TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
T1 - Verifizierung von Flip-Chip-Demonstratoren unter Verwendung belastbarer Materialkennwerte
T2 - Öffentliches Status-Seminar "Projekt SIMIKO"
T2 - Öffentliches Status-Seminar "Projekt SIMIKO"
CY - München, Deutschland
DA - 2000-09-29
PY - 2000
AN - OPUS4-976
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
A1 - Schubert, A.
ED - Winkler, T.
ED - Schubert, A.
T1 - On the influence of two different underfill materials on the inelastic thermo-cyclic response of a flip-chip solder bump
T2 - Materials mechanics - Fracture mechanics - Micro mechanics
N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a solder bump configuration on Al2O3 substrate under thermo-cyclic loading between -55 °C and 125 °C. Chaboche's viscoplastic material model was used to describe the Bauschinger effect and the creep/plasticity interaction for the tin-lead solder material. The influence of two different viscoelastic underfill materials (Epoxy+50 % SiO2, Epoxy+70 % SiO2) on the inelastic deformation of the tin-lead solder was analyzed and compared. It may be shown that the thermally matched 'hard' underfiller (Epoxy+70 % SiO2) significantly reduces the accumulated inelastic strain in the bump compared to 'soft' underfiller or no underfill material. On the other hand, the maximum lateral normal stress will increase slightly.
PY - 2015
SP - 471
EP - 480
AN - OPUS4-33859
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
ED - Michel, B.
ED - Winkler, T.
T1 - Viscoplastic analysis of a solder-bump-configuration at thermo-cyclic loading
T2 - Micro Mat '97 - International conference and exhibition micro materials (Proceedings)
T2 - Micro Mat '97 - International conference and exhibition micro materials
CY - Berlin, Germany
DA - 1997-04-16
KW - Hardening and creep
KW - Constitutive modeling
KW - Determination of material parameters
KW - Hysteresis loops
KW - Relaxation behaviour
PY - 1997
SN - 3-932434-05-6
SP - 283
EP - 286
AN - OPUS4-33714
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - JOUR
A1 - Eberle, Arno
A1 - Sievert, Rainer
A1 - Schiller, Wolfgang Arno
T1 - Flip-Chip-Lotbumps thermisch-zyklisch belastet - Einfluß des Substratmaterials auf das viskoplastische Verhalten von Flip-Chip-Lotbumps
JF - Materialprüfung = Materials testing
PY - 1998
SN - 0025-5300
VL - 40
IS - 9
SP - 350
EP - 352
PB - Carl Hanser Verlag
CY - München
AN - OPUS4-33715
LA - deu
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
A1 - Schiller, Wolfgang Arno
T1 - Numerical investigation on the influence of different substrate materials on the viscoplastic behaviour of flip chip solder bumps
T2 - International symposium on advanced packaging materials 2000 (Proceedings)
N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a flip chip under thermocyclic loading between -55°C (-67°F) and 125°C (257°F). In order to simulate realistically the inelastic material response of the solder bump, Chaboche's viscoplastic material model instead of a classical ORNL-theory was implemented into the finite element code ABAQUS and applied to a flip chip configuration. This so-called unified constitutive model is able to describe the Bauschinger effect as well as the creep/plasticity interaction. Herewith the influence of the substrate material on the inelastic deformation behaviour of a tin-lead solder bump was analysed. A comparison is given with respect to the influence of the two substrate materials namely Al2O3 and our self-developed Low Temperature Co-fired Ceramics (LTCC) on the inelastic response of the Sn60Pb40 eutectic solder material. It may be shown that the thermoelastic behaviour of the LTCC substrate significantly reduces the cyclic stresses in the bump compared to Al2O3 as well as the cumulative inelastic strain which is responsible for the development of damage and hence flip chip failure
T2 - International symposium on advanced packaging materials 2000
CY - Braselton, Georgia, USA
DA - 06.03.2000
PY - 2000
SN - 0-930815-59-9
DO - https://doi.org/10.1109/ISAPM.2000.869253
SP - 112
EP - 117
AN - OPUS4-33716
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -
TY - CONF
A1 - Eberle, Arno
A1 - Sievert, Rainer
T1 - Numerical analysis of an electronic structure bearing deep cracks
T2 - MicroMat 2000 - 3rd International conference and poster exhibition Micro Materials (Proceedings)
N2 - The successive fatigue failure process, i.e. crack initiation and growth up to electrical failure, has been investigated for a flip chip configuration. A cracked and uncracked solder bump was analysed using an unified viscoplastic constitutive model (Chaboche). The electrical failure of a bump seems to be reached in general not before a deep crack has grown into the bump. In order to update the actual loading situation two different cracked structures were calculated.
T2 - MicroMat 2000 - 3rd International conference and poster exhibition Micro Materials
CY - Berlin, Germany
DA - 17.04.2000
PY - 2000
SN - 3-932434-15-3
SP - 582
EP - 585
AN - OPUS4-33827
LA - eng
AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER -