<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>18675</id>
    <completedYear/>
    <publishedYear>2009</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1</pageFirst>
    <pageLast>8</pageLast>
    <pageNumber/>
    <edition/>
    <issue>1</issue>
    <volume>6</volume>
    <type>article</type>
    <publisherName>American Ceramic Soc.</publisherName>
    <publisherPlace>Westerville, Ohio</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>1</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Design of LTCC with high thermal expansion</title>
    <abstract language="eng">New applications of low-temperature co-fired ceramics (LTCC), such as pressure sensors or integrated functional layers, require materials that possess higher coefficients of thermal expansion (CTE). To fabricate LTCC with elevated CTE, two methods of material design are examined: firstly, glass ceramic composites (GCC), which consist of &gt;50 vol% glass in the starting powder, and, secondly, glass-bonded ceramics (GBC), where glass is added as a sintering aid only. The CTE of GBC is mainly determined by the crystalline component. For GCC, the CTE can be well predicted, if CTE and elastic data of each phase in the microstructure are known. A nonlinear characteristic of the CTE versus phase composition was found with increasing Ecrystals/Eglass ratio and absolute CTE difference between the components. The glass composition and glass amount can be used to compensate the fixed properties of a crystalline material in a desired way. However, because the CTE and permittivity of a glass cannot be chosen independently, an optimum glass composition has to be found. For a given LTCC, it is possible to control the devitrification by shifting the glass composition. In this way, the resulting CTE values can be predicted more exactly and tailoring becomes possible. Different LTCC materials, based on the crystalline compounds Ba(La,Nd)2Ti4O12, ZrO2 (Y-TZP), SiO2 (quartz), and specially developed glasses, possessing an elevated CTE of around 10 × 10-6 K-1 while showing permittivity εr between 6 and 63, are introduced.</abstract>
    <parentTitle language="eng">International Journal of Applied Ceramic Technology</parentTitle>
    <identifier type="old">20836</identifier>
    <identifier type="doi">10.1111/j.1744-7402.2008.02316.x</identifier>
    <identifier type="issn">1546-542X</identifier>
    <identifier type="issn">1744-7402</identifier>
    <enrichment key="bibliotheksstandort">Sonderstandort: Publica-Schrank</enrichment>
    <enrichment key="date_peer_review">15.01.2009</enrichment>
    <author>Markus Eberstein</author>
    <author>Carsten Glitzky</author>
    <author>Marion Gemeinert</author>
    <author>Torsten Rabe</author>
    <author>Wolfgang Arno Schiller</author>
    <author>C. Modes</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LTCC</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Glass ceramic composites</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Coefficient of thermal expansion CTE</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Design</value>
    </subject>
    <collection role="literaturgattung" number="">Verlagsliteratur</collection>
    <collection role="fulltextaccess" number="">Physisches Exemplar in der Bibliothek der BAM vorhanden ("Hardcopy Access")</collection>
  </doc>
  <doc>
    <id>17436</id>
    <completedYear/>
    <publishedYear>2008</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>000120</pageFirst>
    <pageLast>000126</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IMAPS, International Microelectronics and Packaging Society</publisherName>
    <publisherPlace>Washington, DC</publisherPlace>
    <creatingCorporation>American Ceramic Society</creatingCorporation>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Design of LTCC with high thermal expansion</title>
    <parentTitle language="eng">Proceedings and exhibitor presentations - 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies</parentTitle>
    <identifier type="old">19499</identifier>
    <enrichment key="bibliotheksstandort">Sonderstandort: Publica-Schrank</enrichment>
    <enrichment key="eventName">IMAPS/ACERS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2008)</enrichment>
    <enrichment key="eventPlace">Munich, Germany</enrichment>
    <enrichment key="eventStart">2008-04-21</enrichment>
    <enrichment key="eventEnd">2008-04-24</enrichment>
    <author>Markus Eberstein</author>
    <author>Carsten Glitzky</author>
    <author>Marion Gemeinert</author>
    <author>Torsten Rabe</author>
    <author>Wolfgang Arno Schiller</author>
    <author>C. Modes</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LTCC</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Glass ceramic composites</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Coefficient of thermal expansion CTE</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Design</value>
    </subject>
    <collection role="fulltextaccess" number="">Physisches Exemplar in der Bibliothek der BAM vorhanden ("Hardcopy Access")</collection>
    <collection role="literaturgattung" number="">Graue Literatur</collection>
  </doc>
  <doc>
    <id>19708</id>
    <completedYear/>
    <publishedYear>2009</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>49</pageFirst>
    <pageLast>53</pageLast>
    <pageNumber/>
    <edition/>
    <issue>1</issue>
    <volume>6</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace>Washington, DC</publisherPlace>
    <creatingCorporation>International Microelectronics and Packaging Society (IMAPS)</creatingCorporation>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">LTCC-Modules with integrated ferrite layers - Strategies for material development and co-sintering</title>
    <abstract language="eng">The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties.</abstract>
    <parentTitle language="eng">Journal of microelectronics and electronic packaging</parentTitle>
    <identifier type="old">21954</identifier>
    <identifier type="issn">1551-4897</identifier>
    <enrichment key="bibliotheksstandort">Sonderstandort: Publica-Schrank</enrichment>
    <author>Carsten Glitzky</author>
    <author>Torsten Rabe</author>
    <author>Markus Eberstein</author>
    <author>Wolfgang Arno Schiller</author>
    <author>J. Töpfer</author>
    <author>S. Barth</author>
    <author>A. Kipka</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Coefficient of thermal expansion (CTE)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Cofiring</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Ferrite</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LTCC</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Shrinkage</value>
    </subject>
    <collection role="literaturgattung" number="">Verlagsliteratur</collection>
    <collection role="fulltextaccess" number="">Physisches Exemplar in der Bibliothek der BAM vorhanden ("Hardcopy Access")</collection>
  </doc>
  <doc>
    <id>18926</id>
    <completedYear/>
    <publishedYear>2008</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>000058</pageFirst>
    <pageLast>000063</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation>International Microelectronics and Packaging Society (IMAPS)</creatingCorporation>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">LTCC-modules with integrated ferrite layers - Strategies for material development and co-sintering</title>
    <parentTitle language="eng">CICMT 2008 - 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, April 21-24, 2008, Munich, Germany (Proceedings)</parentTitle>
    <identifier type="old">21107</identifier>
    <identifier type="isbn">0-930815-83-1</identifier>
    <enrichment key="bibliotheksstandort">Sonderstandort: Publica-Schrank</enrichment>
    <enrichment key="eventName">2009 IMAPS/ACerS - 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)</enrichment>
    <enrichment key="eventPlace">Denver, Colorado, USA</enrichment>
    <enrichment key="eventStart">2009-04-21</enrichment>
    <enrichment key="eventEnd">2009-04-23</enrichment>
    <author>Carsten Glitzky</author>
    <author>Torsten Rabe</author>
    <author>Markus Eberstein</author>
    <author>Wolfgang Arno Schiller</author>
    <author>J. Töpfer</author>
    <author>S. Barth</author>
    <author>A. Kipka</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LTCC</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Ferrite</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Co-firing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Shrinkage</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Coefficient of thermal expansion (CTE)</value>
    </subject>
    <collection role="literaturgattung" number="">Verlagsliteratur</collection>
    <collection role="fulltextaccess" number="">Physisches Exemplar in der Bibliothek der BAM vorhanden ("Hardcopy Access")</collection>
  </doc>
</export-example>
