TY - JOUR T1 - Amts- und Mitteilungsblatt, Band 53, Heft 4 T3 - Amts- und Mitteilungsblatt der BAM - 4/2023 KW - Anerkennungen KW - Zulassungen PY - 2023 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:b43-592823 SN - 0340-7551 VL - 53 IS - 4 SP - 517 EP - 540 PB - Bundesanstalt für Materialforschung und -prüfung (BAM) CY - Berlin AN - OPUS4-59282 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR T1 - Amts- und Mitteilungsblatt, Band 53, Heft 3 T3 - Amts- und Mitteilungsblatt der BAM - 3/2023 KW - Anerkennungen KW - Zulassungen KW - Richtlinien PY - 2023 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:b43-585302 SN - 0340-7551 VL - 53 IS - 3 SP - 463 EP - 516 PB - Bundesanstalt für Materialforschung und -prüfung (BAM) CY - Berlin AN - OPUS4-58530 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR T1 - Amts- und Mitteilungsblatt, Band 53, Heft 2 T3 - Amts- und Mitteilungsblatt der BAM - 2/2023 KW - Anerkennungen KW - Zulassungen KW - Richtlinien PY - 2023 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:b43-577330 SN - 0340-7551 VL - 53 IS - 2 SP - 341 EP - 462 PB - Bundesanstalt für Materialforschung und -prüfung (BAM) CY - Berlin AN - OPUS4-57733 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR T1 - Amts- und Mitteilungsblatt, Band 53, Heft 1 T3 - Amts- und Mitteilungsblatt der BAM - 1/2023 KW - Anerkennungen KW - Zulassungen KW - Richtlinien PY - 2023 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:b43-574038 SN - 0340-7551 VL - 53 IS - 1 SP - 1 EP - 340 PB - Bundesanstalt für Materialforschung und -prüfung (BAM) CY - Berlin AN - OPUS4-57403 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR ED - Krüger, Jörg ED - Bonse, Jörn T1 - Special Issue "Advanced Pulse Laser Machining Technology" N2 - Advanced Pulse Laser Machining Technology is a rapidly growing field to tailor special industrial and scientific applications. This is significantly driven by the availability of high-repetition rate laser sources and novel beam delivery concepts. This Special Issue focuses on developments in areas of surface and volume laser material processing, including spatial and temporal beam shaping, Bessel-beam dicing, direct laser interference patterning (DLIP), laser-induced forward transfer (LIFT), pulse burst machining, waveguide writing, and two-photon polymerization. Additionally, limitations of modern laser processing caused by failure of laser optics or unwanted secondary hazards like X-ray emission are addressed. Here, we would like to attract contributors from industry and academics. This Special Issue shall bundle original research and review articles of the latest achievements. KW - Advanced ultrashort-laser technology KW - Bessel-beam laser dicing KW - Direct laser interference patterning (DLIP) KW - High-repetition rate ultrafast laser processing KW - Laser-induced forward transfer (LIFT) KW - X-ray hazards during ultrafast laser processing KW - Volume processing, waveguide writing KW - Temporal beam shaping for precision machining PY - 2023 UR - https://www.mdpi.com/journal/materials/special_issues/pulse_laser_machining SN - 1996-1944 PB - MDPI CY - Basel AN - OPUS4-56842 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -