TY - GEN A1 - Fedelich, Bernard T1 - Micromechanical modelling of creep damage in a Copper-Antimony-Alloy T2 - International Conference on Material Modeling (ICMM) T2 - International Conference on Material Modeling (ICMM) CY - Warsaw, Poland DA - 2013-09-08 PY - 2013 UR - https://opus4.kobv.de/opus4-bam/frontdoor/index/index/docId/31129 AN - OPUS4-31129 AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany