TY - JOUR A1 - Ghasem Zadeh Khorasani, Media A1 - Silbernagl, Dorothee A1 - Szymoniak, Paulina A1 - Hodoroaba, Vasile-Dan A1 - Sturm, Heinz T1 - The effect of boehmite nanoparticles (gamma‐AlOOH) on nanomechanical and thermomechanical properties correlated to crosslinking density of epoxy N2 - We show that complex physical and chemical interactions between boehmite nanoparticles and epoxy drastically affect matrix properties, which in the future will provide tuning of material properties for further optimization in applications from automotive to aerospace. We utilize intermodulation atomic force microscopy (ImAFM) for probing local stiffness of both particles and polymer matrix. Stiff particles are expected to increase total stiffness of nanocomposites and the stiffness of polymer should remain unchanged. However, ImAFM revealed that stiffness of matrix in epoxy/boehmite nanocomposite is significantly higher than unfilled epoxy. The stiffening effect of the boehmite on epoxy also depends on the particle concentration. To understand the mechanism behind property alteration induced by boehmite nanoparticles, network architecture is investigated using dynamic mechanical thermal analysis (DMTA). It was revealed that although with 15 wt% boehmite nanoparticles the modulus at glassy state increases, crosslinking density of epoxy for this composition is drastically low. KW - Crosslinking density KW - Epoxy KW - Intermodulation KW - Atomic force microscopy KW - Nanomechanical properties KW - Boehmite nanoparticles PY - 2019 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-476050 DO - https://doi.org/10.1016/j.polymer.2018.12.054 SN - 0032-3861 SN - 1873-2291 VL - 164 SP - 174 EP - 182 PB - Elsevier AN - OPUS4-47605 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Silbernagl, Dorothee A1 - Szymoniak, Paulina A1 - Tavasolyzadeh, Zeynab A1 - Sturm, Heinz A1 - Topolniak, Ievgeniia T1 - Interpenetrating Polymer Networks with Tuned Thermal and Mechanical Properties by Multiphoton Lithography N2 - Multiphoton lithography (MPL) has recently attracted significant research interest as a versatile tool capable of fabricating 2D and 3D micro- and nanoscopic features with high spatial resolution. The integrity of MPL microstructures, or their ability to respond to external stimuli, is of critical importance. Often, the mechanically flexible micro-objects are expected to be capable of shape morphing, bending, or other motion to ensure their functionality. However, achieving the desired properties of MPL-manufactured micro components for a specific application still remains challenging. In this work, we present new MPL materials based on epoxy-acrylate interpenetrating networks (IPNs). We aim at fabrication 3D microstructures, whose properties can be easily tuned by varying the ratio of the IPN components and fabrication parameters. The studied mixtures consist of polyethylene glycol diacrylate (PEGDA) and cycloaliphatic epoxide functional groups. Consequently, tryarylsylfonium salt and cyclopentanone photoinitiator tailored for MPL were used to ensure cationic and radical polymerization, respectively. The resulting library of 3D microstructures was investigated for their thermal and mechanical properties using highly sensitive space-resolved methods. For the first time, we were able to evaluate the glass transition behavior of 3D MPL microstructures using fast scanning calorimetry. The influence of both IPN composition and fabrication parameters on glass transition temperature and material fragility was demonstrated. AFM force-distance curve and intermodulation methods were used to characterize the micromechanical properties with lateral resolution of the techniques in the range of 1 micron and 4 nm, respectively. The elastic-plastic behavior of the microarchitectures was evaluated and explained in terms of IPN morphology and thermal properties. The fabricated 3D IPN microstructures exhibit higher structural strength and integrity compared to PEGDA. In addition, IPNs exhibit high to full elastic recovery (up to 100%) with bulk modulus in the range of 4 to 6 MPa. This makes IPNs a good base material for modeling microstructures with intricate 3D designs for biomimetics and scaffold engineering. The effects of composition and MPL microfabrication parameters on the resulting IPN properties give us a better understanding of the underlying mechanisms and microfabrication-structure-property relationships. Moreover, our funding supports the further development of IPN systems as versatile and easily tunable MPL materials. T2 - Material Research Society Meeting CY - Boston, Massachusetts, USA DA - 26.11.2023 KW - Multiphoton Lithography KW - Two-photon polymerisatio KW - Interpenetrating polymer network PY - 2023 SP - 1 AN - OPUS4-59382 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Silbernagl, Dorothee A1 - Szymoniak, Paulina A1 - Tavasolyzadeh, Zeynab A1 - Sturm, Heinz A1 - Topolniak, Ievgeniia T1 - Interpenetrating networks with tuned thermal and mechanical properties N2 - Multiphoton lithography (MPL), an emerging microfabrication technique, shows great potential in a variety of applications ranging from tissue engineering to soft micro-robotics. Fabricated micro-objects often are expected to undergo shape morphing or bending. Furthermore, ensuring precise property tuning becomes detrimental for the functionality of MPL microstructures. Herein, we present novel MPL materials based on interpenetrating networks (IPNs), which effectively combine the advantages of acrylate and epoxy thermoset systems. A library of 3D MPL IPN microstructures with high 3D structural stability and tailored thermal and micromechanical properties is achieved. MPL laser velocity and fabrication power can be used to tune the morphology and therefore properties of IPN. New IPN microstructures with materials Young's moduli of 4 to 6 MPa demonstrate susceptibility to deformation with high to fully elastic response. Such soft elastic materials hold immense promise within morphable microsystems, soft micro-robotics and cell engineering applications. T2 - RSC Poster conference CY - Online meeting DA - 05.03.2024 KW - Multiphoton lithography KW - Interpenetrating polymer networks KW - AFM PY - 2024 AN - OPUS4-60060 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Waniek, Tassilo A1 - Omar, Hassan A1 - Szymoniak, Paulina A1 - Silbernagl, Dorothee A1 - Sturm, Heinz T1 - The influence of water released from particles in epoxy‐based nanocomposites N2 - AbstractRecent studies have hypothesized that the reinforcing effects of boehmite nanoparticles (BNPs) in polymer nanocomposites (PNCs) are partly related to the particles themselves and partly to the water released from the BNP during curing. In this work, PNCs made from dried BNP (dBNP) with concentrations up to 15 wt% are investigated to differentiate particle and water related effects. The observed trend of the storage modulus in dynamic mechanical thermal analysis measurements was found to be independent of the drying procedure. Stiffness maps from intermodulation atomic force microscopy showed that dBNP leads to a stiffening of the interphase surrounding the particles compared with the unaffected epoxy matrix, while a softer interphase was reported for PNCs with as received BNP. A slight decrease in the glass transition temperature was observed by broadband dielectric spectroscopy related to a lowered crosslink density due to the particles. A significantly higher decrease was reported for PNCs with BNP, attributed to water influencing the curing process. In conclusion, the stiffening of PNC with BNP is related to the particles themselves, while the release of water causes the formation of a soft interphase in the vicinity of the particles and a significant decrease in crosslink density. KW - AFM stiffness of interface KW - Aluminium oxide hydroxide KW - Boehmit nanoparticle KW - Glass transition temperature KW - Broadband dielectric spectroscopy KW - Crosslink density control KW - Structure–property relationship KW - Nanocomposites KW - Thermoset PY - 2024 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-606772 DO - https://doi.org/10.1002/app.55937 SN - 0021-8995 SP - 1 EP - 16 PB - Wiley AN - OPUS4-60677 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Silbernagl, Dorothee A1 - Szymoniak, Paulina A1 - Tavasolyzadeh, Zeynab A1 - Sturm, Heinz A1 - Topolniak, Ievgeniia T1 - Interpenetrating networks with tuned thermal and mechanical properties N2 - Text Multiphoton lithography (MPL) has recently attracted significant research interest as a versatile tool capable of producing 2D and 3D micro- and nanoscopic features with high spatial resolution. The integrity of MPL microstructures, or their ability to respond to external stimuli, is of critical importance. However, achieving the desired properties of fabricated microcomponents for a specific application remains a challenge. In this work, we present new MPL materials based on epoxy-acrylate interpenetrating networks (IPNs). We aim at 3D microstructures, whose properties can be easily tuned by varying the ratio of the IPN components and fabrication parameters (Figure 1). The resulting library of 3D microstructures was investigated for their thermal and mechanical properties using highly-sensitive space-resolved methods. Flash scanning calorimetry revealed the influence of both, IPN composition and fabrication parameters, on glass transition temperature and material fragility. AFM force-distance curve and intermodulation methods were used to characterize the mechanical properties with a lateral resolution of 1 micron and 4 nm, respectively. The deformation, stiffness and elastic behavior are discussed in detail in relation to the morphology. Moreover, we found that some 3D IPN microstructures exhibit fully elastic behavior. Our funding encourages the further development of IPN systems as versatile and easily tunable MPL materials. T2 - Micro Nano Engineering (MNE conference) CY - Berlin, Germany DA - 25.09.2023 KW - Interpenetrating polymer network KW - Multiphoton Lithography KW - Two photon polymerisation KW - Direct laser writing KW - Polyethylene glycol diacrylate PY - 2023 AN - OPUS4-58879 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Silbernagl, Dorothee A1 - Szymoniak, Paulina A1 - Tavasolyzadeh, Zeynab A1 - Sturm, Heinz A1 - Topolniak, Ievgeniia T1 - Multiphoton lithography of interpenetrating polymer networks for tailored microstructure thermal and micromechanical properties N2 - Multiphoton lithography (MPL), an emerging truly 3D microfabrication technique, exhibits substantial potential in biomedical applications, including drug delivery and tissue engineering. Fabricated micro-objects are often expected to undergo shape morphing or bending of the entire structure or its parts. Furthermore, ensuring precise property tuning is detrimental to the realization of the functionality of MPL microstructures. Herein, novel MPL materials based on interpenetrating polymer networks (IPNs) are presented that effectively combine the advantages of acrylate and epoxy systems. IPNs with varying component ratios are investigated for their microfabrication performance and structural integrity with respect to thermal and micromechanical properties. A variety of high-resolution techniques is applied to comprehensively evaluate IPN properties at the bulk, micron, and segmental levels. This study shows that the MPL laser scanning velocity and power, photoinitiator content, and multi-step exposure can be used to tune the morphology and properties of the IPN. As a result, a library of 3D MPL IPN microstructures with high 3D structural stability and tailored thermal and micromechanical properties is achieved. New IPN microstructures with Young’s moduli of 3–4 MPa demonstrate high-to-fully elastic responses to deformations, making them promising for applications in morphable microsystems, soft micro-robotics, and cell engineering. KW - Interpenetrating polymer network KW - Multiphoton lithography KW - Atomic force microscopy KW - Intermodulation AFM KW - Fast scanning calorimetry PY - 2024 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-600593 DO - https://doi.org/10.1002/smll.202310580 SN - 1613-6810 SP - 1 EP - 12 PB - Wiley-VCH CY - Weinheim AN - OPUS4-60059 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -