TY - CONF A1 - Naghib Zadeh, Hamid A1 - Rabe, Torsten A1 - Toepfer, J. A1 - Karmazin, R. T1 - Co-firing of LTCC modules with embedded ferrite layers T2 - EMPC-2011 - 18th European microelectronics & packaging conference (Proceedings) N2 - Further miniaturization of electronic packaging calls for integration of magnetic functional components into LTCC modules. For integration of magnetic function into LTCC, low fired MnZn- and NiCuZn-ferrites which can be fully densified at the standard LTCC sintering temperature of 900°C were developed. To co-fire these ferrite tapes with dielectric tapes the sintering shrinkage and the coefficient of thermal expansion of ferrite and dielectric tapes must be matched. For each ferrite material a new LTCC dielectric material was designed. The embedded ferrite tapes into new LTCC dielectric tapes can be sufficiently densified during co-firing at 900°C without any cracking. Compared to separately sintered ferrites the permeability of embedded ferrite tapes is reduced. For embedded NiCuZn ferrites permeabilities between 230 and 570 (at 2 MHz) according to the thickness of the embedded ferrite layer were measured. For embedded MnZn ferrites a permeability of 300 was measured. T2 - EMPC-2011 - 18th European microelectronics & packaging conference CY - Brighton, UK DA - 12.09.2011 KW - LTCC KW - Co-firing KW - Ferrite PY - 2011 SN - 978-0-9568086-0-8 IS - TuA2 SP - 1 EP - 6 AN - OPUS4-25021 LA - eng AD - Bundesanstalt fuer Materialforschung und -pruefung (BAM), Berlin, Germany ER -