<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>19708</id>
    <completedYear/>
    <publishedYear>2009</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>49</pageFirst>
    <pageLast>53</pageLast>
    <pageNumber/>
    <edition/>
    <issue>1</issue>
    <volume>6</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace>Washington, DC</publisherPlace>
    <creatingCorporation>International Microelectronics and Packaging Society (IMAPS)</creatingCorporation>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">LTCC-Modules with integrated ferrite layers - Strategies for material development and co-sintering</title>
    <abstract language="eng">The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties.</abstract>
    <parentTitle language="eng">Journal of microelectronics and electronic packaging</parentTitle>
    <identifier type="old">21954</identifier>
    <identifier type="issn">1551-4897</identifier>
    <enrichment key="bibliotheksstandort">Sonderstandort: Publica-Schrank</enrichment>
    <author>Carsten Glitzky</author>
    <author>Torsten Rabe</author>
    <author>Markus Eberstein</author>
    <author>Wolfgang Arno Schiller</author>
    <author>J. Töpfer</author>
    <author>S. Barth</author>
    <author>A. Kipka</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Coefficient of thermal expansion (CTE)</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Cofiring</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Ferrite</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LTCC</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Shrinkage</value>
    </subject>
    <collection role="literaturgattung" number="">Verlagsliteratur</collection>
    <collection role="fulltextaccess" number="">Physisches Exemplar in der Bibliothek der BAM vorhanden ("Hardcopy Access")</collection>
  </doc>
  <doc>
    <id>18926</id>
    <completedYear/>
    <publishedYear>2008</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>000058</pageFirst>
    <pageLast>000063</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation>International Microelectronics and Packaging Society (IMAPS)</creatingCorporation>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">LTCC-modules with integrated ferrite layers - Strategies for material development and co-sintering</title>
    <parentTitle language="eng">CICMT 2008 - 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, April 21-24, 2008, Munich, Germany (Proceedings)</parentTitle>
    <identifier type="old">21107</identifier>
    <identifier type="isbn">0-930815-83-1</identifier>
    <enrichment key="bibliotheksstandort">Sonderstandort: Publica-Schrank</enrichment>
    <enrichment key="eventName">2009 IMAPS/ACerS - 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)</enrichment>
    <enrichment key="eventPlace">Denver, Colorado, USA</enrichment>
    <enrichment key="eventStart">2009-04-21</enrichment>
    <enrichment key="eventEnd">2009-04-23</enrichment>
    <author>Carsten Glitzky</author>
    <author>Torsten Rabe</author>
    <author>Markus Eberstein</author>
    <author>Wolfgang Arno Schiller</author>
    <author>J. Töpfer</author>
    <author>S. Barth</author>
    <author>A. Kipka</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>LTCC</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Ferrite</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Co-firing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Shrinkage</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Coefficient of thermal expansion (CTE)</value>
    </subject>
    <collection role="literaturgattung" number="">Verlagsliteratur</collection>
    <collection role="fulltextaccess" number="">Physisches Exemplar in der Bibliothek der BAM vorhanden ("Hardcopy Access")</collection>
  </doc>
</export-example>
