TY - JOUR A1 - Czichos, Horst T1 - The mechanism of the metallic adhesion bond JF - Journal of physics D N2 - Adhesion bonding at a bimetallic interface is considered in terms of the electronic structure of combined metals in a highly simplified model. If specific surface properties are neglected, the contact area may be interpreted by a `jellium' model of thinned atom cores smeared on the interface and imbedded in a thinned sea of electrons. Adhesion bond strength will then depend primarily on free-electron density. In addition to the free-electron `jellium' formalism, the electronic structure of metals and the character (s, p, d) of electrons free for adhesion bonding must be considered. For metal single crystals an influence of the structure of the Fermi surface can also be pointed out. The adhesional pairs of dissimilar metals are assumed to fall into line with groups of `donor-acceptor' combinations of different strengths of adhesion. PY - 1972 DO - https://doi.org/10.1088/0022-3727/5/10/321 SN - 0022-3727 SN - 1361-6463 VL - 5 IS - 10 SP - 1890 EP - 1897 PB - IOP Publ. CY - Bristol AN - OPUS4-9473 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -