TY - GEN A1 - Munz, Martin A1 - Chung, Jae Un A1 - Kalinka, Gerhard A2 - Possart, W. T1 - Mapping Epoxy Interphases T2 - Adhesion : current research and applications PB - Wiley-VCH CY - Weinheim T2 - 7th European Conference on Adhesion ; 7th EURADH CY - Freiberg, Germany DA - 2004-09-01 KW - Interface KW - Interphase KW - Epoxy KW - Copper (Cu) KW - Polyvinylpyrrolidone (PVP) KW - AFM/SFM KW - DSI KW - EDX/EDS KW - Stiffness KW - Modulus KW - Interdiffusion PY - 2005 UR - https://opus4.kobv.de/opus4-bam/frontdoor/index/index/docId/10894 AN - OPUS4-10894 SN - 3-527-31263-3 VL - 7 SP - 103 EP - 123 AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany