TY - CONF A1 - Mieller, Björn A1 - Rabe, Torsten T1 - Structuring of LTCC substrates by a combination of pressure-assisted sintering and hot-embossing T2 - Additional Conferences (Device Packaging, HiTEC, HiTEN, CICMT) N2 - A novel technology for the structuring of LTCC surfaces is introduced. The material is shaped in a zero-shrinkage process by embossing a glassy carbon mold into the softened LTCC directly after termination of the shrinkage. Three commercially available LTCC compositions (Ceramtape GC, Heratape CT707, and DP951) were tested. Diverse raised and lowered structures including rings, grids, and characters were fabricated. Different material behavior was observed for the tested compositions. Promising results were achieved with Ceramtape GC. Embossing of precise, 40 µm deep circular cavities and 50 µm high raised characters is demonstrated. Processing of 100 × 100 mm² substrates is possible. DP951 showed very good moldability, but also unwanted material displacement due to evaporating lead. A high displacement capacity but uneven heights of embossed structures were observed on CT707 samples. SEM investigations proved the precise transfer of surface contours from the mold to the LTCC. Thereby, the high potential of the hot-embossing process for micro-patterning of LTCC is illustrated. T2 - 11th International Conference and Exhibition on Ceramic Interconnects and Ceramic Microsystem Technologies (CICMT 2015) CY - Dresden, Germany DA - 20.04.2015 KW - LTCC KW - Glass-like carbon PY - 2015 UR - https://opus4.kobv.de/opus4-bam/frontdoor/index/index/docId/40135 AN - OPUS4-40135 SN - 2380-4491 VL - 2015 IS - CICMT SP - 000297 EP - 000303 AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany