TY - CONF A1 - Grundmann, Jana A1 - Ermilova, Elena A1 - Hertwig, Andreas A1 - Klapetek, Petr A1 - Pereira, Silvania F. A1 - Rafighdoost, Jila A1 - Bodermann, Bernd T1 - Optical and Tactile Measurements on SiC Sample Defects T2 - SMSI 2023 Conference – Sensor and Measurement Science International N2 - The different defect types on SiC samples are measured with various measurement methods including optical and tactile methods. The defect types investigated include particles, carrots and triangles and they are analyzed with imaging ellipsometry, coherent Fourier scatterometry and atomic force microscopy. Each of these methods measures different properties of the defects and they all together contribute to a complete analysis. PB - AMA Service CY - Wunstorf T2 - SMSI 2023 - Sensor and Measurement Science International CY - Nuremberg, Germany DA - 08.05.2023 KW - Defects KW - Silicon carbide KW - Imaging ellipsometry KW - Atomic force microscopy KW - Coherent Fourier scatterometry PY - 2023 UR - https://opus4.kobv.de/opus4-bam/frontdoor/index/index/docId/59339 AN - OPUS4-59339 UR - https://nbn-resolving.org/urn:nbn:de:kobv:b43-593397 SN - 978-3-9819376-8-8 VL - 2023/D5 SP - 233 EP - 234 AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany