TY - CONF A1 - Silbernagl, Dorothee A1 - Szymoniak, Paulina A1 - Tavasolyzadeh, Zeynab A1 - Sturm, Heinz A1 - Topolniak, Ievgeniia T1 - Interpenetrating networks with tuned thermal and mechanical properties N2 - Text Multiphoton lithography (MPL) has recently attracted significant research interest as a versatile tool capable of producing 2D and 3D micro- and nanoscopic features with high spatial resolution. The integrity of MPL microstructures, or their ability to respond to external stimuli, is of critical importance. However, achieving the desired properties of fabricated microcomponents for a specific application remains a challenge. In this work, we present new MPL materials based on epoxy-acrylate interpenetrating networks (IPNs). We aim at 3D microstructures, whose properties can be easily tuned by varying the ratio of the IPN components and fabrication parameters (Figure 1). The resulting library of 3D microstructures was investigated for their thermal and mechanical properties using highly-sensitive space-resolved methods. Flash scanning calorimetry revealed the influence of both, IPN composition and fabrication parameters, on glass transition temperature and material fragility. AFM force-distance curve and intermodulation methods were used to characterize the mechanical properties with a lateral resolution of 1 micron and 4 nm, respectively. The deformation, stiffness and elastic behavior are discussed in detail in relation to the morphology. Moreover, we found that some 3D IPN microstructures exhibit fully elastic behavior. Our funding encourages the further development of IPN systems as versatile and easily tunable MPL materials. T2 - Micro Nano Engineering (MNE conference) CY - Berlin, Germany DA - 25.09.2023 KW - Interpenetrating polymer network KW - Multiphoton Lithography KW - Two photon polymerisation KW - Direct laser writing KW - Polyethylene glycol diacrylate PY - 2023 AN - OPUS4-58879 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -