TY - JOUR A1 - Naghib-zadeh, H. A1 - Oder, Gabriele A1 - Hesse, J. A1 - Reimann, T. A1 - Töpfer, J. A1 - Rabe, Torsten T1 - Effect of oxygen partial pressure on co-firing behavior and magnetic properties of LTCC modules with integrated NiCuZn ferrite layers N2 - Low-κ dielectric LTCC was developed, to realize successful co-firing with NiCuZn ferrite tapes. A critical high-temperature process in the production of highly integrated LTCC modules is the migration of silver from inner conductors into the LTCC glass phase. Intensive silver migration causes strong deformation of LTCC multilayers during firing in air. Silver migration into the LTCC glass phase depends on oxygen content of the sintering atmosphere and can be minimized by sintering in nitrogen atmosphere. However, partial decomposition of NiCuZn-ferrite and formation of cuprite was observed during sintering in nitrogen and, consequently, the permeability of the ferrite decreases. As shown by a combined XRD/thermogravimetric study the co-firing of LTCC modules with silver metallization and integrated ferrite layer demands precise adjustment of oxygen partial pressure. KW - Ferrite KW - Silver diffusion KW - Co-firing KW - LTCC PY - 2016 U6 - https://doi.org/10.1007/s10832-016-0043-0 SN - 1385-3449 SN - 1573-8663 VL - 37 IS - 1-4 SP - 100 EP - 109 PB - Springer Science+Business Media CY - New York AN - OPUS4-38603 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Naghib Zadeh, Hamid A1 - Rabe, Torsten T1 - Pressure-assisted sintering of multilayer transformer using LTCC-compatible NiCuZn-ferrite and silver conductor T2 - CICMT 2012 - 8th International conference on ceramic interconnect & ceramic microsystems technologies CY - Erfurt, Germany DA - 2012-04-16 KW - LTCC KW - Ferrite KW - Silver conductor PY - 2012 SP - 000476 EP - 000483 (Session WP 1 / WP 15) AN - OPUS4-27775 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Rabe, Torsten A1 - Naghib Zadeh, Hamid A1 - Glitzky, C. A1 - Töpfer, J. T1 - Integration of Ni-Cu-Zn ferrite in LTCC-modules N2 - Integration of magnetic functional components in LTCC Circuit boards calls for co-firing of dielectric and ferrite tapes. Ni-Cu-Zn ferrites with permeability of p=900 were developed which can be fully densified at the Standard LTCC sintering temperature of 900 °C. Successful co-firing of this ferrite with dielectric tapes requires the adaptation of the shrinkage behavior of the materials as well as the thermal expansion during the cooling period - especially in the temperature range below the transformation point of the glassy phase of the dielectric tape. To match these preconditions, a new dielectric LTCC material with steep sintering curve and high thermal expansion coefficient was designed. Sintered multilayer composed of Ni-Cu-Zn ferrite and tailored dielectric tapes are free of cracks and possess no open porosity. No significant interdiffusion between the ferrite and dielectric tapes was found by EDX measurements. Compared to pure ferrite laminates the permeability of co-sintered Ni-Cu-Zn ferrite layers is drastically reduced to 400, i.e. a decrease of more than 50 %. To investigate the origin of this permeability reduction, Ni-Cu-Zn ferrite laminates were sintered separately, and in combination with alumina release tapes or dielectric tapes, respectively. SEM and EDX analysis of co-fired laminates reveal differences in the ferrite grain growth behavior. Ferrite laminates with homogeneous microstructure and grain size up to 50 pm exhibit large permeability. However, growth of ferrite grains does not take place near the interface between ferrite and release or dielectric tapes. There is a strong correlation between high permeability and volume fraction of large ferrite grains. Regions of fine and coarse grains inside the ferrite layers show different bismuth concentration; the Bi-content is larger in regions of fine ferrite grains. T2 - CICMT 2011 - 7th International conference and exhibition on ceramic interconnect and ceramic microsystems technologies CY - San Diego, CA, USA DA - 05.04.2011 KW - LTCC KW - Co-firing KW - Ferrite KW - Shrinkage behavior KW - Constrained sintering KW - Keramische Multilayer KW - Grenzflächenreaktion PY - 2011 SN - 0-930815-92-0 SP - 000266 EP - 000275 PB - IMAPS, International Microelectronics and Packaging Society AN - OPUS4-25072 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Naghib Zadeh, Hamid A1 - Rabe, Torsten A1 - Toepfer, J. A1 - Karmazin, R. T1 - Co-firing of LTCC modules with embedded ferrite layers N2 - Further miniaturization of electronic packaging calls for integration of magnetic functional components into LTCC modules. For integration of magnetic function into LTCC, low fired MnZn- and NiCuZn-ferrites which can be fully densified at the standard LTCC sintering temperature of 900°C were developed. To co-fire these ferrite tapes with dielectric tapes the sintering shrinkage and the coefficient of thermal expansion of ferrite and dielectric tapes must be matched. For each ferrite material a new LTCC dielectric material was designed. The embedded ferrite tapes into new LTCC dielectric tapes can be sufficiently densified during co-firing at 900°C without any cracking. Compared to separately sintered ferrites the permeability of embedded ferrite tapes is reduced. For embedded NiCuZn ferrites permeabilities between 230 and 570 (at 2 MHz) according to the thickness of the embedded ferrite layer were measured. For embedded MnZn ferrites a permeability of 300 was measured. T2 - EMPC-2011 - 18th European microelectronics & packaging conference CY - Brighton, UK DA - 12.09.2011 KW - LTCC KW - Co-firing KW - Ferrite PY - 2011 SN - 978-0-9568086-0-8 IS - TuA2 SP - 1 EP - 6 AN - OPUS4-25021 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - JOUR A1 - Glitzky, Carsten A1 - Rabe, Torsten A1 - Eberstein, Markus A1 - Schiller, Wolfgang Arno A1 - Töpfer, J. A1 - Barth, S. A1 - Kipka, A. T1 - LTCC-Modules with integrated ferrite layers - Strategies for material development and co-sintering N2 - The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties. KW - Coefficient of thermal expansion (CTE) KW - Cofiring KW - Ferrite KW - LTCC KW - Shrinkage PY - 2009 SN - 1551-4897 VL - 6 IS - 1 SP - 49 EP - 53 CY - Washington, DC AN - OPUS4-19708 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Rabe, Torsten A1 - Glitzky, Carsten A1 - Naghib Zadeh, Hamid A1 - Oder, Gabriele A1 - Eberstein, M. A1 - Töpfer, J. T1 - Silver in LTCC - Interfacial reactions, transport processes and influence on properties of ceramics T2 - 2009 IMAPS/ACerS - 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) CY - Denver, Colorado, USA DA - 2009-04-21 KW - LTCC KW - Silver conductors KW - Interface KW - Sintering KW - Ferrite KW - Capacitor PY - 2009 SN - 0-930815-87-4 SP - 000085 EP - 000093 AN - OPUS4-19428 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Glitzky, Carsten A1 - Rabe, Torsten A1 - Eberstein, Markus A1 - Schiller, Wolfgang Arno A1 - Töpfer, J. A1 - Barth, S. A1 - Kipka, A. T1 - LTCC-modules with integrated ferrite layers - Strategies for material development and co-sintering T2 - 2009 IMAPS/ACerS - 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) CY - Denver, Colorado, USA DA - 2009-04-21 KW - LTCC KW - Ferrite KW - Co-firing KW - Shrinkage KW - Coefficient of thermal expansion (CTE) PY - 2008 SN - 0-930815-83-1 SP - 000058 EP - 000063 AN - OPUS4-18926 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -