TY - CONF A1 - Rabe, Torsten A1 - Naghib Zadeh, Hamid A1 - Glitzky, C. A1 - Töpfer, J. T1 - Integration of Ni-Cu-Zn ferrite in LTCC-modules N2 - Integration of magnetic functional components in LTCC Circuit boards calls for co-firing of dielectric and ferrite tapes. Ni-Cu-Zn ferrites with permeability of p=900 were developed which can be fully densified at the Standard LTCC sintering temperature of 900 °C. Successful co-firing of this ferrite with dielectric tapes requires the adaptation of the shrinkage behavior of the materials as well as the thermal expansion during the cooling period - especially in the temperature range below the transformation point of the glassy phase of the dielectric tape. To match these preconditions, a new dielectric LTCC material with steep sintering curve and high thermal expansion coefficient was designed. Sintered multilayer composed of Ni-Cu-Zn ferrite and tailored dielectric tapes are free of cracks and possess no open porosity. No significant interdiffusion between the ferrite and dielectric tapes was found by EDX measurements. Compared to pure ferrite laminates the permeability of co-sintered Ni-Cu-Zn ferrite layers is drastically reduced to 400, i.e. a decrease of more than 50 %. To investigate the origin of this permeability reduction, Ni-Cu-Zn ferrite laminates were sintered separately, and in combination with alumina release tapes or dielectric tapes, respectively. SEM and EDX analysis of co-fired laminates reveal differences in the ferrite grain growth behavior. Ferrite laminates with homogeneous microstructure and grain size up to 50 pm exhibit large permeability. However, growth of ferrite grains does not take place near the interface between ferrite and release or dielectric tapes. There is a strong correlation between high permeability and volume fraction of large ferrite grains. Regions of fine and coarse grains inside the ferrite layers show different bismuth concentration; the Bi-content is larger in regions of fine ferrite grains. T2 - CICMT 2011 - 7th International conference and exhibition on ceramic interconnect and ceramic microsystems technologies CY - San Diego, CA, USA DA - 05.04.2011 KW - LTCC KW - Co-firing KW - Ferrite KW - Shrinkage behavior KW - Constrained sintering KW - Keramische Multilayer KW - Grenzflächenreaktion PY - 2011 SN - 0-930815-92-0 SP - 000266 EP - 000275 PB - IMAPS, International Microelectronics and Packaging Society AN - OPUS4-25072 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Töpfer, J. A1 - Hesse, J. A1 - Barth, S. A1 - Pawlowski, B. A1 - Rabe, Torsten T1 - Spinel Ferrites for Integrated LTCC Inductor Modules T2 - EUROMAT CY - Montpellier, France DA - 2011-09-12 PY - 2011 AN - OPUS4-24865 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Rabe, Torsten A1 - Naghib Zadeh, Hamid A1 - Glitzky, Carsten A1 - Töpfer, J. T1 - Integration of Ni-Cu-Zn ferrite in low temperature Co-fired ceramics (LTCC) modules N2 - Integration of magnetic functional components in LTCC circuit boards calls for co-firing of dielectric and ferrite tapes. Ni-Cu-Zn ferrites with permeability of µ = 900 were fully densified at the standard LTCC sintering temperature of 900°C. Co-firing of this ferrite with dielectric tapes requires the adaptation of the shrinkage behavior of the materials as well as the thermal contraction during the cooling period – especially in the temperature range below the transformation point of the glass phase of the dielectric tape. To match these preconditions, a new dielectric LTCC material with steep sintering curve and high thermal expansion coefficient was designed. Sintered multilayer laminates composed of Ni-Cu-Zn ferrite and tailored dielectric tapes are free of cracks and possess no open porosity. No significant interdiffusion between the ferrite and dielectric tapes was found using microprobe analysis. Pure ferrite laminates show homogeneous microstructure with large grains up to 50 µm in diameter. However, growth of ferrite grains does not take place near the interface between ferrite and release or dielectric tapes. There is a strong correlation between permeability and volume fraction of large ferrite grains. Compared to pure ferrite laminates the permeability of co-sintered Ni-Cu-Zn ferrite layers is drastically reduced to 400, that is a decrease of more than 50%. PY - 2012 U6 - https://doi.org/10.1111/j.1744-7402.2011.00712.x SN - 1546-542X SN - 1744-7402 VL - 9 IS - 1 SP - 18 EP - 28 PB - American Ceramic Soc. CY - Westerville, Ohio AN - OPUS4-25544 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Töpfer, J. A1 - Mürbe, J. A1 - Glitzky, Carsten A1 - Rabe, Torsten T1 - High permeability (Ni.Mg)-Cu-Zn ferrites for integrated inductors T2 - 2nd Int. Congr. on Ceramics CY - Verona, Italy DA - 2008-06-29 PY - 2008 AN - OPUS4-17641 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Glitzky, Carsten A1 - Rabe, Torsten A1 - Eberstein, Markus A1 - Schiller, Wolfgang Arno A1 - Töpfer, J. A1 - Barth, S. A1 - Kipka, A. T1 - LTCC-Modules with integrated ferrite layers - Strategies for material development and co-sintering N2 - The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties. KW - Coefficient of thermal expansion (CTE) KW - Cofiring KW - Ferrite KW - LTCC KW - Shrinkage PY - 2009 SN - 1551-4897 VL - 6 IS - 1 SP - 49 EP - 53 CY - Washington, DC AN - OPUS4-19708 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Töpfer, J. A1 - Mürbe, J. A1 - Kracunovska, S. A1 - Barth, S. A1 - Pawlowski, B. A1 - Rabe, Torsten T1 - Ferrite Materials for Integrated LTCC Modules T2 - Jahrestagung der Amer. Ceramic Society (MST) CY - Houston, TX, USA DA - 2010-10-17 PY - 2010 AN - OPUS4-22291 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Töpfer, J. A1 - Hesse, J. A1 - Bierlich, S. A1 - Barth, S. A1 - Capraro, B. A1 - Rabe, Torsten A1 - Naghib Zadeh, Hamid A1 - Bartsch, H. T1 - Integration of Ni-Cu-Zn and hexagonal ferrites into LTCC modules: Cofiring strategies and magnetic properties N2 - We have studied the integration of Ni-Cu-Zn ferrite spinels as well as substituted hexagonal Co2Y-and M-type ferrites into LTCC (Low Temperature Ceramic Co-firing) modules. The cofiring behavior and the magnetic properties of these materials were investigated and evaluated for multilayer applications. Ni-Cu-Zn ferrites exhibit permeabilities of µ=300–500 for operating frequencies in the MHz range. Cu-substituted Y-type ferrites Ba2Co2-x-yZnxCuyFe12O22 in combination with sintering additives display sufficient shrinkage and densification at 900°C. A permeability of µ=10 is observed; however, substituted Co2Y-type ferrites do not exhibit long-term stability at 900°C. Co/Ti-substituted M-type ferrites BaFe12-2yCoyTiyO19 (y=1.2) with planar magneto-crystalline anisotropy exhibit excellent soft magnetic behavior. Using sintering additives, complete densification is reached at 900°C and a permeability of µ=15 and a resonance frequency of larger than 1?GHz are observed. Integration of ferrite multilayer inductor components into LTCC modules using free and constrained cofiring technologies is demonstrated. KW - Ferrites KW - Cofiring KW - LTCC modules KW - Permeability PY - 2014 UR - https://www.jstage.jst.go.jp/article/jjspm/61/S1/61_S214/_pdf U6 - https://doi.org/10.2497/jjspm.61.S214 SN - 0532-8799 SN - 1880-9014 VL - 61 SP - Suppl. S1, S214 EP - S217 PB - Ky¯okai CY - Ky¯oto AN - OPUS4-31045 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Glitzky, Carsten A1 - Rabe, Torsten A1 - Eberstein, Markus A1 - Schiller, Wolfgang Arno A1 - Töpfer, J. A1 - Barth, S. A1 - Kipka, A. T1 - LTCC-modules with integrated ferrite layers - Strategies for material development and co-sintering T2 - 2009 IMAPS/ACerS - 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) CY - Denver, Colorado, USA DA - 2009-04-21 KW - LTCC KW - Ferrite KW - Co-firing KW - Shrinkage KW - Coefficient of thermal expansion (CTE) PY - 2008 SN - 0-930815-83-1 SP - 000058 EP - 000063 AN - OPUS4-18926 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Töpfer, J. A1 - Mürbe, J. A1 - Kracunovska, S. A1 - Barth, S. A1 - Pawlowski, B. A1 - Bartnizek, T. A1 - Glitzky, Carsten A1 - Rabe, Torsten T1 - LTCC-compatible multilayer ferrites for integrated inductors T2 - 10th International Conference on Ferrites CY - Chengdu, China DA - 2008-10-10 KW - Hexagonal ferrites KW - Multilayer inductors KW - Ni-Cu-Zn ferrites KW - LTCC KW - Integrated inductors PY - 2008 SP - 147 EP - 150 CY - Chengdu, China AN - OPUS4-19426 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Rabe, Torsten A1 - Glitzky, Carsten A1 - Naghib Zadeh, Hamid A1 - Oder, Gabriele A1 - Eberstein, M. A1 - Töpfer, J. T1 - Silver in LTCC - Interfacial reactions, transport processes and influence on properties of ceramics T2 - 2009 IMAPS/ACerS - 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) CY - Denver, Colorado, USA DA - 2009-04-21 KW - LTCC KW - Silver conductors KW - Interface KW - Sintering KW - Ferrite KW - Capacitor PY - 2009 SN - 0-930815-87-4 SP - 000085 EP - 000093 AN - OPUS4-19428 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Naghib-zadeh, H. A1 - Oder, Gabriele A1 - Hesse, J. A1 - Reimann, T. A1 - Töpfer, J. A1 - Rabe, Torsten T1 - Effect of oxygen partial pressure on co-firing behavior and magnetic properties of LTCC modules with integrated NiCuZn ferrite layers N2 - Low-κ dielectric LTCC was developed, to realize successful co-firing with NiCuZn ferrite tapes. A critical high-temperature process in the production of highly integrated LTCC modules is the migration of silver from inner conductors into the LTCC glass phase. Intensive silver migration causes strong deformation of LTCC multilayers during firing in air. Silver migration into the LTCC glass phase depends on oxygen content of the sintering atmosphere and can be minimized by sintering in nitrogen atmosphere. However, partial decomposition of NiCuZn-ferrite and formation of cuprite was observed during sintering in nitrogen and, consequently, the permeability of the ferrite decreases. As shown by a combined XRD/thermogravimetric study the co-firing of LTCC modules with silver metallization and integrated ferrite layer demands precise adjustment of oxygen partial pressure. KW - Ferrite KW - Silver diffusion KW - Co-firing KW - LTCC PY - 2016 U6 - https://doi.org/10.1007/s10832-016-0043-0 SN - 1385-3449 SN - 1573-8663 VL - 37 IS - 1-4 SP - 100 EP - 109 PB - Springer Science+Business Media CY - New York AN - OPUS4-38603 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Hesse, J. A1 - Naghib-zadeh, H. A1 - Rabe, Torsten A1 - Töpfer, J. T1 - Integration of additive-free Ni–Cu–Zn ferrite layers into LTCC multilayer modules N2 - The sintering behavior of sub-micron Ni0.30Cu0.20Zn0.52Fe1.98O3.99 ferrite with and without Bi2O3 addition was studied. Ferrites with 0.5 wt% Bi2O3 exhibit enhanced shrinkage at T < 900 °C with significant grain growth. Additive-free ferrite powders also sinter to high density at 900 °C, however, grain growth is very limited. Both ferrites exhibit a permeability of µ = 400–450. Multilayers consisting of ferrite and low-k dielectric LTCC layers were prepared by co-firing at 900–915 °C. The shrinkage and thermal expansion characteristics of ferrite and LTCC tapes are similar. However, the permeability of integrated ferrite layers, made from ferrite tapes with Bi2O3 additive, significantly drops after co-firing with LTCC layers compared to separately fired monolithic ferrite multilayers. Contrarily, the permeability of integrated, Bi2O3-free ferrite layers, co-fired with dielectric tapes, is identical to that of monolithic ferrite multilayers. This finding is an important step toward ferrite integration into complex LTCC multilayer architectures. KW - LTCC KW - Ferrite integration KW - Multilayer KW - Sintering PY - 2016 U6 - https://doi.org/10.1016/j.jeurceramsoc.2016.02.016 SN - 0955-2219 VL - 36 IS - 8 SP - 1931 EP - 1937 PB - Elsevier Ltd. CY - Oxford, UK AN - OPUS4-36001 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Schulz, T. A1 - Reimann, T. A1 - Bochmann, A. A1 - Vogel, A. A1 - Capraro, B. A1 - Mieller, Björn A1 - Teichert, S. A1 - Töpfer, J. T1 - Sintering behavior, microstructure and thermoelectric properties of calcium cobaltite thickfilms for transversal thermoelectric multilayer generators N2 - The sintering behavior and the thermoelectric performance of Ca3Co4O9 multilayer laminates were studied, and a multilayer thermoelectric generator was fabricated. Compacts and multilayer samples with anisotropic microstructure and residual porosity were obtained after conventional sintering at 920 °C, whereas dense and isotropic multilayer samples were prepared by firing at 1200 °C and reoxidation at 900 °C. A hot-pressed sample has a dense and anisotropic microstructure. Samples sintered at 920 °C exhibit low electrical conductivity due to the low density, whereas the Seebeck coefficient is not sensitive to preparation conditions. However, thermal conductivity of multilayers is very low, and, hence acceptable ZT values are obtained. A ransversal multilayer thermoelectric generator (TMLTEG) was fabricated by stacking layers of Ca3Co4O9 green tapes, AgPd conductor printing, and co-firing at 920 °C. The TMLTEG has a power output of 3 mW at ΔT =200 K in the temperature interval of 25 °C to 300 °C. KW - Thermoelectric oxide KW - Calcium cobaltite KW - Pressure-assisted sintering KW - Multilayer PY - 2018 U6 - https://doi.org/10.1016/j.jeurceramsoc.2017.11.017 SN - 0955-2219 SN - 1873-619X VL - 38 IS - 4 SP - 1600 EP - 1607 PB - Elsevier Ltd. AN - OPUS4-43983 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Matz, R. A1 - Rabe, Torsten A1 - Töpfer, J. A1 - Ziesche, S. T1 - Circuit-Board-Integrated Transformers Design and Manufacture N2 - Transformers couple two sections of a circuit by electromagnetic induction. They are widely used to either transform alternating voltage levels or to transmit power or signals across galvanic isolation. Both of these functions are essential for the operation of sensors and controllers. Covering all aspects from idea to circuit performance and from design to manufacture, this paper presents the first comprehensive description of the making of miniaturized, rugged, up-to-100W transformers for embedding into multilayer circuit boards. For circular coils, the well-manageable Ampere-Laplace law is shown to yield reliable designs, predicting correctly the performance of manufactured hardware. This enables fast design without lengthy finite element modelling. In the low-power linear regime, basic relations describe how the device’s characteristics evolve from the material properties and device structure. While scattering Parameters are useful for the analysis of isolated transformers with their intrinsic parasitics, the interaction with the components of the final circuit and the aspects of power and efficiency are addressed by chain matrixes. While these design rules are similar for multilayer boards of different material (like epoxy, Teflon, ceramics), the manufacturing of ceramic board transformers is considered here in detail. Low-temperature-cofired ceramic (LTCC) boards being sintered at 900 °C are particularly suited for harsh environments with chemical or thermal stress as frequently found at sensor positions. The transformer performance usually benefits from or even requires an integrated ceramic core of higher permeability, a ferrite, to shape the magnetic flux. Methods to sinter ferrites inside a dielectric ceramic multilayerandto measure their performance are therefore described in detail.Asthe sintering behaviour of dielectricandmagnetic ceramics differs considerably, their simultaneous sintering is challenging.However, the sintering temperatures of the usefulMnZnand NiZnCu ferrites can be lowered to that of the dielectric material with only moderate loss of permeability by glass additives. Furthermore, thermal mismatch between materials causes catastrophic failure or at least stress and loss of magnetic performance during cooling to room temperature after sintering. This is avoidable by either adjusting the thermal expansion coefficient of the ferrite or by enclosing the ferrite between stressreleasing separation layers.We present the state of the art in materials development according to the first approach as well as fully functional devices made with the second technique. Other applications not directly addressed but well related to this work are characterized by low load resistance in relation to the coil resistance of the transformer. Efficient power transmission then requires that technological solutions are applied to achieve the lowest possible resistive loss inside the coils by an enlarged conductor cross-section. As this is particularly challenging for LTCC boards, a technique is discussed to fabricate conductor traces with a thickness larger than their width. KW - Multilayer ceramic technology KW - LTCC KW - Transformer PY - 2020 U6 - https://doi.org/10.4416/JCST2019-00071 SN - 2190-9385 VL - 11 IS - 1 SP - 44 EP - 61 PB - Göller Verlag CY - Baden-Baden AN - OPUS4-50751 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -