TY - JOUR A1 - Zeipert, H. A1 - Claes, L. A1 - Johannesmann, S. A1 - Lugovtsova, Yevgeniya A1 - Nicolai, Marcel A1 - Prager, Jens A1 - Henning, Bernd ED - Jumar, U. T1 - An approach to adhesive bond characterisation using guided acoustic waves in multi-layered plates JF - at - Automatisierungstechnik N2 - An approach for the non-destructive characterisation of adhesive bonds using guided ultrasonic waves is presented. Pulsed laser radiation is used to thermoacoustically excite broadband ultrasonic waves in a multi-layered sample, consisting of a metal plate adhesively joined to a polymeric layer using synthetic resin. The resulting signals are received by a purpose-built piezoelectric transducer. Varying the distance between excitation and detection yields spatio-temporal measurement data, from which the dispersive properties of the propagating waves can be inferred using a two-dimensional Fourier transform, assuming the plates to act as coupled waveguides. Coupled multi-layered waveguides show an effect referred to as mode repulsion, where the distance between certain modes in the frequency-wavenumber domain is assumed to be a measure of coupling strength. Measurements at different stages of curing of the adhesive layer are performed and evaluated. A comparison of the results shows changes in the dispersive properties, namely an increased modal bandwidth for the fully cured sample as well as an increased modal distance. KW - Adhesive bonding KW - Guided waves KW - Non-destructive testing KW - Ultrasound PY - 2021 DO - https://doi.org/10.1515/auto-2021-0089 VL - 69 IS - 11 SP - 962 EP - 969 PB - De Gruyter CY - Berlin/Boston AN - OPUS4-53762 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -