TY - JOUR A1 - Busche, Steffen A. A1 - Vigarani, Giulia A1 - Retzmann, Anika A1 - Meermann, Björn A1 - Börner, Hans G. T1 - Heavy metal on stage: Making ion-exchange resin selective by peptide tetrazine-norbornene ligation N2 - The challenge of recycling metal salt-contaminated wastewater is more relevant than ever, and cost-effective materials for specific ion-binding are required. A generic route to functionalize a macroporous polystyrene ion-exchange resin (LR-NH2) via chemoselective inverse electron-demand Diels-Alder (IEDDA) ligation is demonstrated. The resin is modified using accessible endo-/exo-5-norbornene-2-carboxylic acid (Nb-COOH) and a set of tetrazine-functionalized 5mer peptides based on sequence variations of the literature known Cu2+ binding domain HGGGW is employed for the IEDDA ligation. The resulting peptide-functionalized resins (LR-Pz-Peptides) are studied for Cu2+ binding to correlate ion-binding capacity with sequence properties by single bead analysis of metal amounts via inductively-coupled plasma mass spectrometry (ICP-MS). The complexation preferences are demonstrated and utilized for specific binding of Cu2+ versus Ni2+ from 1:1 salt mixture as a model system. Enrichment factors of up to 305 could be realized, which might open the potential for applications in metal recycling or waste water purification. KW - Heavy metals KW - Ion exchange resins KW - Analysis PY - 2024 DO - https://doi.org/10.1016/j.polymer.2023.126608 SN - 0032-3861 VL - 291 SP - 1 EP - 12 PB - Elsevier Ltd. AN - OPUS4-60756 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - GEN A1 - Schwaar, Timm A1 - Remmler, Dario A1 - Börner, Hans G. T1 - Spec2Seq N2 - Spe2Seq automatically translates mass spectrometry fragment spectra of precision polymers into their corresponding sequence. This software is especially useful for combinatorial approaches. KW - Java GUI KW - Polymers KW - Mass spectroscopy (MS) PY - 2018 SP - 1 EP - 8 PB - Humboldt-Universität CY - Berlin AN - OPUS4-46987 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Walter, Keven A1 - Hoch, Dominik P. A1 - Hertweck, Leon A1 - Balasubramanian, Kannan A1 - Geisler, Jonas A1 - Röllig, Mathias A1 - Neubert, Tilmann J. A1 - Börner, Hans G. T1 - Unlocking the Essence of Lignin: High‐Performance Adhesives That Bond via Thiol‐Catechol Connectivities and Debond on Electrochemical Command N2 - AbstractThe next generation of adhesives requires effective debonding capabilities that can be triggered on demand to enable advanced circular repair and recycling strategies. A new class of lignin‐inspired, two‐component (2K) structural adhesives offers bonding strengths of up to 20 MPa and clean, on‐command electrochemical debonding within 5–30 min. The debonding is induced by a distinct electrochemical oxidation of thiol‐catechol connectivities (TCCs) within the entire adhesive network, enforcing rapid and clean adhesive failure on the cathodic substrate side. The TCC‐functionalities are formed during curing by a thiol‐quinone Michael‐type polyaddition, reacting polyester‐based trithiols with tris‐quinones as lignin‐inspired minimal building blocks. The structural adhesive can be fine‐tuned by adjusting the formulation. The addition of carbon black and ionic liquids facilitates the desired electrochemical transformation of TCC‐catechols to TCC‐quinones. Applying only 9 V for 5–30 min, leads to clean debonding with 72–86% loss of shear strength. A comprehensive study of curing, bonding, and debonding behavior by rheological, spectroscopic, and electrochemical investigations reveals the debonding mechanism by correlating catechol oxidation to adhesive performance. The electrochemical debonding capability of TCC‐structural adhesives is demonstrated in a functional prototype, where on‐command detachment of a cover glass from a display device is achieved within 6.5 min. KW - Lignin-inspired KW - Electrochemical-Debonding KW - Thiol-Catechol-Connectivity (TCC) KW - Michael-Type Polyaddition KW - On-Demand Adhesive Failure PY - 2025 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-639674 DO - https://doi.org/10.1002/adma.202510463 SN - 0935-9648 SP - 1 EP - 10 PB - Wiley VHC-Verlag CY - 69451 Weinheim AN - OPUS4-63967 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -