TY - JOUR A1 - Krüger, Jörg A1 - Bonse, Jörn A1 - Lenzner, Matthias T1 - Modification and Ablation of Semiconductors by Femtosecond Laser Pulses N2 - Physical and chemical phenomena resulting from irradiation of silicon and indium phosphide with ultrashort laser pulses (~100fs) were investigated with respect to the difference between single- and multiple-pulse treatment. In the single-pulse case, several processes were identified: modification, recrystallization and ablation. All processes exhibit a distinct treshold behaviour. A two photon-absorption coefficient can be determined from a single spatial ablation profile. Accumulation effects were observed for multi-pulse illumination. Different morphological features like bubbles, rippels and microcolumns were found. PY - 2002 VL - 5 IS - 2 SP - 437 EP - 461 PB - Transworld Research Network CY - Trivandrum AN - OPUS4-1585 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Bonse, Jörn A1 - Baudach, Steffen A1 - Krüger, Jörg A1 - Kautek, Wolfgang A1 - Lenzner, Matthias T1 - Femtosecond laser ablation of silicon-modification thresholds and morphology N2 - We investigated the initial modification and ablation of crystalline silicon with single and multiple Ti:sapphire laser pulses of 5 to 400 fs duration. In accordance with earlier established models, we found the phenomena amorphization, melting, re-crystallization, nucleated vaporization, and ablation to occur with increasing laser fluence down to the shortest pulse durations. We noticed new morphological features (bubbles) as well as familiar ones (ripples, columns). A nearly constant ablation threshold fluence on the order of 0.2 J/cm2 for all pulse durations and multiple-pulse irradiation was observed. For a duration of ,100 fs, significant incubation can be observed, whereas for 5 fs pulses, the ablation threshold does not depend on the pulse number within the experimental error. For micromachining of silicon, a pulse duration of less than 500 fs is not advantageous. PY - 2002 U6 - https://doi.org/10.1007/s003390100893 SN - 0947-8396 VL - 74 IS - 1 SP - 19 EP - 25 PB - Springer CY - Berlin AN - OPUS4-6328 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Jeschke, H.O. A1 - Garcia, M.E. A1 - Lenzner, Matthias A1 - Bonse, Jörn A1 - Krüger, Jörg A1 - Kautek, Wolfgang T1 - Laser ablation thresholds of silicon for different pulse durations: theory and experiment N2 - The ultrafast laser ablation of silicon has been investigated experimentally and theoretically. The theoretical description is based on molecular dynamics (MD) simulations combined with a microscopic electronic model. We determine the thresholds of melting and ablation for two different pulse durations =20 and 500 fs. Experiments have been performed using 100 Ti:Sap-phire laser pulses per spot in air environment. The ablation thresholds were determined for pulses with a duration of 25 and 400 fs, respectively. Good agreement is obtained between theory and experiment. KW - Laser ablation KW - Pulse duration KW - Threshold of silicon PY - 2002 U6 - https://doi.org/10.1016/S0169-4332(02)00458-0 SN - 0169-4332 SN - 1873-5584 VL - 197-198 SP - 839 EP - 844 PB - North-Holland CY - Amsterdam AN - OPUS4-6314 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -