TY - CONF A1 - Deppe, Hans-Joachim T1 - Technische Entwicklungen auf dem Markt der Holzwerkstoffe T2 - 2. Internationaler Holzhandelskongress CY - Munich, Germany DA - 08.10.1981 PY - 1982 SN - 3-87181-303-6 N1 - Schriftenreihe: Internationaler Holzhandelskongress; 2 IS - 2 SP - 170 EP - 193 PB - DRW-Verl. CY - Stuttgart AN - OPUS4-36254 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Deppe, Hans-Joachim ED - Maloney, T. M. T1 - The utilization of wastepaper and refuse fiber material T2 - Nineteenth Washington State University International Particleboard/Composite Materials Symposium CY - Pullman, WA, USA DA - 1985-03-26 PY - 1985 SP - 1 EP - 16 PB - Washington State University CY - Pullman, Wash. AN - OPUS4-34115 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Deppe, Hans-Joachim T1 - Schwachholz als Rohstoffquelle für holzindustrielle Massenprodukte PY - 1981 SN - 3-7939-5069-7 N1 - Serientitel: Schriften aus der Forstlichen Fakultät der Universität Göttingen und der Niedersächsischen Forstlichen Versuchsanstalt – Series title: Schriften aus der Forstlichen Fakultät der Universität Göttingen und der Niedersächsischen Forstlichen Versuchsanstalt IS - 69 SP - 243 EP - 255 PB - Sauerländer CY - Frankfurt am Main AN - OPUS4-31957 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Deppe, Hans-Joachim T1 - Holzbaustoffe und Holzschutz T2 - Kongreß "Stadtsanierung" (AMK-Messeband) CY - Berlin, Deutschland DA - 1978-01-01 PY - 1978 SP - 2 EP - 12 CY - Berlin AN - OPUS4-8927 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Deppe, Hans-Joachim T1 - Technological advance in the manufacture and application of wood-based products T2 - World Consultation on Wood-Based Panels (background paper) CY - New Delhi, India DA - 1975-02-06 PY - 1975 IS - 47 SP - i-iii, 1-10 CY - New Delhi, India AN - OPUS4-8279 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Deppe, Hans-Joachim T1 - On the Production and Application of Cement-Bonded Wood Chipboards T2 - 8th Washington State University International Particleboard/Composite Materials Symposium CY - Pullman, WA, USA DA - 1974-01-01 PY - 1974 VL - 8 SP - 267 EP - 286 CY - Pullman, Wash. AN - OPUS4-8062 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER - TY - CONF A1 - Deppe, Hans-Joachim T1 - Preservation of Wood-Based Panels N2 - Universal application of wood-based panels (coreboard, plywood, hardboard, MDF, particle board, moulded products of particles and fibres) for inferior and exterior use is increasing. Compared with solid wood products they have several advantages (large size, homogeneity, controllable properties etc). As a result the consumption ratio of solid wood: woodbased panels decreased from 20:1 in 1950 to 2:1 today. This trend can be observed in industrialised as well as in developing countries. T2 - FAO/UNPD Technical consultation on wood based panels CY - New Delhi, India DA - 13.01.1983 PY - 1983 SP - 57 EP - 73 AN - OPUS4-39598 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -