Dokument-ID Dokumenttyp Autoren/innen Persönliche Herausgeber/innen Haupttitel Abstract Auflage Verlagsort Verlag Herausgeber (Institution) Erscheinungsjahr Titel des übergeordneten Werkes Jahrgang/Band ISBN Veranstaltung Veranstaltungsort Beginndatum der Veranstaltung Enddatum der Veranstaltung Ausgabe/Heft Erste Seite Letzte Seite URN DOI Lizenz Datum der Freischaltung OPUS4-30991 Zeitschriftenartikel Vöse, Markus; Fedelich, Bernard; Otto, F.; Eggeler, G. Micromechanical modeling of creep damage in a copper-antimony alloy A micromechanical model of creep induced grain boundary damage is proposed, which allows for the simulation of creep damage in a polycrystal with the finite element method. Grain boundary cavitation and sliding are considered via a micromechanically motivated cohesive zone model, while the grains creep following the slip system theory. The model has been calibrated with creep test data from pure Cu single crystals and a coarse-grained polycrystalline Cu-Sb alloy. The test data includes porosity measurements and estimates of grain boundary sliding. Finally, the model has been applied to Voronoi models of polycrystalline structures. In particular the influence of grain boundary sliding on the overall creep rate is demonstrated. Red Hook, NY, USA Curran 2014 Procedia materials science 3 ECF20 - 20th European conference on fracture Trondheim, Norway 28.06.2014 04.07.2014 21 26 urn:nbn:de:kobv:b43-309914 10.1016/j.mspro.2014.06.006 http://creativecommons.org/licenses/by-nc-nd/3.0/de/deed.de 2016-02-20