TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer T1 - Verifizierung von Flip-Chip-Demonstratoren unter Verwendung belastbarer Materialkennwerte T2 - Öffentliches Status-Seminar "Projekt SIMIKO" T2 - Öffentliches Status-Seminar "Projekt SIMIKO" CY - München, Deutschland DA - 2000-09-29 PY - 2000 AN - OPUS4-976 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schubert, A. ED - Winkler, T. ED - Schubert, A. T1 - On the influence of two different underfill materials on the inelastic thermo-cyclic response of a flip-chip solder bump T2 - Materials mechanics - Fracture mechanics - Micro mechanics N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a solder bump configuration on Al2O3 substrate under thermo-cyclic loading between -55 °C and 125 °C. Chaboche's viscoplastic material model was used to describe the Bauschinger effect and the creep/plasticity interaction for the tin-lead solder material. The influence of two different viscoelastic underfill materials (Epoxy+50 % SiO2, Epoxy+70 % SiO2) on the inelastic deformation of the tin-lead solder was analyzed and compared. It may be shown that the thermally matched 'hard' underfiller (Epoxy+70 % SiO2) significantly reduces the accumulated inelastic strain in the bump compared to 'soft' underfiller or no underfill material. On the other hand, the maximum lateral normal stress will increase slightly. PY - 2015 SP - 471 EP - 480 AN - OPUS4-33859 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer ED - Michel, B. ED - Winkler, T. T1 - Viscoplastic analysis of a solder-bump-configuration at thermo-cyclic loading T2 - Micro Mat '97 - International conference and exhibition micro materials (Proceedings) T2 - Micro Mat '97 - International conference and exhibition micro materials CY - Berlin, Germany DA - 1997-04-16 KW - Hardening and creep KW - Constitutive modeling KW - Determination of material parameters KW - Hysteresis loops KW - Relaxation behaviour PY - 1997 SN - 3-932434-05-6 SP - 283 EP - 286 AN - OPUS4-33714 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schiller, Wolfgang Arno T1 - Flip-Chip-Lotbumps thermisch-zyklisch belastet - Einfluß des Substratmaterials auf das viskoplastische Verhalten von Flip-Chip-Lotbumps JF - Materialprüfung = Materials testing PY - 1998 SN - 0025-5300 VL - 40 IS - 9 SP - 350 EP - 352 PB - Carl Hanser Verlag CY - München AN - OPUS4-33715 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schiller, Wolfgang Arno T1 - Numerical investigation on the influence of different substrate materials on the viscoplastic behaviour of flip chip solder bumps T2 - International symposium on advanced packaging materials 2000 (Proceedings) N2 - The finite element method was used to simulate the thermo-mechanical behaviour of a flip chip under thermocyclic loading between -55°C (-67°F) and 125°C (257°F). In order to simulate realistically the inelastic material response of the solder bump, Chaboche's viscoplastic material model instead of a classical ORNL-theory was implemented into the finite element code ABAQUS and applied to a flip chip configuration. This so-called unified constitutive model is able to describe the Bauschinger effect as well as the creep/plasticity interaction. Herewith the influence of the substrate material on the inelastic deformation behaviour of a tin-lead solder bump was analysed. A comparison is given with respect to the influence of the two substrate materials namely Al2O3 and our self-developed Low Temperature Co-fired Ceramics (LTCC) on the inelastic response of the Sn60Pb40 eutectic solder material. It may be shown that the thermoelastic behaviour of the LTCC substrate significantly reduces the cyclic stresses in the bump compared to Al2O3 as well as the cumulative inelastic strain which is responsible for the development of damage and hence flip chip failure T2 - International symposium on advanced packaging materials 2000 CY - Braselton, Georgia, USA DA - 06.03.2000 PY - 2000 SN - 0-930815-59-9 DO - https://doi.org/10.1109/ISAPM.2000.869253 SP - 112 EP - 117 AN - OPUS4-33716 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer T1 - Numerical analysis of an electronic structure bearing deep cracks T2 - MicroMat 2000 - 3rd International conference and poster exhibition Micro Materials (Proceedings) N2 - The successive fatigue failure process, i.e. crack initiation and growth up to electrical failure, has been investigated for a flip chip configuration. A cracked and uncracked solder bump was analysed using an unified viscoplastic constitutive model (Chaboche). The electrical failure of a bump seems to be reached in general not before a deep crack has grown into the bump. In order to update the actual loading situation two different cracked structures were calculated. T2 - MicroMat 2000 - 3rd International conference and poster exhibition Micro Materials CY - Berlin, Germany DA - 17.04.2000 PY - 2000 SN - 3-932434-15-3 SP - 582 EP - 585 AN - OPUS4-33827 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -