TY - CONF A1 - Eberstein, Markus A1 - Glitzky, Carsten A1 - Gemeinert, Marion A1 - Rabe, Torsten A1 - Schiller, Wolfgang Arno A1 - Modes, C. T1 - Design of LTCC with high thermal expansion T2 - IMAPS/ACERS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2008) CY - Munich, Germany DA - 2008-04-21 KW - LTCC KW - Glass ceramic composites KW - Coefficient of thermal expansion CTE KW - Design PY - 2008 SP - 000120 EP - 000126 PB - IMAPS, International Microelectronics and Packaging Society CY - Washington, DC AN - OPUS4-17436 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -