ensure cationic and radical polymerization, respectively. The resulting library of 3D microstructures was investigated for their thermal and mechanical properties using highly sensitive space-resolved methods. For the first time, we were able to evaluate the glass transition behavior of 3D MPL microstructures using fast scanning calorimetry. The influence of both IPN composition and fabrication parameters on glass transition temperature and material fragility was demonstrated. AFM force-distance curve and intermodulation methods were used to characterize the micromechanical properties with lateral resolution of the techniques in the range of 1 micron and 4 nm, respectively. The elastic-plastic behavior of the microarchitectures was evaluated and explained in terms of IPN morphology and thermal properties. The fabricated 3D IPN microstructures exhibit higher structural strength and integrity compared to PEGDA. In addition, IPNs exhibit high to full elastic recovery (up to 100%) with bulk modulus in the range of 4 to 6 MPa. This makes IPNs a good base material for modeling microstructures with intricate 3D designs for biomimetics and scaffold engineering. The effects of composition and MPL microfabrication parameters on the resulting IPN properties give us a better understanding of the underlying mechanisms and microfabrication-structure-property relationships. Moreover, our funding supports the further development of IPN systems as versatile and easily tunable MPL materials. T2 - Material Research Society Meeting CY - Boston, Massachusetts, USA DA - 26.11.2023 KW - Multiphoton Lithography KW - Two-photon polymerisatio KW - Interpenetrating polymer network PY - 2023 SP - 1 AN - OPUS4-59382 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Silbernagl, Dorothee A1 - Szymoniak, Paulina A1 - Tavasolyzadeh, Zeynab A1 - Sturm, Heinz A1 - Topolniak, Ievgeniia T1 - Interpenetrating networks with tuned thermal and mechanical properties N2 - Text Multiphoton lithography (MPL) has recently attracted significant research interest as a versatile tool capable of producing 2D and 3D micro- and nanoscopic features with high spatial resolution. The integrity of MPL microstructures, or their ability to respond to external stimuli, is of critical importance. However, achieving the desired properties of fabricated microcomponents for a specific application remains a challenge. In this work, we present new MPL materials based on epoxy-acrylate interpenetrating networks (IPNs). We aim at 3D microstructures, whose properties can be easily tuned by varying the ratio of the IPN components and fabrication parameters (Figure 1). The resulting library of 3D microstructures was investigated for their thermal and mechanical properties using highly-sensitive space-resolved methods. Flash scanning calorimetry revealed the influence of both, IPN composition and fabrication parameters, on glass transition temperature and material fragility. AFM force-distance curve and intermodulation methods were used to characterize the mechanical properties with a lateral resolution of 1 micron and 4 nm, respectively. The deformation, stiffness and elastic behavior are discussed in detail in relation to the morphology. Moreover, we found that some 3D IPN microstructures exhibit fully elastic behavior. Our funding encourages the further development of IPN systems as versatile and easily tunable MPL materials. T2 - Micro Nano Engineering (MNE conference) CY - Berlin, Germany DA - 25.09.2023 KW - Interpenetrating polymer network KW - Multiphoton Lithography KW - Two photon polymerisation KW - Direct laser writing KW - Polyethylene glycol diacrylate PY - 2023 AN - OPUS4-58879 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -