TY - JOUR A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schiller, Wolfgang Arno T1 - Flip-Chip-Lotbumps thermisch-zyklisch belastet - Einfluß des Substratmaterials auf das viskoplastische Verhalten von Flip-Chip-Lotbumps PY - 1998 SN - 0025-5300 VL - 40 IS - 9 SP - 350 EP - 352 PB - Carl Hanser Verlag CY - München AN - OPUS4-33715 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schiller, Wolfgang Arno T1 - Numerical investigation on the influence of different substrate materials on the viscoplastic behaviour of flip chip solder bumps N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a flip chip under thermocyclic loading between -55°C (-67°F) and 125°C (257°F). In order to simulate realistically the inelastic material response of the solder bump, Chaboche's viscoplastic material model instead of a classical ORNL-theory was implemented into the finite element code ABAQUS and applied to a flip chip configuration. This so-called unified constitutive model is able to describe the Bauschinger effect as well as the creep/plasticity interaction. Herewith the influence of the substrate material on the inelastic deformation behaviour of a tin-lead solder bump was analysed. A comparison is given with respect to the influence of the two substrate materials namely Al2O3 and our self-developed Low Temperature Co-fired Ceramics (LTCC) on the inelastic response of the Sn60Pb40 eutectic solder material. It may be shown that the thermoelastic behaviour of the LTCC substrate significantly reduces the cyclic stresses in the bump compared to Al2O3 as well as the cumulative inelastic strain which is responsible for the development of damage and hence flip chip failure T2 - International symposium on advanced packaging materials 2000 CY - Braselton, Georgia, USA DA - 06.03.2000 PY - 2000 SN - 0-930815-59-9 DO - https://doi.org/10.1109/ISAPM.2000.869253 SP - 112 EP - 117 AN - OPUS4-33716 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno T1 - Simulation der thermo-mechanischen Belastung eines Chipaufbaus während des Thermo-Kompressions-Bondens unter bruchmechanischen Aspekten T2 - 27. Vortragsveranstaltung des DVM-Arbeitskreises Bruchvorgänge PY - 1995 SN - 0943-3473 SP - 321 EP - 334 AN - OPUS4-34622 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Klingbeil, Dietmar A1 - Schicker, Johannes T1 - Die Berechnung dynamischer JR-Kurven aus der FE-Simulation des Kerbschlagbiegeversuchs unter Einbeziehung eines geschwindigkeitsabhängigen Schädigungsmodells T2 - 29. Tagung des DVM-Arbeitskreises Bruchvorgänge CY - Stuttgart, Germany DA - 1997-02-25 PY - 1997 N1 - Serientitel: DVM-Bericht – Series title: DVM-Bericht IS - 229 SP - 325 EP - 334 PB - DVM CY - Berlin AN - OPUS4-34624 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer T1 - Numerical analysis of an electronic structure bearing deep cracks N2 - The successive fatigue failure process, i.e. crack initiation and growth up to electrical failure, has been investigated for a flip chip configuration. A cracked and uncracked solder bump was analysed using an unified viscoplastic constitutive model (Chaboche). The electrical failure of a bump seems to be reached in general not before a deep crack has grown into the bump. In order to update the actual loading situation two different cracked structures were calculated. T2 - MicroMat 2000 - 3rd International conference and poster exhibition Micro Materials CY - Berlin, Germany DA - 17.04.2000 PY - 2000 SN - 3-932434-15-3 SP - 582 EP - 585 AN - OPUS4-33827 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Klingbeil, Dietmar A1 - Schicker, Johannes T1 - The calculation of dynamic JR-curves from finite element analysis of a Charpy test using a rate-dependent damage model T2 - GJS 97 - German-Japanese seminar CY - Stuttgart, Germany DA - 1997-09-29 PY - 1997 SN - 0029-5493 SP - 75 EP - 87 AN - OPUS4-33828 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schubert, A. ED - Winkler, T. ED - Schubert, A. T1 - On the influence of two different underfill materials on the inelastic thermo-cyclic response of a flip-chip solder bump N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a solder bump configuration on Al2O3 substrate under thermo-cyclic loading between -55 °C and 125 °C. Chaboche's viscoplastic material model was used to describe the Bauschinger effect and the creep/plasticity interaction for the tin-lead solder material. The influence of two different viscoelastic underfill materials (Epoxy+50 % SiO2, Epoxy+70 % SiO2) on the inelastic deformation of the tin-lead solder was analyzed and compared. It may be shown that the thermally matched 'hard' underfiller (Epoxy+70 % SiO2) significantly reduces the accumulated inelastic strain in the bump compared to 'soft' underfiller or no underfill material. On the other hand, the maximum lateral normal stress will increase slightly. PY - 2015 SP - 471 EP - 480 AN - OPUS4-33859 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Klein, Ulrich A1 - Zunkel, Astrid A1 - Eberle, Arno T1 - Breakdown of heat exchangers due to erosion corrosion and fretting caused by inappropriate operating conditions N2 - Damage analyses on two heat exchanger units showed that in both cases inappropriate flow conditions of media caused very different failure mechanisms that resulted in irreparable damage. The first incident was the breakdown of an unalloyed steel condenser, which operated in a coal-fired power plant. A considerably high number of tubes successively leaked. Metallography identified lines of segregation in the microstructure of the tube walls, thus, giving evidence that both uniform corrosion and erosion corrosion caused by low-pressure wet steam were the root cause. The second incident was the breakdown of a recuperator made from chromium–nickel steel due to mechanical damage to tubes and baffle. This unit operated as part of a pilot plant to regain heat from the drying process of sewage sludge. It turned out that soiled vapour caused clogging of the cross-sectional area and therefore accelerating the flow velocity of the vapour. This inappropriate operating condition caused the tubes to oscillate so severely that they even banged together. Abrasive wear especially at the intersection through the holes of the baffle damaged the tubes and the whole unit irreparably. KW - Corrosion KW - Condenser KW - Recuperator KW - Soiled media KW - Leakage of tubes PY - 2014 DO - https://doi.org/10.1016/j.engfailanal.2014.03.019 SN - 1350-6307 SN - 1873-1961 VL - 43 IS - Special Issue 'A Tribute to Prof. A. Martens' SP - 271 EP - 280 PB - Elsevier Science Publ. CY - Oxford AN - OPUS4-31597 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno T1 - Numerical Investigation on the Influence of Different Substrate Materials on the Viscoplastic Behaviour of Flip Chip Solder Bumps T2 - International Symposium and Exhibition on Advanced Packaging Materials CY - Braselton, Georgia (USA) DA - 2000-03-06 PY - 2000 AN - OPUS4-32605 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno T1 - Verifizierung von Flip Chip Demonstratoren unter Verwendung belastbarer Materialkennwerte T2 - Öffentliches Statusseminar zum Abschluss des Projektes: Werkstoffdatenbank für die Simulation mikroelektronischer Komponenten (SimiKo) CY - München DA - 2000-09-29 PY - 2000 AN - OPUS4-32606 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -