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  <doc>
    <id>63571</id>
    <completedYear/>
    <publishedYear>2025</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>poster</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Optimization of local backside released micro-ring resonators for sensing applications using silicon photonic integrated circuits in a SOI technology</title>
    <abstract language="eng">The integration of photonic sensors into compact systems requires space-efficient solutions, such as the backside release of waveguides on silicon-on-insulator (SOI) platforms. This study presents the design, fabrication, and characterization of fully backside-released micro-ring resonators (MRRs) using the IHP SG25H5EPIC technology. The performance of rib and strip waveguides released by either dry or wet etching of the buried oxide (BOX) layer is evaluated. While wet etching provides low-loss release of rib waveguides, dry etching is required for the release of strip waveguides but results in increased waveguide losses and reduced quality factors. The effects of these release methods on critical coupling conditions, extinction ratio (ER), full width at half maximum (FWHM), and sensor performance are analyzed. The findings confirm that both etching strategies yield structures suitable for photonic sensing, with backside release enabling co-integration with microfluidic and optoelectronic components. These results contribute to the advancement of high-performance, integrated silicon photonic sensors.</abstract>
    <identifier type="doi">10.1117/12.3056481</identifier>
    <identifier type="url">https://www.spiedigitallibrary.org/conference-proceedings-of-spie/13527/135270U/Optimization-of-local-backside-released-micro-ring-resonators-for-sensing/10.1117/12.3056481.short</identifier>
    <enrichment key="eventName">SPIE Optics + Optoelectronics 2025</enrichment>
    <enrichment key="eventPlace">Prague, Czech Republic</enrichment>
    <enrichment key="eventStart">23.05.2025</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Tabea Fünning</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Rib and strip waveguides</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Wet and dry etching</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microfluidics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Biosensor</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Germanium photodiode</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Q-Factor</value>
    </subject>
    <collection role="ddc" number="543">Analytische Chemie</collection>
    <collection role="institutes" number="">1 Analytische Chemie; Referenzmaterialien</collection>
    <collection role="institutes" number="">1.5 Proteinanalytik</collection>
    <collection role="themenfelder" number="">Chemie und Prozesstechnik</collection>
    <collection role="themenfelder" number="">Chemische Charakterisierung und Spurenanalytik</collection>
    <collection role="fulltextaccess" number="">Datei im Netzwerk der BAM verfügbar ("Closed Access")</collection>
    <collection role="literaturgattung" number="">Präsentation</collection>
  </doc>
</export-example>
