TY - GEN A1 - Krüger, Jörg A1 - Kautek, Wolfgang A1 - Lenzner, M. A1 - Sartania, S. A1 - Spielmann, C. A1 - Krausz, F. ED - Dubowski, J. T1 - Structuring of dielectric and metallic materials with ultrashort laser pulses between 20 fs and 3 ps T2 - Laser applications in microelectronic and optoelectronic manufacturing II N2 - Laser-micromachining of barium aluminum borosilicate glass, fused silica and stainless steel has been extended down to a pulse duration of 20 fs generated by a Ti:sapphire laser system at a wavelength of 0.8 micrometer. A systematic study shows that, below 100 fs, an enhanced precision and a substantial decrease of the ablation threshold fluence in comparison to pulse laser processing with pulses in the picosecond and nanosecond range could be achieved. The physical mechanism and the technical relevance of this novel microtechnology is discussed. T2 - Conference CY - San José, CA, USA DA - 1997-02-10 KW - Ablation KW - Laser processing KW - Micromachining KW - Structuring KW - Femtosecond pulse laser KW - Glass KW - Silica KW - Steel PY - 1997 SN - 0-8194-2402-1 DO - https://doi.org/10.1117/12.273740 SN - 1605-7422 N1 - Serientitel: SPIE proceedings series – Series title: SPIE proceedings series IS - 2991 SP - 40 EP - 47 PB - SPIE CY - Bellingham, Wash. AN - OPUS4-11893 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -