TY  - CONF
A1  - Fünning, Tabea
T1  - Optimization of local backside released micro-ring resonators for sensing applications using silicon photonic integrated circuits in a SOI technology
N2  - The integration of photonic sensors into compact systems requires space-efficient solutions, such as the backside release of waveguides on silicon-on-insulator (SOI) platforms. This study presents the design, fabrication, and characterization of fully backside-released micro-ring resonators (MRRs) using the IHP SG25H5EPIC technology. The performance of rib and strip waveguides released by either dry or wet etching of the buried oxide (BOX) layer is evaluated. While wet etching provides low-loss release of rib waveguides, dry etching is required for the release of strip waveguides but results in increased waveguide losses and reduced quality factors. The effects of these release methods on critical coupling conditions, extinction ratio (ER), full width at half maximum (FWHM), and sensor performance are analyzed. The findings confirm that both etching strategies yield structures suitable for photonic sensing, with backside release enabling co-integration with microfluidic and optoelectronic components. These results contribute to the advancement of high-performance, integrated silicon photonic sensors.
T2  - SPIE Optics + Optoelectronics 2025
CY  - Prague, Czech Republic
DA  - 23.05.2025
KW  - Rib and strip waveguides
KW  - Wet and dry etching
KW  - Microfluidics
KW  - Biosensor
KW  - Germanium photodiode
KW  - Q-Factor
PY  - 2025
UR  - https://www.spiedigitallibrary.org/conference-proceedings-of-spie/13527/135270U/Optimization-of-local-backside-released-micro-ring-resonators-for-sensing/10.1117/12.3056481.short
DO  - https://doi.org/10.1117/12.3056481
AN  - OPUS4-63571
LA  - eng
AD  - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany
ER  -