TY - JOUR A1 - Hempel, M. A1 - Tomm, J.W. A1 - Ziegler, Mathias A1 - Elsaesser, T. A1 - Michel, N. A1 - Krakowski, M. T1 - Catastrophic optical damage at front and rear facets of diode lasers JF - Applied physics letters N2 - Single-pulse tests of the catastrophic optical damage (COD) are performed for three batches of diode lasers with different gain-regions. The tests involve in situ inspection of front, rear, and side of the devices by a thermocamera. Devices with an Al-containing gain-region show COD at the front facet, as expected for strong facet heating via surface recombination and reabsorption of laser light. In contrast, Al-free devices with low surface recombination rates tend to fail at the rear facet, pointing to a different heating scenario. The high carrier density at the rear facet favors heating and COD via Auger recombination processes. KW - Thermography KW - Catastrophic optical damage KW - High power diode lasers KW - Destructive testing KW - Non-destructive testing KW - Auger effect KW - Carrier density KW - Heating KW - Laser beam effects KW - Optical testing KW - Semiconductor lasers KW - Surface recombination PY - 2010 DO - https://doi.org/10.1063/1.3524235 SN - 0003-6951 SN - 1077-3118 VL - 97 IS - 23 SP - 231101-1 - 231101-3 PB - American Institute of Physics CY - Melville, NY AN - OPUS4-22763 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Tomm, J.W. A1 - Ziegler, Mathias A1 - Hempel, M. A1 - Elsaesser, T. T1 - Mechanisms and fast kinetics of the catastrophic optical damage (COD) in GaAs-based diode lasers JF - Laser & photonics reviews N2 - COD diagram determined for a batch of broad-area AlGaAs diode lasers. The time to COD within a single current pulse is plotted versus the actual average optical power in the moment when the COD takes place. Full circles stand for clearly identified COD events (right ordinate), whereas open circles (left ordinate) represent the pulse duration in experiments, where no COD has been detected. A borderline (gray) exists between two regions, i. e., parameter sets, of presence (orange) and absence of COD (blue). This borderline is somewhat blurred because of the randomness in filamentation of the laser nearfield and scatter in properties of the involved individual devices. KW - Semiconductor laser KW - Thermography KW - Catastrophic optical damage KW - High-power diode lasers KW - Destructive testing KW - Non-destructive testing PY - 2011 DO - https://doi.org/10.1002/lpor.201000023 SN - 1863-8880 VL - 5 IS - 3 SP - 422 EP - 441 PB - Wiley-VCH CY - Weinheim AN - OPUS4-23624 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Hempel, M. A1 - Ziegler, Mathias A1 - Schwirzke-Schaaf, S. A1 - Tomm, J.W. A1 - Jankowski, D. A1 - Schröder, D. T1 - Spectroscopic analysis of packaging concepts for high-power diode laser bars JF - Applied physics A N2 - Double-side cooled high-power diode laser bars packaged by different techniques on different types of passive heat sinks are analyzed in terms of packaging-induced strain. Reference data from standard devices being single-side cooled only and packaged by conventional soft and hard soldering are also presented. Thermal profiling across the devices complements the results. The most suitable packaging architecture and technique for double-side cooled bars is identified. Measurements of the laser emission near field and electroluminescence pattern provide direct reference to the functionality of the devices. Furthermore, a type of cross calibration of the methods used for strain analysis is made, since all techniques are applied to the same set of bars. This involves micro photoluminescence, micro Raman, and degree-of-polarization electroluminescence spectroscopy. KW - Spectroscopy KW - Semiconductor laser KW - Thermography KW - High-power diode lasers KW - Non-destructive testing PY - 2012 DO - https://doi.org/10.1007/s00339-012-6799-4 SN - 0947-8396 VL - 107 IS - 2 SP - 371 EP - 377 PB - Springer CY - Berlin AN - OPUS4-25789 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Myrach, Philipp A1 - Jonietz, Florian A1 - Meinel, Dietmar A1 - Suwala, Hubert A1 - Ziegler, Mathias T1 - Calibration of thermographic spot weld testing with X-ray computed tomography JF - Quantative InfraRed Thermography Journal N2 - The paper presents an attempt for the calibration of an active thermography method that is suitable for the non-destructive evaluation of spot welds. Nowadays, the quality of spot welds is commonly characterised by the application of random chisel tests, which are time consuming, expensive and destructive. Recently a non-destructive testing method by means of active thermography was proposed that relies on the fact that the mechanical connection formed by the spot weld also serves as a thermal bridge between the two steel sheets joined in the welding process. It is shown in this paper that this thermal bridge can be thermographically characterised by extracting a measure for the spot weld diameter and hence the quality of the spot weld. The determination of the absolute value of the diameter hereby relies on a calibration of the testing system, which is performed by means of X-ray computed tomography in this study. The experiments were carried out using different experimental approaches, namely transmission as well as reflection geometry wSetup in reflectionith laser illumination. A comprehensive evaluation of samples produced using different welding currents, hence different quality, was carried out in order to validate the thermographic results. KW - Thermography KW - Spot welds KW - Spot welding KW - Computed thomography KW - Non-destructive testing PY - 2017 DO - https://doi.org/10.1080/17686733.2017.1281554 SN - 1768-6733 SN - 2116-7176 VL - 14 IS - 1 SP - 122 EP - 131 PB - Taylor & Francis CY - London AN - OPUS4-40180 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Puthiyaveettil, N. A1 - Thomas, K. R. A1 - Myrach, Philipp A1 - Ziegler, Mathias A1 - Rajagopal, P. A1 - Balasubramaniamam, K. T1 - Defect detection in steel bars up to 600 °C using laser line thermography JF - Infrared Physics & Technology N2 - Crack detection in steel bars at high surface temperatures is a critical problem in any manufacturing industry. Surface breaking cracks are the major problems during the billet casting. Many NDT techniques are proven its capability in crack detection at room temperature. Here, we are demonstrating the possibility of exposure of cracks using laser line thermography at higher surface temperatures (up to 600 °C). A continuous-wave (CW) laser is used to excite the sample kept at higher surface temperatures. The temperature distribution over the sample due to the laser line scanning is captured using a temperature calibrated infrared (IR) thermal camera. The response of the sample temperature in crack detection is investigated using a validated FE model. The impact of the oxide layer in crack detection is investigated by using two types of samples; one without any oxide layer and the second is with the oxide layer. The influence of laser power in the detection of defects at high temperatures is studied. 3D numerical models were developed for the cases; when the sample is with oxide layer and without any oxide layer for a better understanding of physics. The surface temperature rise due to laser heating is higher for the scaled sample compared to the no-scale sample. The presence of the oxide layer above the parent metal will reduce the reflectivity of the surface. Lower reflectivity will lead to increased absorption of incident energy so that the surface temperature rise will be higher than the surface with no scale. Thermal contrast linearly depends on laser power, which means higher laser power will increase the defect detectability even at a higher surface temperature. KW - Laser thermography KW - High temperature KW - Modeling KW - Surface cracks KW - Non-destructive testing PY - 2020 DO - https://doi.org/10.1016/j.infrared.2020.103565 SN - 1350-4495 VL - 111 SP - 103565 PB - Elsevier B.V. AN - OPUS4-51573 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Hauffen, J. C. A1 - Kästner, L. A1 - Ahmadi, Samim A1 - Jung, P. A1 - Caire, G. A1 - Ziegler, Mathias T1 - Learned block iterative shrinkage thresholding algorithm for photothermal super resolution imaging JF - Sensors N2 - Block-sparse regularization is already well known in active thermal imaging and is used for multiple-measurement-based inverse problems. The main bottleneck of this method is the choice of regularization parameters which differs for each experiment. We show the benefits of using a learned block iterative shrinkage thresholding algorithm (LBISTA) that is able to learn the choice of regularization parameters, without the need to manually select them. In addition, LBISTA enables the determination of a suitable weight matrix to solve the underlying inverse problem. Therefore, in this paper we present LBISTA and compare it with state-of-the-art block iterative shrinkage thresholding using synthetically generated and experimental test data from active thermography for defect reconstruction. Our results show that the use of the learned block-sparse optimization approach provides smaller normalized mean square errors for a small fixed number of iterations. Thus, this allows us to improve the convergence speed and only needs a few iterations to generate accurate defect reconstruction in photothermal super-resolution imaging. KW - Thermography KW - Laser KW - Machine learning KW - Optimization KW - Non-destructive testing KW - NDT KW - Neural network KW - Defect reconstruction KW - Block-sparsity KW - Active thermal imaging KW - Regularization KW - Laser thermography PY - 2022 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-554598 DO - https://doi.org/10.3390/s22155533 SN - 1424-8220 VL - 22 IS - 15 SP - 1 EP - 15 PB - MDPI CY - Basel AN - OPUS4-55459 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -