TY - JOUR A1 - Hempel, M. A1 - Ziegler, Mathias A1 - Schwirzke-Schaaf, S. A1 - Tomm, J.W. A1 - Jankowski, D. A1 - Schröder, D. T1 - Spectroscopic analysis of packaging concepts for high-power diode laser bars N2 - Double-side cooled high-power diode laser bars packaged by different techniques on different types of passive heat sinks are analyzed in terms of packaging-induced strain. Reference data from standard devices being single-side cooled only and packaged by conventional soft and hard soldering are also presented. Thermal profiling across the devices complements the results. The most suitable packaging architecture and technique for double-side cooled bars is identified. Measurements of the laser emission near field and electroluminescence pattern provide direct reference to the functionality of the devices. Furthermore, a type of cross calibration of the methods used for strain analysis is made, since all techniques are applied to the same set of bars. This involves micro photoluminescence, micro Raman, and degree-of-polarization electroluminescence spectroscopy. KW - Spectroscopy KW - Semiconductor laser KW - Thermography KW - High-power diode lasers KW - Non-destructive testing PY - 2012 U6 - https://doi.org/10.1007/s00339-012-6799-4 SN - 0947-8396 VL - 107 IS - 2 SP - 371 EP - 377 PB - Springer CY - Berlin AN - OPUS4-25789 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -