TY - JOUR A1 - Kraft, Sebastian A1 - Schille, J. A1 - Bonse, Jörn A1 - Löschner, U. A1 - Krüger, Jörg T1 - X‑ray emission during the ablative processing of biological materials by ultrashort laser pulses JF - Applied Physics A N2 - The ablative laser processing with ultrashort pulsed laser beams may cause secondary emission of hazardous X-rays. While the effect has recently been proven to be considered in working safety regulations when processing technical materials, such as metals, the X-ray emission rates during the ablative processing of biological tissue materials are widely unexplored yet. Therefore, biological materials like water, isotonic saline solution, pig eyes, and human teeth were ablated with ultrashort laser pulses of 1030 nm wavelength, 600 fs pulse duration and 5 kHz pulse repetition rate, aiming to mimic typical surgery situations. Simultaneously, in-situ X-ray dose rate measurements were performed at a short distance from the plasma to display potential X-ray emission. For all four studied biological materials, our measurements prove the secondary emission of laser-induced X-rays. KW - Ultrashort pulsed laser KW - Laser-induced X-ray emission KW - Ophthalmology KW - Dentistry KW - Secondary hazard PY - 2023 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-569960 DO - https://doi.org/10.1007/s00339-023-06440-4 SN - 0947-8396 VL - 129 IS - 3 SP - 1 EP - 8 PB - Springer AN - OPUS4-56996 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Legall, Herbert A1 - Schwanke, Christoph A1 - Bonse, Jörn A1 - Krüger, Jörg T1 - X-ray radiation protection aspects during ultrashort laser processing JF - Journal of Laser Applications N2 - Ultrashort pulse laser processing of materials allows for precise machining with high accuracy. By increasing the repetition rate to several 100 kHz, laser machining becomes quick and cost-effective. Ultrafast laser processing at high repetition rates and peak intensities above 10^13 W/cm^2 can cause a potential hazard by generation of unwanted x-ray radiation. Therefore, radiation protection must be considered. For 925 fs pulse duration at a center wavelength of 1030 nm, the x-ray emission in air at a repetition rate of 400 kHz was investigated up to a peak intensity of 2.6 × 10^14 W/cm^2. Based on the presented measurements, the properties of potential shielding materials will be discussed. By extending our previous works, a scaling of the x-ray radiation emission to higher peak intensities up to 10^15 W/cm^2 is described, and emitted x-ray doses are predicted. KW - Laser ablation KW - Ultrashort pulse laser processing KW - Laser-induced x-ray emission KW - Radiation protection PY - 2020 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-505677 DO - https://doi.org/10.2351/1.5134778 VL - 32 IS - 2 SP - 022004 AN - OPUS4-50567 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Stolzenberg, U. A1 - Schmitt Rahner, M. A1 - Pullner, B. A1 - Legall, Herbert A1 - Bonse, Jörn A1 - Kluge, M. A1 - Ortner, A. A1 - Hoppe, B. A1 - Krüger, Jörg T1 - X-ray emission hazards from ultrashort pulsed laser material processing in an industrial setting JF - Materials N2 - Interactions between ultrashort laser pulses with intensities larger than 10^13 W/cm^2 and solids during material processing can lead to the emission of X-rays with photon energies above 5 keV, causing radiation hazards to operators. A framework for inspecting X-ray emission hazards during laser material processing has yet to be developed. One requirement for conducting radiation protection inspections is using a reference scenario, i.e., laser settings and process parameters that will lead to an almost constant and high level of X-ray emissions. To study the feasibility of setting up a reference scenario in practice, ambient dose rates and photon energies were measured using traceable measurement equipment in an industrial setting at SCHOTT AG. Ultrashort pulsed (USP) lasers with a maximum average power of 220 W provided the opportunity to measure X-ray emissions at laser peak intensities of up to 3.3 × 10^15 W/cm^2 at pulse durations of ~1 ps. The results indicate that increasing the laser peak intensity is insufficient to generate high dose rates. The investigations were affected by various constraints which prevented measuring high ambient dose rates. In this work, a list of issues which may be encountered when performing measurements at USP-laser machines in industrial settings is identified. KW - X-ray emission hazards KW - Ultrashort pulsed laser KW - Radiation protection KW - Industrial applications KW - Protection housing PY - 2021 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-538632 DO - https://doi.org/10.3390/ma14237163 SN - 1996-1944 VL - 14 SP - 1 EP - 17 PB - MDPI CY - Basel AN - OPUS4-53863 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Legall, Herbert A1 - Schwanke, Christoph A1 - Bonse, Jörn A1 - Krüger, Jörg T1 - X-ray emission during ultrashort pulse laser processing T2 - Proceedings of SPIE - FRONTIERS IN ULTRAFAST OPTICS: BIOMEDICAL, SCIENTIFIC, AND INDUSTRIAL APPLICATIONS XIX N2 - The industrial use of ultrashort laser pulses has made considerable progress in recent years. The reasons for this lie in the availability of high average powers at pulse repetition rates in the several 100 kHz range. The advantages of using ultrashort laser pulses in terms of processing precision can thus be fully exploited. However, high laser intensities on the workpiece can also lead to the generation of unwanted X-rays. Even if the emitted X-ray dose per pulse is low, the accumulated X-ray dose can become significant for high-repetition-rate laser systems so that X-ray exposure safety limits must be considered. The X-ray emission during ultrashort pulse laser processing was investigated for a pulse duration of 925 fs at 1030 nm wavelength and 400 kHz repetition rate. Industrially relevant materials such as steel,aluminum and glass were treated. Tungsten served as reference. X-ray spectra were recorded, and X-ray dose measurements were performed for laser treatment in air. For laser intensities > 2 × 10^13 W/cm2, X-ray doses exceeding the regulatory exposure limits for members of the public were found. Suitable X-ray protection strategies are proposed. T2 - SPIE Photonics West CY - San Francisco, USA DA - 02.02.2019 KW - Laser-induced X-ray emission KW - Ultrashort laser material interaction KW - Radiation protection PY - 2019 SN - 978-1-5106-2459-7 DO - https://doi.org/10.1117/12.2516165 SN - 0277-786X SN - 1996-756X VL - 10908 SP - 1090802-1 EP - 1090802-7 PB - SPIE - The international society for optics and photonics CY - Bellingham, WA, USA AN - OPUS4-47510 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Bonse, Jörn A1 - Legall, Herbert A1 - Schwanke, Christoph A1 - Pentzien, Simone A1 - Krüger, Jörg T1 - X-ray emission during processing of metals with ultrashort laser pulses N2 - Ultrashort laser pulse micromachining features a high precision. By increasing the repetition rate of the applied laser to several 100 kHz, laser processing becomes quick and cost-effective and make this method attractive for industrial applications. Upon exceeding a critical laser intensity, hard X-ray radiation is generated as a side effect. Even if the emitted X-ray dose per pulse is low, the accumulated X-ray dose becomes significant for high-repetition-rate laser systems so that radiation safety must be considered. T2 - 8th International LIPSS Workshop CY - Bochum, Germany DA - 27.09.2018 KW - X-ray KW - Laser processing KW - Ultrashort KW - Metals PY - 2018 AN - OPUS4-46104 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Bonse, Jörn A1 - Legall, Herbert A1 - Schwanke, Christoph A1 - Pentzien, Simone A1 - Krüger, Jörg T1 - X-Ray Emission during Laser Processing with Ultrashort Laser Pulses N2 - Ultrashort laser pulse micromachining features a high precision. By increasing the repetition rate of the applied laser to several 100 kHz, laser processing becomes quick and cost-effective and make this method attractive for industrial applications. Upon exceeding a critical laser intensity, hard X-ray radiation is generated as a side effect. Even if the emitted X-ray dose per pulse is low, the accumulated X-ray dose becomes significant for high-repetition-rate laser systems so that radiation safety must be considered. T2 - 5th UKP-Workshop: Ultrafast Laser Technology CY - Aachen, Germany DA - 10.04.2019 KW - Laser-induced X-ray emission KW - Radiation protection KW - Ultrashort laser material interaction PY - 2019 AN - OPUS4-47788 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Legall, Herbert A1 - Schwanke, Christoph A1 - Pentzien, Simone A1 - Dittmar, G. A1 - Bonse, Jörn A1 - Krüger, Jörg T1 - X-ray emission as a potential hazard during ultrashort pulse laser material processing JF - Applied physics A N2 - In laser machining with ultrashort laser pulses unwanted X-ray radiation in the keV range can be generated when a critical laser intensity is exceeded. Even if the emitted X-ray dose per pulse is low, high laser repetition rates can lead to an accumulation of X-ray doses beyond exposure safety limits. For 925 fs pulse duration at a center wavelength of 1030 nm, the X-ray emission was investigated up to an intensity of 2.6 × 10^14 W/cm2. The experiments were performed in air with a thin disk laser at a repetition rate of 400 kHz. X-ray spectra and doses were measured for various planar target materials covering a wide range of the periodic table from aluminum to tungsten. Without radiation shielding, the measured radiation doses at this high repetition rate clearly exceed the regulatory limits. Estimations for an adequate radiation shielding are provided. KW - Laser-induced X-ray emission KW - Ultrashort laser material interaction KW - Femtosecond laser KW - Radiation protection PY - 2018 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-448431 DO - https://doi.org/10.1007/s00339-018-1828-6 SN - 0947-8396 SN - 1432-0630 VL - 124 IS - 6 SP - Article 407, 1 EP - 8 PB - Springer AN - OPUS4-44843 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Böttcher, Katrin A1 - Schmitt Rahner, M. A1 - Stolzenberg, U. A1 - Kraft, Sebastian A1 - Bonse, Jörn A1 - Feist, C. A1 - Albrecht, D. A1 - Pullner, B. A1 - Krüger, Jörg T1 - Worst-case X-ray photon energies in ultrashort pulse laser processing JF - Materials N2 - Ultrashort pulse laser processing can result in the secondary generation of unwanted X-rays if a critical laser irradiance of about 10^13 W/cm^2 is exceeded. Spectral X-ray emissions were investigated during the processing of tungsten and steel using three complementary spectrometers (based on CdTe and silicon drift detectors) simultaneously for the identification of a worst-case spectral scenario. Therefore, maximum X-ray photon energies were determined, and corresponding dose equivalent rates were calculated. An ultrashort pulse laser workstation with a pulse duration of 274 fs, a center wavelength of 1030 nm, pulse repetition rates between 50 kHz and 200 kHz, and a Gaussian laser beam focused to a spot diameter of 33 µm was employed in a single pulse and burst laser operation mode. Different combinations of laser pulse energy and repetition rate were utilized, keeping the average laser power constant close to the maximum power of 20 W. Peak irradiances ranging from 7.3 × 10^13 W/cm^2 up to 3.0 × 10^14 W/cm^2 were used. The X-ray dose equivalent rate increases for lower repetition rates and higher pulse energy if a constant average power is used. Laser processing with burst mode significantly increases the dose rates and the X-ray photon energies. A maximum X-ray photon energy of about 40 keV was observed for burst mode processing of tungsten with a repetition rate of 50 kHz and a peak irradiance of 3 × 10^14 W/cm^2. KW - Ultrashort pulsed laser KW - X-ray emission KW - X-ray spectrum KW - X-ray energies KW - Radiation protection PY - 2022 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-566176 DO - https://doi.org/10.3390/ma15248996 VL - 15 IS - 24 SP - 1 EP - 17 PB - MDPI AN - OPUS4-56617 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Kraft, S. A1 - Böttcher, Katrin A1 - Bonse, Jörn A1 - Schille, J. A1 - Löschner, U. A1 - Krüger, Jörg T1 - Unwanted X-ray emission in ultrashort pulse laser processing: From metallic to biological materials T2 - Proceedings of the Lasers in Manufacturing Conference 2023 N2 - X-rays can be generated as an unwanted side effect during ultrashort pulse laser material processing of technical work pieces and even biological samples with laser intensities above 10^13 W/cm^2. First studies demonstrate the need to address this effect in industrial as well as in medical applications. This secondary hazard should be considered in work safety and risk assessment. T2 - Lasers in Manufacturing 2023 (LiM 2023) CY - Munich, Germany DA - 26.06.2023 KW - Ultrashort pulse laser processing KW - Laser-induced X-ray emission KW - Secondary hazard PY - 2023 SP - LiM 2023 - 1 EP - LiM 2023 - 6 PB - Wissenschaftliche Gesellschaft Lasertechnik und Photonik e.V. (WLT) AN - OPUS4-58358 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - BOOK A1 - Stoian, R. A1 - Bonse, Jörn T1 - Ultrafast Laser Nanostructuring — The Pursuit of Extreme Scales T3 - Springer Series in Optical Sciences N2 - Long seen as “a solution seeking a problem,” laser pulses are nowadays – more than 60 years after their first practical demonstration – paramount in shaping and structuring matter. Harnessing their capabilities to direct intense beams of light, the number of scientific and technological developments and daily-life applications is continuously increasing. Today, the presence of lasers is ubiquitous in all sites of scientific and technological interest, from the most advanced research laboratories to industrial factories and medical hospitals. The directionality of the laser beam determines equally a local character on lightmatter interaction and as such a local modification to a material target. Furthermore, the coherence of laser radiation enables near-field or far-field scattering and interference effects that widen significantly the capabilities of controlling and tracking laser-matter interactions in space and time. Already with the advent of lasers, powerful beams of light have been directed at solid materials for a variety of purposes, making this application as old as the laser itself. The roots of the major applications for laser structuring were developed already in the 1960s, setting the base of both theoretical and experimental studies on laser ablation, with the number of publications expanding explosively during the next decades. Within this dynamic context, laser processing of materials experienced an impressive development over the years. Laser processing means specifically the capability to structure and tailor a material on its surface or even within its volume, rendering new functions and properties that are impacting the mechanical, electrical, or optical characteristics of the material. These properties are scaledependent, generating thus over the years an equally impressive quest for spatial or temporal resolution. Therefore, the developments in laser engineering with major breakthroughs, notably in pulse duration and power, always closely accompanied the efforts in material structuring with two milestones in sight: (1) yield and (2) resolution. Every step in shrinking the laser pulse duration led to a subsequent strong-impact development in process precision – particularly when the ultrashort pulse durations surpassed the fundamental electron-phonon relaxation times. Thus, minimizing heat diffusion, the advent of pulses with duration smaller than molecular or lattice vibration times has managed to confine the spatial resolution to the optical diffraction limit and sometimes even beyond. The nanoscale was already in sight at the turn of the millennium. An important question may be raised now; is there any fundamental limit in the processing resolution, a barrier defined by the intrinsic properties of light and matter? The answer has an inherently multidisciplinary nature, following the conversion of free-propagating electromagnetic radiation into material-confined energy potentially usable to drive or transform matter, and will be the focus of the present book. Relying on the experience and expertise of the leading researchers in the field, the present book intends to explore the current efforts in achieving laser processing resolution beyond the diffraction limit, laying down a perspective towards extreme laser nanostructuring. Following the most recent advances and developments, it puts forward a concept of extreme processing scales enabled by optical pulses that are able to bypass diffraction limits and achieve structuring characteristic scales beyond 100 nm. This objective can be achieved by a comprehensive understanding on how light can change matter and how, in turn, matter can change light, allowing jointly for actively controlling light and material processes. In order to give an extended perspective on the current state-of-the-art in the field of precision laser structuring, the book is divided into three main parts. The first part of the book (Part I: Fundamental Processes) offers a perspective into the fundamentals of laser-matter interaction on extreme spatial scales, with a description of the most advanced modeling efforts in understanding energy deposition in matter, a plethora of material-relaxation pathways, as well as advanced concepts for probing and observing matter in motion. Roadmaps for energy localization will be developed, and the atomistic perspective of laser ablation visualized. Theoretical modelling enables in-depth insights on ultrafast quantum processes at the nanoscale. Laser-driven self-organization at surfaces will be dissected regarding the question of how light drives material periodic patterns down to the nanoscale, explored and transmitted to its ultimate limits of an atomic printer, and immediately complemented by the unprecedented capabilities of ultrafast in-situ observation approaches for tracking the laser-induced material response with extreme spatial and temporal resolution. In the second part of the book (Part II: Concepts of Extreme Nanostructuring), distinct concepts will be developed and explored that allow confinement of light and harnessing of a material response restricted to nano- or mesoscopic scales at surfaces or in the volume of irradiated materials. A special focus will be on optical near-field related approaches for localizing light on scales even below the optical diffraction limit and plasmonic printing. Spatial and temporal beam-shaping and tailored interference techniques are discussed in the context of ultrashort laser pulses, and insights into some extreme states of matter realized by the tight confinement of laser energy are presented. The ultimate limits of writing waveguides in the bulk of dielectrics and for manifesting 3D-nanolithography are elucidated. Plasma-based surface treatments can significantly enhance the vertical precision of surface processing through etching processes. Finally, the third part of the book (Part III: Applications) leads us to a number of resuming applications, unveiling the tremendous capabilities of surface functionalization through laser micro- and nanostructuring, assessing the 3D-writing of waveguides in the bulk of dielectrics or semiconductors for enabling new branches of integrated photonics, and summarizing related applications ranging from nanophotonics to nanofluidics and from optical sensing to biomedical applications, including the latest capabilities of refractive eye surgery. This part will analyze the applications’ compatibility in yield and reproducibility with current industrial requirements, costs, and intellectual property aspects. It expands the involved spatial scales by more than eight orders of magnitude, when extending extremely small structures featuring sizes of few tens of nanometers to larger dimensions in the meter range. Thus, from surfaces to the bulk, from subtractive to additive manufacturing approaches, from advanced theoretical frames to practical technological processes – we invite the readers here to an exciting journey into the varicolored landscape of extreme laser nanostructuring. The idea of this book project was seeded in early 2020. We were delighted about the numerous and extremely positive responses from the laser-processing community, quickly receiving commitments for more than 30 individual book chapters. About 2500 communications later, the book is published. We would like to thank all authors of this book project for their insightful and detailed chapters, reviewing and reporting on this fascinating topic of the pursuit of extreme scales in ultrafast laser nanostructuring. Moreover, we would like to acknowledge the professional help and guidance of the staff of Springer Nature. Finally, we hope you will enjoy reading this book as much as we have enjoyed putting it together. Saint Etienne, France Razvan Stoian Berlin, Germany Jörn Bonse December 2022 KW - Laser nanostructuring KW - Surface engineering KW - Nonlinear lithography KW - Self-organization KW - Laser-induced periodic surface structures, LIPSS PY - 2023 SN - 978-3-031-14751-7 (Hardcover) SN - 978-3-031-14752-4 (eBook) DO - https://doi.org/10.1007/978-3-031-14752-4 SN - 0342-4111 VL - 239 SP - 1 EP - 1245 PB - Springer Nature Switzerland AG CY - Cham ET - 1 AN - OPUS4-57294 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -