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Emerging device technologies such as resistive RAM (RRAM) are increasingly recognized in enhancing system performance, particularly in applications demanding extensive vector-matrix multiplications (VMMs) with high parallelism. However, a significant limitation in current electronics design automation (EDA) tools is their lack of support for rapid prototyping, design space exploration, and the integration of inherent process-dependent device variability into system-level simulations, which is essential for assessing system reliability. To address this gap, we introduce a field-programmable gate array (FPGA) based emulation approach for RRAM crossbars featuring cycle-accurate emulations in real time without relying on complex device models. Our approach is based on pre-generated look-up tables (LUTs) to accurately represent the RRAM device behavior. To efficiently model the device variability at the system level, we propose using the multivariate kernel density estimation (KDE) method to augment the measured RRAM data. The proposed emulator allows precise latency determination for matrix mapping and computation operations. Meanwhile, by coupling with the NeuroSim framework, the corresponding energy consumption can be estimated. In addition to facilitating a range of in-depth system assessments, experimental results suggest a remarkable reduction of emulation time compared to the classic behavioral simulation.
AbstractBlooming and pruning is one of the most important developmental mechanisms of the biological brain in the first years of life, enabling it to adapt its network structure to the demands of the environment. The mechanism is thought to be fundamental for the development of cognitive skills. Inspired by this, Chialvo and Bak proposed in 1999 a learning scheme that learns from mistakes by eliminating from the initial surplus of synaptic connections those that lead to an undesirable outcome. Here, this idea is implemented in a neuromorphic circuit scheme using CMOS integrated HfO2-based memristive devices. The implemented two-layer neural network learns in a self-organized manner without positive reinforcement and exploits the inherent variability of the memristive devices. This approach provides hardware, local, and energy-efficient learning. A combined experimental and simulation-based parameter study is presented to find the relevant system and device parameters leading to a compact and robust memristive neuromorphic circuit that can handle association tasks.
This paper presents a read circuit design for resistive memory cells based on current mirrors. The circuit utilizes high-precision current mirrors and reference cells to determine the state of resistive memory using comparators. It offers a high degree in adaptability in terms of both resistance range and number of levels. Special emphasis was put on device protection to prevent accidental programming of the memory during read operations. The realized circuit can resolve eight states with a resolution of up to 1 k Ω, realizing a digitization of the analog memory information. Furthermore, the integration in a complete memory macro is shown. The circuit was realized in a 130 nm-process but can easily be adapted to other processes and resistive memory technologies.
High Gain Graphene Based Hot Electron Transistor with Record High Saturated Output Current Density
(2024)
Hot electron transistors (HETs) represent an exciting frontier in semiconductor technology, holding the promise of high-speed and high-frequency electronics. With the exploration of two-dimensional materials such as graphene and new device architectures, HETs are poised to revolutionize the landscape of modern electronics. This study highlights a novel HET structure with a record output current density of 800 A/cm² and a high current gain α, fabricated using a scalable fabrication approach. The HET structure comprises two-dimensional hexagonal boron nitride (hBN) and graphene layers wet transferred to a germanium substrate. The combination of these materials results in exceptional performance, particularly in terms of the highly saturated output current density. The scalable fabrication scheme used to produce the HET opens up opportunities for large-scale manufacturing. This breakthrough in HET technology holds promise for advanced electronic applications, offering high current capabilities in a practical and manufacturable device.
The combination of two-dimensional materials, such as graphene, with established thin films offers great opportunities for enabling next-generation vertical transistors for various applications. This paper gives a brief overview about different vertical transistor concepts using twodimensional materials proposed so far, e.g. the hot electron transistor and the Barristor. With the arrival of twodimensional materials, the hot electron transistor also experienced a revival with predicted cut-off frequencies in the THz range. The Barristor overcomes the weak current saturation of lateral graphene field-effect transistors and high on-off ratios up to 107 were demonstrated, which are suitable parameters for logic applications. By combining a
semiconductor-graphene-semiconductor design of the simplest hot electron transistor with the Barristor operating principle a new device, called graphene adjustable-barriers transistor, can be realized. This new device concept provides the potential for RF, power electronics, and optoelectronic applications.
Due to the unique electronic band structure, graphene has opened great potential to extend the functionality of a large variety of devices. Despite the significant progress in the fabrication of various graphene based microelectronic devices, the integration of graphene devices still lack the stability and compatibility with Si-technology processes. Therefore, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance. This study aims to explore various aspects of graphene research on a 200mm pilot line, with a focus on simulations and fabrication of graphene modulator. To be more precise, it includes design and fabrication of the layouts, necessary mask sets, creation of the flows, fabrication, and measurements of the Gr modulators on 200 mm wafers.
Study on the metal -graphene contact resistance achieved with one -dimensional contact architecture
(2023)
Graphene has always been considered as one of the materials with the greatest potential for the realization of improved microelectronic and photonic devices. But to actually reach its full potential in Si CMOS technology, graphene
-based devices need to overcome different challenges. They do not only
need to have better performances than standard devices, but they also need to be compatible with the production of standard Si based devices. To address the first challenge the main route requires the optimization of the contact resistance, that highly reduces the devices performance, while the second challenges requires the integration of graphene inside the standard production lines used for microelectronic. In this work we used an 8” wafer pilot -line to realize our devices and we studied the behavior of the contact resistance between metal and graphene obtained by one -dimensional contact architecture between the two materials. The contact resistance has been measured by means of Transmission Line Method (TLM) with several contact patterning.
Memristive devices integrated in 200 mm wafers
manufactured in 130 nm CMOS technology with two different
dielectrics, namely, a HfO2 monolayer and an Al2O3/HfO2 bilayer,
have been measured. The cycle-to-cycle (C2C) and device-todevice (D2D) variability have been analyzed at the wafer scale using different numerical methods to extract the set (Vset) and reset (Vreset) voltages. Some interesting differences between both technologies were found in terms of switching characteristics
This work presents a quasi-static electrical characterization of 1-transistor-1-resistor memristive structures designed following hardness-by-design techniques integrated in the CMOS fabrication process to assure multi-level capabilities in harsh radiation environments. Modulating the gate voltage of the enclosed layout transistor connected in series with the memristive device, it was possible to achieve excellent switching capabilities from a single high resistance state to a total of eight different low resistance states (more than 3 bits). Thus, the fabricated devices are suitable for their integration in larger in-memory computing systems and in multi-level memory applications.
Index Terms—radiation-hard, hardness-by-design, memristive
devices, Enclosed Layout Transistor, in-memory computing
In-memory computing with resistive-switching random access memory (RRAM) crossbar arrays has the potential to overcome the major bottlenecks faced by digital hardware for data-heavy workloads such as deep learning. However, RRAM devices are subject to several non-idealities that result in significant inference accuracy drops compared with software baseline accuracy. A critical one is related to the drift of the conductance states appearing immediately at the end of program and verify algorithms that are mandatory for accurate
multi-level conductance operation. The support of drift models
in state-of-the-art simulation tools of memristive computationin-memory is currently only in the early stage, since they
overlook key device- and array-level parameters affecting drift
resilience such as the programming algorithm of RRAM cells,
the choice of target conductance states and the weight-toconductance mapping scheme. The goal of this paper is to fully expose these parameters to RRAM crossbar designers as a multi-dimensional optimization space of drift resilience. For this purpose, a simulation framework is developed, which comes with the suitable abstractions to propagate the effects of those RRAM crossbar configuration parameters to their ultimate implications over inference performance stability.
We characterize TiN/Ti/HfO2/TiN memristive devices for neuromorphic computing. We analyze different features that allow the devices to mimic biological synapses and present the models to reproduce analytically some of the data measured. In particular, we have measured the spike timing dependent plasticity behavior in our devices and later on we have modeled it. The spike timing dependent plasticity model was implemented as the learning rule of a spiking neural network that was trained to recognize the MNIST dataset. Variability is implemented and its influence on the network recognition accuracy is considered accounting for the number of neurons in the network and the number of training epochs. Finally, stochastic resonance is studied as another synaptic feature.It is shown that this effect is important and greatly depends on the noise statistical characteristics.
The use of resistive random-access memory (RRAM) for in-memory computing (IMC) architectures has significantly improved the energy-efficiency of artificial neural networks (ANN) over the past years. Current RRAM-technologies are physically limited to a defined unambiguously distinguishable number of stable states and a maximum resistive value and are compatible with present complementary metal-oxide semiconductor (CMOS)-technologies. In this work, we improved the accuracy of current ANN models by using increased weight resolutions of memristive devices, combining two or more in-series RRAM cells, integrated in the back end of line (BEOL) of the CMOS process. Based on system level simulations, 1T2R devices were fabricated in IHP's 130nm SiGe:BiCMOS technology node, demonstrating an increased number of states. We achieved an increase in weight resolution from 3 bit in ITIR cells to 6.5 bit in our 1T2R cell. The experimental data of 1T2R devices gives indications for the performance and energy-efficiency improvement in ITNR arrays for ANN applications.
Resistive Random Access Memory (RRAM) technology holds promises to improve the Field Programmable Gate Array (FPGA) performance, reduce the area footprint, and dramatically lower run-time energy requirements compared to the state-of-the-art CMOS-based products. However, the integration of RRAM in FPGAs is hindered by the high programming power consumption and by non-ideal behaviors of the device due to its stochastic nature that may overshadow the benefits in normal operation mode. To cope with these challenges, optimized programming strategies have to be investigated. In this work, we explore the impact that different procedures to set the device have on the run-time performance. Process, voltage, and temperature (PVT) variations as well as time-dependent drift effect of the RRAM device are considered in the assessment of 4T1R MUX designs characteristics. The comparison with tradition CMOS implementations reveals how the choice of the target resistive state and the programming algorithm are key design aspects to reduce the run-time delay and energy metrics, while at the same time improving the robustness against the different sources of variations.
In this paper, we present a method for highly-efficient circuit simulation of a hardware-based artificial neural network realized in a memristive crossbar array. The statistical variability of the devices is considered by a noise-based simulation technique. For the simulation of a crossbar array with 8 synaptic weights in Cadence Virtuoso the new approach shows a more than 200x speed improvement compared to a Monte Carlo approach, yielding the same results. In addition, first results of an ANN with more than 15,000 memristive devices classifying test data of the MNIST dataset are shown, for which the speed improvement is expected to be several orders of magnitude. Furthermore, the influence on the classification of parasitic resistances of the connection lines in the crossbar is shown.
For the fabrication of modern graphene devices, uniform growth of high-quality monolayer graphene on wafer scale is important. This work reports on the growth of large-scale graphene on semiconducting 8 inch Ge(110)/Si wafers by chemical vapor deposition and a DFT analysis of the growth process. Good graphene quality is indicated by the small FWHM (32 cm–1) of the Raman 2D band, low intensity ratio of the Raman D and G bands (0.06), and homogeneous SEM images and is confirmed by Hall measurements: high mobility (2700 cm2/Vs) and low sheet resistance (800 Ω/sq). In contrast to Ge(001), Ge(110) does not undergo faceting during the growth. We argue that Ge(001) roughens as a result of vacancy accumulation at pinned steps, easy motion of bonded graphene edges across (107) facets, and low energy cost to expand Ge area by surface vicinals, but on Ge(110), these mechanisms do not work due to different surface geometries and complex reconstruction.
Resistive random access memory (RRAM)-based hardware accelerators are playing an important role in the implementation of in-memory computing (IMC) systems for artificial intelligence applications. The latter heavily rely on vector-matrix multiplication (VMM) operations that can be efficiently boosted by RRAM devices. However, the stochastic nature of the RRAM technology is still challenging real hardware implementations. To study the accuracy degradation of consecutive VMM operations, in this work we programed two RRAM subarrays composed of 8x8 one-transistor-one-resistor (1T1R) cells following two different distributions of conductive levels. We analyze their robustness against 1000 identical consecutive VMM operations and monitor the inherent devices’ nonidealities along the test. We finally quantize the accuracy loss of the operations in the digital domain and consider the trade-offs between linearly distributing the resistive states of the RRAM cells and their robustness against nonidealities for future implementation of IMC hardware systems.
We explore the stochastic switching of oxide-based memristive devices by using the Stanford model for circuit simulation. From measurements, the device-to-device (D2D) and cycle-to-cycle (C2C) statistical variation is extracted. In the low-resistive state (LRS) dispersion by D2D variability is dominant. In the high-resistive state
(HRS) C2C dispersion becomes the main source of fluctuation. A statistical procedure for the extraction of parameters of the compact model is presented. Thereby, in a circuit simulation the typical D2D and C2C fluctuations of the current–voltage (I-V) characteristics can be emulated by extracting statistical parameters of key model parameters. The statistical distributions of the parameters are used in a Monte Carlo simulation to reproduce the I-V D2D and C2C dispersions which show a good agreement to the measured curves. The results allow the simulation of the on/off current variation for the design of memory cells or can be used to emulate the synaptic behavior of these devices in artificial neural networks realized by a crossbar array of memristors.
The arrival of high-mobility two-dimensional materials like graphene leads to the renaissance of former vertical semiconductor–metal–semiconductor (SMS) hot electron transistors. Because of the monolayer thickness of graphene, improved SMS transistors with a semimetallic graphene-base electrode are now feasible for high-frequency applications. In this study we report about a device that consists of amorphous silicon, graphene, and crystalline silicon. For the first time, this device is fabricated by a four-mask lithography process which leads to significant improvements in the device performance. A strongly increased common-emitter current gain of 2% could be achieved while the on–off ratio improved to 1.6 × 105, which is already higher than predicted theoretically. This could be mainly attributed to better interface characteristics and decreased lateral dimensions of the devices. A cutoff frequency of approximately 26 MHz could be forecasted based on the DC measurements of the device.
The stochastic nature of the resistive switching (RS) process in memristive devices makes device-to-device (DTD) and cycle-to-cycle (CTC) variabilities relevant magnitudes to be quantified and modeled. To accomplish this aim, robust and reliable parameter extraction methods must be employed. In this work, four different extraction methods were used at the production level (over all the 108 devices integrated on 200-mm wafers manufactured in the IHP 130-nm CMOS technology) in order to obtain the corresponding collection of forming, reset, and set switching voltages. The statistical analysis of the experimental data (mean and standard deviation (SD) values) was plotted by using heat maps, which provide a good summary of the whole data at a glance and, in addition, an easy manner to detect inhomogeneities in the fabrication process.
RRAM technology is a promising candidate for implementing efficient AI accelerators with extensive multiply-accumulate operations. By scaling RRAM devices to the synaptic crossbar array, the computations can be realized in situ, avoiding frequent weights transfer between the processing units and memory. Besides, as the computations are conducted in the analog domain with high flexibility, applying multilevel input voltages to the RRAM devices with multilevel conductance states enhances the computational efficiency further. However, several non-idealities existing in emerging RRAM technology may degrade the reliability of the system. In this paper, we measured and investigated the impact of read disturb on RRAM devices with different input voltages, which incurs conductance drifts and introduces errors. The measured data are deployed to simulate the RRAM based AI inference engines with multilevel states.
End-to-end modeling of variability-aware neural networks based on resistive-switching memory arrays
(2022)
Resistive-switching random access memory (RRAM) is a promising technology that enables advanced applications in the field of in-memory computing (IMC). By operating the memory array in the analogue domain, RRAM-based IMC architectures can dramatically improve the energy efficiency of deep neural networks (DNNs). However, achieving a high inference accuracy is challenged by significant variation of RRAM conductance levels, which can be compensated by (i) advanced programming techniques and (ii) variability-aware training (VAT) algorithms. In both cases, however, detailed knowledge and accurate physics-based statistical models of RRAM are needed to develop programming and VAT methodologies. This work presents an end-to-end approach to the development of highly-accurate IMC circuits with RRAM, encompassing the device modeling, the precise programming algorithm, and the VAT simulations to maximize the DNN classification accuracy in presence of conductance variations.
Dielectrophoresis(DEP) is an AC electrokinetic effect mainly used to manipulate cells.Smaller particles,like virions,antibodies,enzymes,andevendyemolecules can be immobilized by DEP as well. In principle, it was shown that enzymesare active after immobilization by DEP, but no quantification of the retainedactivity was reported so far. In this study, the activity of the enzyme horseradishperoxidase (HRP) is quantified after immobilization by DEP. For this, HRP is immobilized on regular arrays of titanium nitride ring electrodes of 500 nm diameter and 20 nm widths. The activity of HRP on the electrode chip is measured with a limit of detection of 60 fg HRP by observing the enzymatic turnover of Amplex Red and H2O2 to fluorescent resoruf in by fluorescence microscopy. The initial activity of the permanently immobilized HRP equals up to 45% of the activity that can be expected for an ideal monolayer of HRP molecules on all electrodes of the array. Localization of the immobilizate on the electrodesis accomplished by staining with the fluorescent product of the enzyme reac-tion.The high residual activity of enzymes after AC field induced immobilization shows the method’s suitability for biosensing and research applications.
In this work we present the progress in regard to the integration of a surface plasmon resonance refractive index sensor into a CMOS compatible 200 mm wafer silicon-based technology. Our approach pursues the combination of germanium photodetectors with metallic nanohole arrays. The paper is focused on the technology development to fabricate large area photodetectors based on a modern design concept. In a first iteration we achieved a leakage current density of 82 mA/cm2 at reverse bias of 0.5 V and a maximum optical responsivity of 0.103 A/W measured with TE polarized light at λ = 1310 nm and a reversed bias of 1 V. For the realization of nanohole arrays we used thin Titanium nitride (TiN) layers deposited by a sputtering process. We were able to produce very homogenous TiN layers with a thickness deviation of around 10 % and RMS of 1.413 nm for 150 nm thick TiN layers.
Towards the Growth of Hexagonal Boron Nitride on Ge(001)/Si Substrates by Chemical Vapor Deposition
(2022)
The growth of hexagonal boron nitride (hBN) on epitaxial Ge(001)/Si substrates via high-vacuum chemical vapor deposition from borazine is investigated for the first time in a systematic manner. The influences of the process pressure and growth temperature in the range of 10−7–10−3 mbar and 900–980 °C, respectively, are evaluated with respect to morphology, growth rate, and crystalline quality of the hBN films. At 900 °C, nanocrystalline hBN films with a lateral crystallite size of ~2–3 nm are obtained and confirmed by high-resolution transmission electron microscopy images. X-ray photoelectron spectroscopy confirms an atomic N:B ratio of 1 ± 0.1. A three-dimensional growth mode is observed by atomic force microscopy. Increasing the process pressure in the reactor mainly affects the growth rate, with only slight effects on crystalline quality and none on the principle growth mode. Growth of hBN at 980 °C increases the average crystallite size and leads to the formation of 3–10 well-oriented, vertically stacked layers of hBN on the Ge surface. Exploratory ab initio density functional theory simulations indicate that hBN edges are saturated by hydrogen, and it is proposed that partial de-saturation by H radicals produced on hot parts of the set-up is responsible for the growth
The crossbar structure of Resistive-switching random access memory (RRAM) arrays enabled the In-Memory Computing circuits paradigm, since they imply the native acceleration of a crucial operations in this scenario, namely the Matrix-Vector-Multiplication (MVM). However, RRAM arrays are affected by several issues materializing in conductance variations that might cause severe performance degradation. A critical
one is related to the drift of the low conductance states appearing
immediately at the end of program and verify algorithms that
are mandatory for an accurate multi-level conductance operation. In this work, we analyze the benefits of a new programming
algorithm that embodies Set and Reset switching operations to
achieve better conductance control and lower variability. Data
retention analysis performed with different temperatures for 168
hours evidence its superior performance with respect to standard programming approach. Finally, we explored the benefits
of using our methodology at a higher abstraction level, through
the simulation of an Artificial Neural Network for image recognition task (MNIST dataset). The accuracy achieved shows higher
performance stability over temperature and time.
A graphene-based three terminal barristor device was proposed to overcome the low on/off ratios and insufficient current saturation of conventional graphene field effect transistors. In this study, we fabricated and analyzed a novel graphene-based transistor, which resembles the structure of the barristor but uses a different operating condition. This new device, termed graphene adjustable-barriers transistor (GABT), utilizes a semiconductor-based gate rather than a metal−insulator gate structure to modulate the device currents. The key feature of the device is the two graphene-semiconductor Schottky barriers with different heights that are controlled simultaneously by the gate voltage. Due to the asymmetry of the barriers, the drain current exceeds the gate current by several orders of magnitude. Thus, the GABT can be considered an amplifier with an alterable current gain. In this work, a silicon−graphene−germanium GABT with an ultra-high current gain (ID/IG up to 8 × 106) was fabricated, and the device functionality was demonstrated. Additionally, a capacitance model is applied to predict the theoretical device performance resulting in an on−off ratio above 106, a swing of 87 mV/dec, and a drivecurrent of about 1 × 106 A/cm2.
One of the objectives fostered in medical science is the so-called precision medicine, which requires the analysis of a large amount of survival data from patients to deeply understand treatment options. Tools like Machine Learning and Deep Neural Networks are becoming a de-facto standard. Nowadays, computing facilities based on the Von Neumann architecture are devoted to these tasks, yet rapidly hitting a bottleneck in performance and energy efficiency. The In-Memory Computing (IMC) architecture emerged as a revolutionary approach to overcome that issue. In this work, we propose an IMC architecture based on Resistive switching memory (RRAM) crossbar arrays to provide a convenient primitive for matrix–vector multiplication in a single computational step. This opens massive performance improvement in the acceleration of a neural network that is frequently used in survival analysis of biomedical records, namely the DeepSurv. We explored how the synaptic weights mapping strategy and the programming algorithms developed to counter RRAM non-idealities expose a performance/energy trade-off. Finally, we assessed the benefits of the proposed architectures with respect to a GPU-based realization of the same task, evidencing a tenfold improvement in terms of performance and three orders of magnitude with respect to energy efficiency.
The impact of artificial intelligence on human life
has increased significantly in recent years. However, as the
complexity of problems rose aswell, increasing system features
for such amount of data computation became troublesome due
to the von Neumann’s computer architecture. Neuromorphic
computing aims to solve this problem by mimicking the parallel
computation of a human brain. For this approach, memristive
devices are used to emulate the synapses of a human brain. Yet,
common simulations of hardware based networks require time
consuming Monte-Carlo simulations to take into account the
stochastic switching of memristive devices. This work presents
an alternative concept making use of the convolution of the
probability distribution functions (PDF) of memristor currents
by its equivalent multiplication in Fourier domain. An artificial
neural network is accordingly implemented to perform the
inference stage with handwritten digits.
Due to the unique electronic structures, graphene and other 2D Materials are considered as materials which can enable and extend the functionalities and performance in a large variety of applications, among them in microelectronics. At this point, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance.Towards these goals, this paper focuses on the full spectra of graphene research aspects in 200mm pilot line. We investigated different process module developments such as CMOS compatible growth of high quality graphene on germanium and its growth mechanisms, transfer related challenges on target substrates, patterning, passivation and various concepts of contacting of graphene on a full 200 mm wafers. Finally, we fabricated proof-of-concept test structures e.g. TLM, Hall bars and capacitor structures to prove the feasibility of graphene processing in the pilot line of IHP.
Accomplishing truly analog conductance modulation in memristive arrays is crucial in order to implement the synaptic plasticity in hardware-based neuromorphic systems. In this paper, such a feature was addressed by exploiting the inherent stochasticity of switching dynamics in amorphous HfO2 technology. A thorough statistical analysis of experimental characteristics measured in 4 kbit arrays by using trains of identical depression/potentiation pulses with different voltage amplitudes and pulse widths provided the key to develop two different updating rules and to define their optimal programming parameters. The first rule is based on applying a specific number of identical pulses until the conductance value achieves the
desired level. The second one utilized only one single pulse with a particular amplitude to achieve the targeted conductance level. In addition, all the results provided by the statistical analysis performed may play an important role in understanding better the switching behavior of this particular technology.
Mitigating the Effects of RRAM Process Variation on the Accuracy of Artifical Neural Networks
(2022)
Weight storage is a key challenge in the efficient implementation of artificial neural networks. Novel memory technologies such as RRAM are able to greatly improve density and introduce non-volatility and multibit capabilities to this component of ANN accelerators. The usage of RRAM in this domain comes with downsides, mainly caused by cycle-to-cycle and device-to-device variability leading to erroneous readouts, greatly affecting digital systems. ANNs have the ability to compensate for this by their inherent redundancy and usually exhibit a gradual deterioration in the accuracy of the task at hand. This means, that slight error rates can be acceptable for weight storage in an ANN accelerator. In this work we link device-to-device variability to the accuracy of an ANN for such an accelerator. From this study, we can estimate how strongly a certain net is affected by a certain device parameter variability. This methodology is then used to present three mitigation strategies and to evaluate how they affect the reaction of the network to variability: a) Dropout Layers b) Fault-Aware Training c) Redundancy. These mitigations are then evaluated by their ability to improve accuracy and to lower hardware overhead by providing data for a real-word example. We improved this network’s resilience in such a way that it could tolerate double the variation in one of the device parameters (standard deviation of the oxide thickness can be 0.4 nm instead of 0.2 nm while maintaining sufficient accuracy.)
Resistive-switching random access memory (RRAM) is a promising technology for in-memory computing (IMC) to accelerate training and inference of deep neural networks (DNNs). This work presents the first physics-based statistical model describing (i) multilevel RRAM device program/verify (PV) algorithms by controlled set transition, (ii) the stochastic cycle-to-cycle (C2C) and device-to-device (D2D) variations within the array, and (iii) the impact of such imprecisions on the accuracy of DNN accelerators. The model can handle the full chain from RRAM materials/device parameters to the DNN performance, thus providing a valuable tool for device/circuit codesign of hardware DNN accelerators.
The resistive switching properties of HfO2 based 1T-1R memristive devices are electrically modified by adding ultra-thin layers of Al2O3
into the memristive device. Three different types of memristive stacks are fabricated in the 130 nm CMOS technology of IHP. The switching properties of the memristive devices are discussed with respect to forming voltages, low resistance state and high resistance state characteristics and their variabilities. The experimental I–V characteristics of set and reset operations are evaluated by using the quantum point contact model. The properties of the conduction filament in the on and off states of the memristive devices are discussed with respect to the model parameters obtained from the QPC fit.
The use of alternating current (AC) electrokinetic forces, like dielectrophoresis and AC electroosmosis, as a simple and fast method to immobilize sub-micrometer objects onto nanoelectrode arrays is presented. Due to its medical relevance, the influenza virus is chosen as a model organism. One of the outstanding features is that the immobilization of viral material to the electrodes can be achieved permanently, allowing subsequent handling independently from the electrical setup. Thus, by using merely electric fields, we demonstrate that the need of prior chemical surface modification could become obsolete. The accumulation of viral material over time is observed by fluorescence microscopy. The influences of side effects like electrothermal fluid flow, causing a fluid motion above the electrodes and causing an intensity gradient within the electrode array, are discussed. Due to the improved resolution by combining fluorescence microscopy with deconvolution, it is shown that the viral material is mainly drawn to the electrode edge and to a lesser extent to the electrode surface. Finally, areas of application for this functionalization technique are presented.
We present a statistical procedure for the extraction of parameters of a compact model for memristive devices. Thereby, in a circuit simulation the typical fluctuations of the current–voltage (I-V) characteristics from device-to-device (D2D) and from cycle-to-cycle (C2C) can be emulated. The approach is based on the Stanford model
whose parameters play a key role to integrating D2D and C2C dispersion. The influence of such variabilities over the model’s parameters is investigated by using a fitting algorithm fed with experimental data. After this, the statistical distributions of the parameters are used in a Monte Carlo simulation to reproduce the I-V D2D and C2C dispersions which show a good agreement to the measured curves. The results allow the simulation of the on/off current variation for the design of RRAM cells or memristor-based artificial neural networks.
A new kind of transistor device with a graphene monolayer embedded between two n-type silicon layers is fabricated and characterized. The device is called graphene-base heterojunction transistor (GBHT). The base-voltage controls the current of the device flowing from the emitter via graphene to the collector. The transit time for electrons passing by the ultrathin graphene layer is extremely short which makes the device very promising for high frequency RF-electronics. The output current of the device is saturated and clearly modulated by the base voltage. Further, the silicon collector of the GBHT is replaced by germanium to improve the device performance. This enabled the collector current to be increased by almost three orders of magnitude. Also, the common-emitter current gain (Ic/Ib) increased from 10-3 to approximately 0.3 for the newly designed device. However, the ON-OFF ratio of the improved germanium based GBHT has so far been rather low. Further optimizations are necessary in order to fully exploit the potential of the graphene-base heterojunction transistor.
In Memory Computing (IMC) is one of the most promising candidates
for data-intensive computing accelerators of machine learning (ML). A key ML algorithm for dimensionality reduction and classification is principal component analysis (PCA), which heavily relies on matrixvector multiplications (MVM) for which classic von Neumann architectures are not optimized. Here, we provide the experimental
demonstration of a new IMCbased PCA algorithm based on power iteration and deflation executed in a 4-kbit array of resistive switching random-access memory (RRAM). The classification accuracy of the Wisconsin Breast Cancer data set reaches 95.43%, close to floatingpoint implementation. Our simulations indicate a 250× improvement in energy efficiency compared to commercial GPUs, thus supporting IMC for energy-efficient ML in modern data-intensive computing.
We have performed different simulation experiments in relation to hardware neural networks (NN) to analyze the role of the number of synapses for different NN architectures in the network accuracy, considering different datasets. A technology that stands upon 4-kbit 1T1R ReRAM arrays, where resistive switching devices based on HfO2 dielectrics are employed, is taken as a reference. In our study, fully dense (FdNN) and convolutional neural networks (CNN) were considered, where the NN size in terms of the number of synapses and of hidden layer neurons were varied. CNNs work better when the number of synapses to be used is limited. If quantized synaptic weights are included, we observed thatNNaccuracy decreases significantly as the number of synapses is reduced; in this respect, a trade-off between the number of synapses and the NN accuracy has to be achieved. Consequently, the CNN architecture must be carefully designed; in particular, it was noticed that different datasets need specific architectures according to their complexity to achieve good results. It was shown that due to the number of variables that can be changed in the optimization of a NN hardware implementation, a specific solution has to be worked in each case in terms of synaptic weight levels, NN architecture, etc.
Resistive switching memory (RRAM) is a promising technology for highly efficient computing scenarios. RRAM arrays enabled the acceleration of neural networks for artificial intelligence and the creation of In-Memory Computing circuits. However, the arrays are affected by several issues materializing in conductance variations that might cause severe performance degradation in those applications. Among those, one is related to the drift of the low conductance states appearing immediately at the end of program and verify algorithms that are fundamental for an accurate Multi-level conductance operation. In this work, we tackle the issue by developing an Incremental Reset and Verify technique showing enhanced variability and reliability features compared with a traditional refresh-based approach.
With the rapid emergence of in-memory computing systems based on memristive technology, the integration of such memory devices in large-scale architectures is one of the main aspects to tackle.
In this work we present a study of HfO2-based memristive devices for their integration in large-scale CMOS systems, namely 200 mm wafers. The DC characteristics of single metal–insulator–metal
devices are analyzed taking under consideration device-to-device variabilities and switching properties. Furthermore, the distribution of the leakage current levels in the pristine state of the
samples are analyzed and correlated to the amount of formingless memristors found among the measured devices. Finally, the obtained results are fitted into a physic-based compact model that
enables their integration into larger-scale simulation environments.
This work reports forming free/self-rectifying resistive switching characteristics and dependency of the top electrode (TE) of a crystalline HfO2-based resistive switching memory device. In the memory cells, nonlinear bipolar resistive switching characteristics, i.e., an asymmetric current-voltage curve like the Schottky diode, was
observed. In addition, the device exhibits resistive switching behaviors without forming process, which makes it possible to switch the resistance state under ultra-low current levels of <10 nA. In addition, compared to the resistive switching of the proposed resistive switching memory devices with different TEs, the VSET was decreased when using TE with lower work function, and the height read margin was obtained in the sample with the Ni TE, covering over 56 × 56 arrays. Consequently, these results indicate that the interface control resistive switching properties in memory structures having the Schottky junction warrant the realization of selector-free resistive
switching memory cells in a high-density crossbar array.