TY - CONF A1 - Wunderle, B. A1 - Onken, T. A1 - Heilmann, J. A1 - Silbernagl, Dorothee A1 - Arnold, J. A1 - Bieniek, T. A1 - Pufall, R. T1 - Reliability of sputtered thin aluminium films under accelerated stress testing by vibration loading and modeling N2 - Aluminium is still one of the most important contact metallisations for power electronic chips like MOSFETs or IGBTs. With a large difference in thermal expansion coefficients (CTEs) between aluminium and silicon and the temperatures generated in hot-spots during high power transients, these layers are prone to failure due to thermo-mechanical fatigue. Usually lifetime assessment is done by subjecting dedicated test specimens to standardised stress tests as e.g. active or passive thermal cycling. This paper proposes a novel method for accelerated stress testing and lifetime modelling of thin aluminium films in the high-cycle fatigue regime by isothermal mechanical loading. The proposed novel test method is suggested to complement or replace resource-demanding thermal cycling tests and allow simple in-situ monitoring of failure. T2 - 6th Electronic System-Integration Technology Conference (ESTC) CY - Grenoble, France DA - 13.09.2016 KW - Semiconductor device reliability KW - Thermal expansion KW - AFM KW - Vibrations KW - Nanoroughness KW - Accelerated stress testing KW - Active thermal cycling KW - Power electronic chips KW - Sputtered thin aluminium film KW - Thermomechanical fatigue PY - 2016 U6 - https://doi.org/10.1109/ESTC.2016.7764458 SP - 1 EP - 14 PB - IEEE AN - OPUS4-43595 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -