TY - CONF A1 - Eisenbart, M. A1 - Bauer, F. A1 - Klotz, U. A1 - Weber, M. A1 - Beygi Nasrabadi, Hossein A1 - Skrotzki, Birgit A1 - Klengel, R. A1 - Steinmeier, L. A1 - Parvez, A. A1 - Hanke, T. A1 - Dziwis, G. A1 - Meissner, R. A1 - Tikana, L. A1 - Heisterkamp, J. T1 - Development of an ontology for the lifecycle of copper and copper alloys N2 - Efforts towards digitalization in the material science and technology community have enhanced in the last years. In 2019 the German digitalization initiative platform „MaterialDigital“1 (MD) has been started. Numerous projects concerning digitalization, including the copper related project „KupferDigital“ (copper digital) have been initiated under the umbrella of MD. The initiative strives to address numerous issues concerning data access, exchange, security, provenance and sovereignty. Heterogeneous data origin, storage and evaluation often result in problems concerning comparability and reproducibility of scientific and technological results. In many cases material data are recorded, but the methods of testing are insufficiently described, or such information is not communicated along with the raw data. The material data can also have numerous different formats such as paper printouts, pdfs, excel sheets or csv-files. Hence, gathering and integrating material data from different sources is challenging for potential users like materials scientists and engineers, especially if there are contradictory data where the reasons for contradictions is not clear due their vague description. In order to address these problems, data should comply to the so called „FAIR“ principle which calls for data to be findable, accessible, interoperable, and reusable (FAIR)2 and hence be accessible via so-called decentralized but interconnected data spaces. By using knowledge representation withontologies, data can be enriched with meaning and the methods of the testing procedures can be accurately provided. In this presentation we want to introduce our approach to such knowledge representation based on a high-throughput alloy development process for Cu-based alloys³ along with characterization techniques such as hardness testing and microstructural characterization (e.g. EBSD – Electron Backscattered Diffraction). T2 - Copper Alloys Conference CY - Dusseldorf, Germany DA - 22.11.2022 KW - Copper KW - Life cycle KW - Ontology PY - 2022 AN - OPUS4-56406 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -