TY - CONF A1 - Eberle, Arno A1 - Sievert, Rainer A1 - Schiller, Wolfgang T1 - Numerical Investigation on the Influence of Different Substrate Materials on the Viscoplastic Behaviour of Flip Chip Solder Bumps T2 - International Symposium and Exhibition on Advanced Packaging Materials T2 - International Symposium and Exhibition on Advanced Packaging Materials CY - Braselton, Georgia (USA) DA - 2000-03-06 PY - 2000 AN - OPUS4-32605 LA - deu AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -