TY - JOUR
A1 - Eberle, Arno
A1 - Sievert, Rainer
A1 - Schiller, Wolfgang Arno
T1 - Flip-Chip-Lotbumps thermisch-zyklisch belastet - Einfluß des Substratmaterials auf das viskoplastische Verhalten von Flip-Chip-Lotbumps
PY - 1998
SN - 0025-5300
VL - 40
IS - 9
SP - 350
EP - 352
PB - Carl Hanser Verlag
CY - München
AN - OPUS4-33715
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
A1 - Schiller, Wolfgang Arno
T1 - Numerical investigation on the influence of different substrate materials on the viscoplastic behaviour of flip chip solder bumps
N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a flip chip under thermocyclic loading between -55°C (-67°F) and 125°C (257°F). In order to simulate realistically the inelastic material response of the solder bump, Chaboche's viscoplastic material model instead of a classical ORNL-theory was implemented into the finite element code ABAQUS and applied to a flip chip configuration. This so-called unified constitutive model is able to describe the Bauschinger effect as well as the creep/plasticity interaction. Herewith the influence of the substrate material on the inelastic deformation behaviour of a tin-lead solder bump was analysed. A comparison is given with respect to the influence of the two substrate materials namely Al2O3 and our self-developed Low Temperature Co-fired Ceramics (LTCC) on the inelastic response of the Sn60Pb40 eutectic solder material. It may be shown that the thermoelastic behaviour of the LTCC substrate significantly reduces the cyclic stresses in the bump compared to Al2O3 as well as the cumulative inelastic strain which is responsible for the development of damage and hence flip chip failure
T2 - International symposium on advanced packaging materials 2000
CY - Braselton, Georgia, USA
DA - 06.03.2000
PY - 2000
SN - 0-930815-59-9
DO - https://doi.org/10.1109/ISAPM.2000.869253
SP - 112
EP - 117
AN - OPUS4-33716
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
T1 - Simulation der thermo-mechanischen Belastung eines Chipaufbaus während des Thermo-Kompressions-Bondens unter bruchmechanischen Aspekten
T2 - 27. Vortragsveranstaltung des DVM-Arbeitskreises Bruchvorgänge
PY - 1995
SN - 0943-3473
SP - 321
EP - 334
AN - OPUS4-34622
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Klingbeil, Dietmar
A1 - Schicker, Johannes
T1 - Die Berechnung dynamischer JR-Kurven aus der FE-Simulation des Kerbschlagbiegeversuchs unter Einbeziehung eines geschwindigkeitsabhängigen Schädigungsmodells
T2 - 29. Tagung des DVM-Arbeitskreises Bruchvorgänge
CY - Stuttgart, Germany
DA - 1997-02-25
PY - 1997
N1 - Serientitel: DVM-Bericht – Series title: DVM-Bericht
IS - 229
SP - 325
EP - 334
PB - DVM
CY - Berlin
AN - OPUS4-34624
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
T1 - Numerical analysis of an electronic structure bearing deep cracks
N2 - The successive fatigue failure process, i.e. crack initiation and growth up to electrical failure, has been investigated for a flip chip configuration. A cracked and uncracked solder bump was analysed using an unified viscoplastic constitutive model (Chaboche). The electrical failure of a bump seems to be reached in general not before a deep crack has grown into the bump. In order to update the actual loading situation two different cracked structures were calculated.
T2 - MicroMat 2000 - 3rd International conference and poster exhibition Micro Materials
CY - Berlin, Germany
DA - 17.04.2000
PY - 2000
SN - 3-932434-15-3
SP - 582
EP - 585
AN - OPUS4-33827
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Klingbeil, Dietmar
A1 - Schicker, Johannes
T1 - The calculation of dynamic JR-curves from finite element analysis of a Charpy test using a rate-dependent damage model
T2 - GJS 97 - German-Japanese seminar
CY - Stuttgart, Germany
DA - 1997-09-29
PY - 1997
SN - 0029-5493
SP - 75
EP - 87
AN - OPUS4-33828
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
A1 - Schubert, A.
ED - Winkler, T.
ED - Schubert, A.
T1 - On the influence of two different underfill materials on the inelastic thermo-cyclic response of a flip-chip solder bump
N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a solder bump configuration on Al2O3 substrate under thermo-cyclic loading between -55 °C and 125 °C. Chaboche's viscoplastic material model was used to describe the Bauschinger effect and the creep/plasticity interaction for the tin-lead solder material. The influence of two different viscoelastic underfill materials (Epoxy+50 % SiO2, Epoxy+70 % SiO2) on the inelastic deformation of the tin-lead solder was analyzed and compared. It may be shown that the thermally matched 'hard' underfiller (Epoxy+70 % SiO2) significantly reduces the accumulated inelastic strain in the bump compared to 'soft' underfiller or no underfill material. On the other hand, the maximum lateral normal stress will increase slightly.
PY - 2015
SP - 471
EP - 480
AN - OPUS4-33859
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - JOUR
A1 - Klein, Ulrich
A1 - Zunkel, Astrid
A1 - Eberle, Arno
T1 - Breakdown of heat exchangers due to erosion corrosion and fretting caused by inappropriate operating conditions
N2 - Damage analyses on two heat exchanger units showed that in both cases inappropriate flow conditions of media caused very different failure mechanisms that resulted in irreparable damage. The first incident was the breakdown of an unalloyed steel condenser, which operated in a coal-fired power plant. A considerably high number of tubes successively leaked. Metallography identified lines of segregation in the microstructure of the tube walls, thus, giving evidence that both uniform corrosion and erosion corrosion caused by low-pressure wet steam were the root cause. The second incident was the breakdown of a recuperator made from chromium–nickel steel due to mechanical damage to tubes and baffle. This unit operated as part of a pilot plant to regain heat from the drying process of sewage sludge. It turned out that soiled vapour caused clogging of the cross-sectional area and therefore accelerating the flow velocity of the vapour. This inappropriate operating condition caused the tubes to oscillate so severely that they even banged together. Abrasive wear especially at the intersection through the holes of the baffle damaged the tubes and the whole unit irreparably.
KW - Corrosion
KW - Condenser
KW - Recuperator
KW - Soiled media
KW - Leakage of tubes
PY - 2014
DO - https://doi.org/10.1016/j.engfailanal.2014.03.019
SN - 1350-6307
SN - 1873-1961
VL - 43
IS - Special Issue 'A Tribute to Prof. A. Martens'
SP - 271
EP - 280
PB - Elsevier Science Publ.
CY - Oxford
AN - OPUS4-31597
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
T1 - Numerical Investigation on the Influence of Different Substrate Materials on the Viscoplastic Behaviour of Flip Chip Solder Bumps
T2 - International Symposium and Exhibition on Advanced Packaging Materials
CY - Braselton, Georgia (USA)
DA - 2000-03-06
PY - 2000
AN - OPUS4-32605
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
T1 - Verifizierung von Flip Chip Demonstratoren unter Verwendung belastbarer Materialkennwerte
T2 - Öffentliches Statusseminar zum Abschluss des Projektes: Werkstoffdatenbank für die Simulation mikroelektronischer Komponenten (SimiKo)
CY - München
DA - 2000-09-29
PY - 2000
AN - OPUS4-32606
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -