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    <title language="eng">PCA-enhanced Computational Thermography for the Non-destructive Investigation of the Historic Bücker Bü 181 Aircraft</title>
    <abstract language="eng">Infrared thermography is a widely recognized non-destructive testing (NDT) method used in material research and defect detection across various industrial applications. Moreover, thermography plays a crucial role in preserving cultural heritage, including historical paintings and buildings. This study focuses on the application of thermography in inspecting the historic Bücker Bü 181 aircraft, which was used in Germany during World War II. Over time, the original appearance of aircraft has often been altered as part of preservation efforts, either before or during their time in museums, leading to deviations from their historically original state. Additionally, the operational history of such objects is frequently undocumented or entirely lost, making it difficult to understand the presence of artifacts and historically significant data. These factors present major challenges in cultural heritage preservation, and destructive methods cannot be used to investigate such invaluable objects.&#13;
Therefore, thermography is implemented as a non-destructive and contactless examination method. Active flash thermography combined with phase analysis is a powerful tool for evaluating multilayer systems. In this study, multiple layers of old paint on the object posed a challenge in assessing defect conditions and retrieving other critical information beneath the surface coatings. Nevertheless, pulse thermography not only demonstrated its capability to identify defects and markings in multilayered coatings but also provided insights into the internal structure and subsections of the investigated aircraft.</abstract>
    <parentTitle language="eng">Research and Review Journal of Nondestructive Testing (ReJNDT)</parentTitle>
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    <author>Sruthi Krishna Kunji Purayil</author>
    <author>Mathias Röllig</author>
    <author>Philipp Daniel Hirsch</author>
    <author>Somsubhro Chaudhuri</author>
    <author>Julien Lecompagnon</author>
    <author>L. Strobach</author>
    <author>Mathias Ziegler</author>
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      <value>Non-destructive Testing</value>
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    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Infrared Thermography</value>
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    <subject>
      <language>eng</language>
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      <value>Defect Detection</value>
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      <language>eng</language>
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      <value>Cultural Heritage</value>
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      <language>eng</language>
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      <value>Multilayer Coatings</value>
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    <collection role="ddc" number="624">Ingenieurbau</collection>
    <collection role="institutes" number="">8 Zerstörungsfreie Prüfung</collection>
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    <title language="eng">Unlocking the Essence of Lignin: High‐Performance Adhesives That Bond via Thiol‐Catechol Connectivities and Debond on Electrochemical Command</title>
    <abstract language="eng">AbstractThe next generation of adhesives requires effective debonding capabilities that can be triggered on demand to enable advanced circular repair and recycling strategies. A new class of lignin‐inspired, two‐component (2K) structural adhesives offers bonding strengths of up to 20 MPa and clean, on‐command electrochemical debonding within 5–30 min. The debonding is induced by a distinct electrochemical oxidation of thiol‐catechol connectivities (TCCs) within the entire adhesive network, enforcing rapid and clean adhesive failure on the cathodic substrate side. The TCC‐functionalities are formed during curing by a thiol‐quinone Michael‐type polyaddition, reacting polyester‐based trithiols with tris‐quinones as lignin‐inspired minimal building blocks. The structural adhesive can be fine‐tuned by adjusting the formulation. The addition of carbon black and ionic liquids facilitates the desired electrochemical transformation of TCC‐catechols to TCC‐quinones. Applying only 9 V for 5–30 min, leads to clean debonding with 72–86% loss of shear strength. A comprehensive study of curing, bonding, and debonding behavior by rheological, spectroscopic, and electrochemical investigations reveals the debonding mechanism by correlating catechol oxidation to adhesive performance. The electrochemical debonding capability of TCC‐structural adhesives is demonstrated in a functional prototype, where on‐command detachment of a cover glass from a display device is achieved within 6.5 min.</abstract>
    <parentTitle language="eng">Advanced Materials</parentTitle>
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    <title language="eng">Development of a fully automated slurry sampling introduction system for GF-AAS and its application for the determination of cadmium in different matrices</title>
    <abstract language="eng">element analysis, offering high sensitivity and precision. However, its effectiveness is limited by sample preparation challenges for solid samples like soils and microplastics. Traditional methods include sample preparation, such as digestion, which is time-consuming and involves reagents, like acids, contributing to measurement uncertainty and higher carbon footprints. Slurry sampling allows direct analysis of suspensions, offering a more efficient alternative. However, maintaining suspension stability is challenging, requiring robust autosampler systems to streamline the process and enhance analytical performance.&#13;
Results: We present a novel autosampler extension for slurry sample introduction into GF-AAS. This system ensures suspension stability with a stirring device and closed vessels to prevent evaporation and contamination, incorporating a cooling unit to reduce solvent and analyte losses. It installs and removes in minutes without&#13;
additional connections. Validation with cadmium analysis in BAM-U110 (Soil) and BAM-H010 (ABS) showed high reliability. For BAM-U110 (Soil), we achieved recovery rates of 94 % ± 13 % in water suspension. The recovery rate for BAM-H010 (ABS) was 104 % ±11 % in acetonitrile suspension. These results demonstrate the system’s robustness, versatility, and accuracy for different matrices.&#13;
Significance:&#13;
The autosampler extension helps solve key problems in trace element analysis of solid samples, making the process faster and more accurate. It works well with complex materials, making it useful for areas like microplastic or nanoparticle analysis. This improvement also helps meet regulations for monitoring environ mental and polymer samples, offering a reliable and flexible tool for high-throughput analysis with fewer errors.</abstract>
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    <title language="eng">Improving the comparability of FFF-3D printing emission data by adjustment of the set extruder temperature</title>
    <abstract language="eng">Fused filament fabrication (FFF) is a material extrusion-based technique often used in desktop 3D printers. Polymeric filaments are melted and are extruded through a heated nozzle to form a 3D object in layers. The extruder temperature is therefore a key parameter for a successful print job but also one of the main emission driving factors as harmful pollutants (e.g., ultrafine particles) are formed by thermal polymer degradation. The awareness of potential health risks has increased the number of emission studies in the past years. However, studies usually refer their calculated emission data to the printer set extruder temperature for comparison purposes. In this study, we used a thermocouple and an infrared camera to measure the actual extruder temperature and found significant temperature deviations to the displayed set temperature among printer models. Our result shows that printing the same filament feedstocks with three different printer models and with identical printer set temperature resulted in a variation in particle emission of around two orders of magnitude. A temperature adjustment has reduced the variation to approx. one order of magnitude. Thus, it is necessary to refer the measured emission data to the actual extruder temperature as it poses a more accurate comparison parameter for evaluation of the indoor air quality in user scenarios or for health risk assessments.</abstract>
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    <title language="deu">Thermografie zur Vergleichbarkeit von Emissionsmessung im 3D-Druck</title>
    <abstract language="deu">Die Bedeutung der Extrudertemperatur bei kleinen Desktop 3D Druckern der&#13;
Fused Filament Fabrication (FFF) Technologie auf die Emission von ultrafeinen&#13;
Partikeln im Druckbetrieb ist nicht zu unterschätzen.&#13;
Allerdings zeigen kommerzielle 3D Drucker häufig eine systematische&#13;
Temperaturabweichung zum Sollwert, d.h. die eingestellte Temperatur weicht&#13;
von der tatsächlichen Temperatur ab. Da die Partikelemission meist&#13;
temperaturabhängig ist, ist eine genaue Messung der tatsächlichen&#13;
Extrudertemperatur für den Vergleich von Emissionsdaten aus&#13;
unterschiedlichen Druckermodellen relevant.</abstract>
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